CN204800866U - Wet or dry diamond saw blade - Google Patents
Wet or dry diamond saw blade Download PDFInfo
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- CN204800866U CN204800866U CN201520430368.1U CN201520430368U CN204800866U CN 204800866 U CN204800866 U CN 204800866U CN 201520430368 U CN201520430368 U CN 201520430368U CN 204800866 U CN204800866 U CN 204800866U
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- diamond
- saw blade
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- chip area
- dry
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Abstract
The utility model relates to a wet or dry diamond saw blade belongs to the technical field of diamond machining tool. The utility model discloses a diamond saw blade, including circular base member, the base member is including the side circumference surface that is located the edge, follow a plurality of chip grooves that are formed with the interval and set up are inwards extended along centre of a circle direction in side circumference surface, be formed with diamond segments between the chip groove, the chip groove includes first chip groove and second chip groove that the interval set up, diamond segments includes first and second diamond segments that the interval set up, the cross section of first chip groove is greater than the second chip groove, diamond segments surface is the plane, and the 2nd diamond segments surface is provided with a plurality of protruding, be the recess between the protruding strip. The utility model discloses a diamond saw blade can be fine in cutting process the chip removal, the heat dissipation can keep the fine cutting performance that keeps under the cooling water condition of polishing not having, has solved the user and process a difficult problem under the extreme condition.
Description
Technical field
The utility model relates to the technical field of diamond machined instrument, and more particularly, the utility model relates to a kind of Wet-dry diamond saw blade.
Background technology
Current market, diamond saw blade has been widely used in marble, granite, concrete, pitch, pottery, glass, jewels and jade, the material cutting processing such as semiconductor, improve constantly product efficiency, reduce spillage of material, especially at the famous and precious stone material of processing, when jade and glassware and semi-conducting material, reduce spillage of material, increasing economic efficiency is the direction that market is pursued jointly.Diamond saw blade is made up of two aspects: diamond segment and saw blade center matrix, saw blade center matrix thickness determines diamond segment thickness, center matrix thickness is thicker, and during cutting, joint-cutting is wider, and cutting efficiency is lower, spillage of material is larger, economic benefit is poorer, and matrix thickness is thinning, and cutter head is thinning, cutting efficiency promotes, and spillage of material declines.Along with the development of technology, also more and more higher to the requirement of cutting efficiency and cutting speed, and cutting time environment also very harsh, such as often need to cut under the condition that cooling water cannot be provided, but in Vehicles Collected from Market, most diamond saw blade all needs to rely on cooling water just can carry out cutting operation.
Utility model content
In order to solve above-mentioned technical problem of the prior art, the purpose of this utility model is to provide a kind of Wet-dry diamond saw blade.
A kind of Wet-dry diamond saw blade, comprise circular base, described circular base comprises the side circumferential surface being positioned at matrix border; It is characterized in that: inwardly extended to form spaced multiple chip area along direction, the center of circle from described side circumferential surface, between described chip area, be formed with diamond segment; It is characterized in that: described chip area comprises spaced first chip area and the second chip area; Described diamond segment comprises spaced first diamond segment and the second diamond segment; The cross section of described first chip area is greater than the second chip area; Described first diamond tool head surface is plane, and described second diamond tool head surface is provided with multiple raised item, is groove between described raised item.
Wherein, each chip area is by a trapeze cut and a U-lag composition.
Wherein, multiple raised items of described each second diamond tool head surface are parallel to each other.
Wherein, the number of the first diamond segment is 5 ~ 15, and the number of described second diamond segment is 5 ~ 15; And the number of described first diamond segment is equal with the number of the second diamond segment.
Wherein, radially the first louvre array has been extended to form to direction, the center of circle from described first diamond segment.
Wherein, radially the second louvre array has been extended to form to direction, the center of circle from described second diamond segment.
Wherein, described first louvre array and the second louvre array radially diminish gradually to the louvre diameter in direction, the center of circle.
Wet-dry diamond saw blade described in the utility model has following beneficial effect:
Diamond saw blade of the present utility model can be good at chip removal in cutting process, and heat radiation, not having to keep well keeping cutting performance under cooling water polishing condition, can solve user and under extreme conditions processing a difficult problem.
Accompanying drawing explanation
Fig. 1 is the structural representation of the Wet-dry diamond saw blade described in embodiment 1.
Detailed description of the invention
Be further elaborated Wet-dry diamond saw blade described in the utility model below with reference to specific embodiment, to help, those skilled in the art conceives utility model of the present utility model, technical scheme has more complete, accurate and deep understanding.
Embodiment 1
As shown in Figure 1, the Wet-dry diamond saw blade described in the present embodiment, comprises circular base 10, and described circular base 10 comprises the side circumferential surface being positioned at matrix border; Inwardly extend to form spaced multiple chip area along direction, the center of circle from described side circumferential surface, between described chip area, be formed with diamond segment; Described chip area comprises spaced first chip area 21 and the second chip area 22; Described diamond segment comprises spaced first diamond segment 31 and the second diamond segment 32; The cross section of described first chip area 21 is greater than the second chip area 22; Described first diamond segment 31 surface is plane, and described second diamond segment 32 surface is provided with multiple raised item, is groove between described raised item.Wherein, each chip area is by a trapeze cut and a U-lag composition; Multiple raised items of described each second diamond tool head surface are parallel to each other.Radially the first louvre array 41 has been extended to form to direction, the center of circle from described first diamond segment 31; Radially the second louvre array 42 has been extended to form to direction, the center of circle from described second diamond segment 32; Described first louvre array and the second louvre array radially diminish gradually to the louvre diameter in direction, the center of circle.In FIG, the number of the first diamond segment and the second diamond segment is 8.Certainly according to the size of matrix, the number of described first diamond segment and the second diamond segment can be designed as 5 ~ 15.
Wet-dry diamond saw blade described in the present embodiment compared with prior art, has following beneficial effect:
1. by the research and design of cutter head grinding process, saw blade is made into shape as shown in Figure 1, when cutting machine is at high-speed cutting material, more dust granules can be transported away by segment design from cutting gap, reduce the Cutting Drag of diamond saw blade, make saw blade cutting efficiency higher, cut gap space can be well controlled simultaneously, make distinguished and admirable can smoothly from cutting gap fluxion strap walk cutter head cutting time produce heat, make cutter head keep a metastable cutting performance.
2. pass through matrix optimal design, be designed to a large notch and a small-rabbet, simultaneously with inside and outside equally distributed special heat-radiating hole, diamond saw blade better chip removal in cutting process can be made by this design, improve distinguished and admirable radiating efficiency, the heat that in diamond saw blade cutting process, matrix surface and material friction produce can be made to be distributed faster, thus keep matrix matrix stress will be caused to increase because of fricative high temperature, be even out of shape and cutting cannot be continued.
3. the utility model adopts, and intensity is high, and security performance is good, ensures cutter head difficult drop-off when extreme condition uses.
For the ordinary skill in the art; specific embodiment is just exemplarily described the utility model; obvious the utility model specific implementation is not subject to the restrictions described above; as long as have employed the improvement of the various unsubstantialities that method of the present utility model is conceived and technical scheme is carried out; or design of the present utility model and technical scheme directly applied to other occasion, all within protection domain of the present utility model without to improve.
Claims (7)
1. a Wet-dry diamond saw blade, comprises circular base, and described circular base comprises the side circumferential surface being positioned at matrix border; Inwardly extend to form spaced multiple chip area along direction, the center of circle from described side circumferential surface, between described chip area, be formed with diamond segment; It is characterized in that: described chip area comprises spaced first chip area and the second chip area; Described diamond segment comprises spaced first diamond segment and the second diamond segment; The cross section of described first chip area is greater than the second chip area; Described first diamond tool head surface is plane, and described second diamond tool head surface is provided with multiple raised item, is groove between described raised item.
2. Wet-dry diamond saw blade according to claim 1, is characterized in that: each chip area is by a trapeze cut and a U-lag composition.
3. Wet-dry diamond saw blade according to claim 1, is characterized in that: multiple raised items of described each second diamond tool head surface are parallel to each other.
4. Wet-dry diamond saw blade according to claim 1, is characterized in that: the number of the first diamond segment is 5 ~ 15, and the number of described second diamond segment is 5 ~ 15; And the number of described first diamond segment is equal with the number of the second diamond segment.
5. Wet-dry diamond saw blade according to claim 1, is characterized in that: radially extended to form the first louvre array to direction, the center of circle from described first diamond segment.
6. Wet-dry diamond saw blade according to claim 5, is characterized in that: radially extended to form the second louvre array to direction, the center of circle from described second diamond segment.
7. Wet-dry diamond saw blade according to claim 6, is characterized in that: described first louvre array and the second louvre array radially diminish gradually to the louvre diameter in direction, the center of circle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520430368.1U CN204800866U (en) | 2015-06-19 | 2015-06-19 | Wet or dry diamond saw blade |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520430368.1U CN204800866U (en) | 2015-06-19 | 2015-06-19 | Wet or dry diamond saw blade |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204800866U true CN204800866U (en) | 2015-11-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520430368.1U Active CN204800866U (en) | 2015-06-19 | 2015-06-19 | Wet or dry diamond saw blade |
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| CN (1) | CN204800866U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107283655A (en) * | 2017-08-28 | 2017-10-24 | 惠安县文雕石业有限公司 | A kind of dry diamond section |
-
2015
- 2015-06-19 CN CN201520430368.1U patent/CN204800866U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107283655A (en) * | 2017-08-28 | 2017-10-24 | 惠安县文雕石业有限公司 | A kind of dry diamond section |
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