CN204791114U - Intelligence IC -card - Google Patents
Intelligence IC -card Download PDFInfo
- Publication number
- CN204791114U CN204791114U CN201520555271.3U CN201520555271U CN204791114U CN 204791114 U CN204791114 U CN 204791114U CN 201520555271 U CN201520555271 U CN 201520555271U CN 204791114 U CN204791114 U CN 204791114U
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- Prior art keywords
- coil
- chip
- card
- installation position
- intellective
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Abstract
The utility model relates to a smart card technical field specifically discloses an intelligence IC -card, including upper PVC piece, the PVC of lower floor piece, and the clamp dress is in upper strata PVC piece with coil and chip between the PVC of the lower floor piece, the upper surface of the PVC of lower floor piece is equipped with coil installation position and install the chip position, its shape and coil and chip shape are corresponding, install the chip position department is equipped with the glue circle, the lower surface of coil has alcohol layer down. The utility model discloses an alcohol alignment antenna's mode, not only the cost of alcohol is lower, and is more volatile moreover, can save drying time, has improved intelligence IC -card's production efficiency effectively, set up coil installation position and install the chip position, avoid in the manufacturing process displacement of coil and chip, further carry high yield.
Description
[technical field]
The utility model relates to technical field of intelligent card, particularly relates to a kind of intellective IC card.
[background technology]
Non-contact Intelligent IC Card is divided into low frequency intellective IC card and high-frequency intelligent IC-card, and its structure is generally between upper and lower two-layer PVC sheet and clamps coil and chip.In traditional intellective IC card, the general glue that adopts locates coil in IC-card and chip.Making programme is as follows: first accomplish fluently glue in the relevant position (chip installation position and coil installation position) of lower floor PVC sheet, and then stick the coil and chip that need locate, coil and chips welding are got up, then levels PVC sheet is pressed into satisfactory intellective IC card.
Need in this conventional fabrication process to use a large amount of glue, cost is higher, and can carry out welding and suppression process after the glue such as having needed done, and the stand-by period of glue dries is longer, causes production efficiency lower.
[utility model content]
The technical problems to be solved in the utility model depends on the defect of glue location in the intellective IC card overcoming prior art unduly, provides a kind of intellective IC card of improvement.
In order to solve the problems of the technologies described above, the utility model takes following technical scheme:
A kind of intellective IC card, comprise upper strata PVC sheet, lower floor PVC sheet and the coil be installed between upper strata PVC sheet and lower floor PVC sheet and chip, the upper surface of described lower floor PVC sheet is provided with coil installation position and chip installation position, described chips installed is provided with glue circle, and the lower surface of described coil is with lower alcohol layer.
In certain embodiments, described coil installation position can be the shape groove corresponding with the shape of described coil or projection, and the height of the degree of depth of described groove or described projection is less than or equal to the thickness of described coil.
In certain embodiments, described chip installation position can be the shape groove corresponding with the shape of described chip or projection, and the height of the degree of depth of described groove or described projection is less than or equal to the thickness of described chip.
In certain embodiments, the lower surface of described upper strata PVC sheet is provided with coil fixed bit and chip fixed bit, and the position of described coil fixed bit is corresponding with described coil installation position, and the position of described chip fixed bit is corresponding with described chip installation position.
In certain embodiments, described coil fixed bit can be the shape groove corresponding with the shape of described coil or projection, and the height of the degree of depth of described groove or described projection is less than or equal to the thickness of described coil.
In certain embodiments, described chip fixed bit can be the shape groove corresponding with the shape of described chip or projection, and the height of the degree of depth of described groove or described projection is less than or equal to the thickness of described chip.
In certain embodiments, the upper surface of described coil can have upper alcohol layer.
The beneficial effects of the utility model are: the mode adopting alcohol set winding, not only the cost of alcohol is lower, and more volatile (namely sticky spirituous coil is easily dry), can drying time be saved, effectively improve the production efficiency of intellective IC card.The coil installation position of lower floor PVC sheet and chip installation position make it possible to more easily fixed coil and chip, reduce the situation of coil or chip displacement, increase the qualification rate that intellective IC card is produced.
[accompanying drawing explanation]
Fig. 1 is the decomposition texture schematic diagram of the intellective IC card of the utility model embodiment.
Fig. 2 is in intellective IC card structure of the present utility model, with the loop construction schematic diagram of upper alcohol layer and lower alcohol layer.
Fig. 3 is the structural representation of lower floor PVC sheet in the intellective IC card of the utility model embodiment.
Fig. 4 is the structural representation of the intellective IC card of the utility model embodiment.
Fig. 5 is the structural representation of the intellective IC card of another embodiment of the utility model.
Reference numeral: 1. alcohol layer on upper strata PVC sheet, 2. lower floor PVC sheet, 3. coil, 4. chip, 11. coil fixed bits, 12. chip fixed bits, 21. coil installation positions, 22. chip installation positions, 23. glue circles, 51. times alcohol layers, 52..
[embodiment]
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
embodiment 1:
Refer to Fig. 1-Fig. 3, schematically show the decomposition texture of intellective IC card of the present utility model, loop construction and lower floor PVC chip architecture respectively.As shown in the figure, this intellective IC card comprises upper strata PVC sheet 1, lower floor PVC sheet 2, and the coil 3 be installed between upper strata PVC sheet 1 and lower floor PVC sheet 2 and chip 4, the upper surface of lower floor PVC sheet 2 is provided with coil installation position 21 and chip installation position 22, be provided with glue circle 23 in chips installed, the lower surface of coil 3 is with lower alcohol layer 51.
PVC sheet is made up of Polyvinylchloride (PVC) material.PVC is the one of Plastic ornament materials, is be primary raw material with Corvic, adds appropriate antiaging agent, modifier etc., through the material of the technique such as mixing, calendering, vacuum forming.
Coil 3 can be attached to coil installation position 21 place on lower floor PVC sheet by the lower alcohol layer 51 being attached to coil 3 lower surface, and chip 4 is adhered to chip installation position 22 place on lower floor PVC sheet 2 by 34, the glue circle at chip installation position 22 place.
It will be understood by those skilled in the art that the upper surface of coil 3 also can have upper alcohol layer 52.The existence of upper alcohol layer 52 makes coil 3 more easily can adhere to laminating upper strata PVC sheet.
The intellective IC card of the present embodiment can make according to following flow process: stamp glue, to form glue circle 23, for adhering chip at chip installation position 22 place of lower floor PVC sheet 2.Alcohol layer 51 under the lower surface of the coil 3 needing location adheres to, and attach to the coil installation position 21 of lower floor PVC sheet 2, then coil 3 and chip 4 are welded, finally upper strata PVC sheet 1 and lower floor PVC sheet 2 are pressed into satisfactory intellective IC card.
In the present embodiment, the coil installation position 21 that lower floor PVC sheet 2 upper surface is provided with and chip installation position 22 make it possible to more easily set winding 3 and chip 4, reduce the situation of coil 3 or chip 4 displacement, increase the qualification rate that intellective IC card is produced.And only chip 4 uses glue circle 23 to locate, the use amount of glue is little; Coil 3 uses lower alcohol layer 51 to attach location, and alcohol cost is low, volatile, and this all will save the stand-by period between locating and welding, and improves the production efficiency of intellective IC card.
embodiment 2:
Refer to Fig. 4, schematically show the structure according to another kind of intellective IC card of the present utility model.Compared with embodiment 1, the difference of the intellective IC card of embodiment 2 is:
Coil installation position 21 and chip installation position 22 are groove structure, and shape is corresponding with the shape of coil 3 and chip 4 respectively.
It will be understood by those skilled in the art that in other embodiments, coil installation position 21 and chip installation position 22 also can be bulge-structure, and the shape of projection is corresponding with the shape of coil 3 and chip 4 respectively.Or in other embodiments, one in coil installation position 21 and chip installation position 22 is groove structure, and another is bulge-structure.
The degree of depth of groove or the height of projection are generally less than or the thickness of the coil 3 that equals to be positioned at wherein or chip 4, to avoid producing space.
Use groove or bulge-structure further coil 3 and chip 4 can be limited to coil installation position 21 and chip installation position 22 place, avoid their movements during making, improve product percent of pass.
embodiment 3:
Refer to Fig. 5, schematically show the structure of another kind of intellective IC card of the present utility model.Compared with embodiment 1, the difference of the intellective IC card of embodiment 3 is:
The lower surface of upper strata PVC sheet 1 is also provided with coil fixed bit 11 and chip fixed bit 12.
The setting of coil fixed bit 11 and chip fixed bit 12 can ancillary coil 3 and chip 4 relative to the location of upper strata PVC sheet 1.
As shown in the figure, in this embodiment, coil fixed bit 11 and chip fixed bit 12 are shape groove structure corresponding with the shape of coil 3 and chip 4 respectively.
But, with coil installation position 21 and chip installation position 22 similar, it will be understood by those skilled in the art that in other embodiments, coil fixed bit 11 and chip fixed bit 12 also can be bulge-structure, and the shape of projection is corresponding with the shape of coil 3 and chip 4 respectively.Or one in coil fixed bit 11 and chip fixed bit 12 is groove structure, and another is bulge-structure.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1. an intellective IC card, comprise upper strata PVC sheet (1), lower floor PVC sheet (2) and the coil (3) be installed between described upper strata PVC sheet (1) and described lower floor PVC sheet (2) and chip (4), it is characterized in that: the upper surface of described lower floor PVC sheet (2) is provided with coil installation position (21) and chip installation position (22), described chip installation position (22) place is provided with glue circle (23); The lower surface of described coil (3) is with lower alcohol layer (51).
2. intellective IC card as claimed in claim 1, it is characterized in that: described coil installation position (21) is the shape groove corresponding with the shape of described coil (3) or projection, and the height of the degree of depth of described groove or described projection is less than or equal to the thickness of described coil (3).
3. intellective IC card as claimed in claim 1, it is characterized in that: described chip installation position (22) is the shape groove corresponding with the shape of described chip (4) or projection, and the height of the degree of depth of described groove or described projection is less than or equal to the thickness of described chip (4).
4. intellective IC card as claimed in claim 1, it is characterized in that: the lower surface of described upper strata PVC sheet (1) is provided with coil fixed bit (11) and chip fixed bit (12), the position of described coil fixed bit (11) is corresponding with described coil installation position (21), and the position of described chip fixed bit (12) is corresponding with described chip installation position (22).
5. intellective IC card as claimed in claim 4, it is characterized in that: described coil fixed bit (11) is the shape groove corresponding with the shape of described coil (3) or projection, and the height of the degree of depth of described groove or described projection is less than or equal to the thickness of described coil (3).
6. intellective IC card as claimed in claim 4, it is characterized in that: described chip fixed bit (12) is the shape groove corresponding with the shape of described chip (4) or projection, and the height of the degree of depth of described groove or described projection is less than or equal to the thickness of described chip (4).
7. intellective IC card as claimed in claim 1, is characterized in that, the upper surface of described coil (3) is with upper alcohol layer (52).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520555271.3U CN204791114U (en) | 2015-07-28 | 2015-07-28 | Intelligence IC -card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520555271.3U CN204791114U (en) | 2015-07-28 | 2015-07-28 | Intelligence IC -card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204791114U true CN204791114U (en) | 2015-11-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520555271.3U Active CN204791114U (en) | 2015-07-28 | 2015-07-28 | Intelligence IC -card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204791114U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107706517A (en) * | 2017-09-19 | 2018-02-16 | 深圳市安拓浦科技有限公司 | A kind of preparation method of wood grain antenna |
-
2015
- 2015-07-28 CN CN201520555271.3U patent/CN204791114U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107706517A (en) * | 2017-09-19 | 2018-02-16 | 深圳市安拓浦科技有限公司 | A kind of preparation method of wood grain antenna |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190807 Address after: 523797 No. 56 Fumin South Road, Dalang Town, Dongguan City, Guangdong Province Patentee after: Guangdong Xinye Intelligent Label Application Co., Ltd. Address before: 518000 Block 202, 302 and 403, Block 11 B, Xili Dakang Industrial Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN XINYE INTELLIGENCE CARD CO., LTD. |