CN204779876U - Current collector indium plating system - Google Patents
Current collector indium plating system Download PDFInfo
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- CN204779876U CN204779876U CN201520431622.XU CN201520431622U CN204779876U CN 204779876 U CN204779876 U CN 204779876U CN 201520431622 U CN201520431622 U CN 201520431622U CN 204779876 U CN204779876 U CN 204779876U
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- China
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- mass flow
- flow body
- indium
- current collector
- indium plating
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Abstract
The utility model provides a mass flow body indium plating system, mass flow body pass through burnishing device, impurity removal device, deoiling device, oxide film removing device, first washing device, activation device, second washing device, copper indium alloy plating device, indium plating device, third washing device, power device, confining liquid closing device in proper order. The utility model provides a pair of mass flow body indium plating system, it is not only efficient, can produce the mass flow body of high quality moreover, make the cladding material of mass flow body stable to make its life-span prolong greatly, simultaneously, still can make the mass flow body surface bright, not blacken.
Description
Technical Field
The utility model relates to a mass flow body manufacturing field especially relates to a mass flow body indium plating system.
Technical Field
With the increasing awareness of environmental protection, people purchase and use products which tend to be environment-friendly. The alkaline environment-friendly zinc-manganese battery is one of the environment-friendly products and is more and more favored by consumers. The current collector is one of the most important components in the battery, and mainly serves as a carrier for electron flow of the positive electrode and the negative electrode of the battery. At present, a current collector is generally protected by a nickel plating method, but is not protected by an indium plating method, and no relevant indium plating standard exists in China. The current collectors plated with nickel in the market generally have the problems of poor smoothness, easy blackening, poor stability of plating layers, short quality guarantee period and the like. Indium is a corrosion-resistant, white rare metal, has low hardness (HV =1.2 MPa), and has a low melting point (156 ℃). The wear resistance and the dry lubricity of the indium-plated copper alloy can be utilized to prolong the service life of a current collector of a plated part, and the corrosion resistance of the indium plating layer is better than that of nickel.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides a mass flow body indium plating system that high efficiency and can produce high-quality mass flow body.
The utility model provides a mass flow body indium plating system, mass flow body pass through burnishing device, impurity removal device, deoiling device, oxide film removing device, first washing device, activation device, second washing device, copper indium alloy plating device, indium plating device, third washing device, power device, confining liquid closing device in proper order.
Furthermore, the second cleaning device is provided with a recovery water tank for recovering waste water.
Furthermore, the third cleaning device is provided with a recovery water tank for recovering the waste water containing indium.
The activation device adopts dilute sulphuric acid for activation.
The sealing liquid does not contain harmful substances such as formaldehyde, benzene, heavy metals and the like, is beneficial to environmental protection and physical and psychological health of operators, is changed into a transparent bright film after being dried, and has the characteristics of excellent brightness, smoothness, discoloration resistance, corrosion resistance, high adhesiveness and the like.
The utility model provides a pair of mass flow body indium plating system, it is not only efficient, can produce the mass flow body of high quality moreover, make the cladding material of mass flow body stable to make its life-span prolong greatly, simultaneously, still can make the mass flow body surface bright, not blacken.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Detailed Description
For a better explanation of the present invention, reference will be made to the following detailed description taken in conjunction with the accompanying drawings.
As shown in figure 1, in the current collector indium plating system, after a current collector 1 is polished by a polishing device 2, impurities on the surface of the current collector are removed in an impurity removing device 3, the current collector enters a degreasing device 4 after coming out of the impurity removing device 3 to clean oil stains on the surface of the current collector, then enters an oxidation film removing device 5 to remove an oxidation film, is cleaned in a first water washing device 6 and then enters an activating device 7 to be activated, the activating device adopts dilute sulfuric acid to activate, is low in cost and good in effect, enters a second water washing device 8 after coming out of the activating device 7 to clean residual sulfuric acid on the current collector, the cleaned waste water is recycled by a recycling water tank in the second water washing device, the activated current collector is pre-plated in a copper indium alloy plating device 9, is plated with a layer of copper alloy and then enters an indium plating device 10 to perform indium plating treatment, after the indium plating treatment, the third water washing device 11 is used for water washing, the third water washing device 11 is provided with a recycling water tank to recycle waste water containing indium, a power washing device 11 is arranged behind the third water washing device 11, and a power washing device 12 is used for providing a closed power system for drying and a power package device 13 after the current collector is finished.
Claims (3)
1. A current collector indium plating system is characterized in that: the current collector sequentially passes through a polishing device, an impurity removing device, a degreasing device, an oxide film removing device, a first washing device, an activating device, a second washing device, a copper indium alloy plating device, an indium plating device, a third washing device, a power device and a sealing liquid sealing device.
2. The current collector indium plating system of claim 1, wherein: the second cleaning device is provided with a recovery water tank.
3. The current collector indium plating system of claim 1, wherein: the third cleaning device is provided with a recovery water tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520431622.XU CN204779876U (en) | 2015-06-23 | 2015-06-23 | Current collector indium plating system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520431622.XU CN204779876U (en) | 2015-06-23 | 2015-06-23 | Current collector indium plating system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204779876U true CN204779876U (en) | 2015-11-18 |
Family
ID=54519966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520431622.XU Active CN204779876U (en) | 2015-06-23 | 2015-06-23 | Current collector indium plating system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204779876U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110004470A (en) * | 2019-05-27 | 2019-07-12 | 南平华孚电器有限公司 | Roll plating indium production process of current collector copper needle |
-
2015
- 2015-06-23 CN CN201520431622.XU patent/CN204779876U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110004470A (en) * | 2019-05-27 | 2019-07-12 | 南平华孚电器有限公司 | Roll plating indium production process of current collector copper needle |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Mass flow body plates indium system Effective date of registration: 20160426 Granted publication date: 20151118 Pledgee: Societe Generale Bank, Limited by Share Ltd, Nanping branch Pledgor: NANPING HUAFU ELECTRIC APPLIANCE CO., LTD. Registration number: 2016350000035 |
|
| PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model |