CN204760412U - Multi -functional anchor clamps of solid brilliant machine of SMD LED - Google Patents
Multi -functional anchor clamps of solid brilliant machine of SMD LED Download PDFInfo
- Publication number
- CN204760412U CN204760412U CN201520583830.1U CN201520583830U CN204760412U CN 204760412 U CN204760412 U CN 204760412U CN 201520583830 U CN201520583830 U CN 201520583830U CN 204760412 U CN204760412 U CN 204760412U
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- CN
- China
- Prior art keywords
- support
- press strip
- bolt
- surface mounted
- mounted device
- Prior art date
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- Expired - Fee Related
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Abstract
The utility model provides a multi -functional anchor clamps of solid brilliant machine of SMD LED, can the quick adjustment location, it includes first support (1), second support (2) and many bleeding pressure strip (3), each layering (3) are located between first support (1) and second support (2), be equipped with through -hole (7) that are used for fixing on layering (3), first support (1) is gone up with second support (2) and is opened recess (4) that have along length direction sets up, recess (4) sliding fit has bolt (6), two bolt (6) of every bleeding pressure strip (3) configuration, partial being connected with of exposing that bolt (6) were passed after through -hole (7) is used for compressing tightly nut (8) fixed on corresponding support with layering (3).
Description
Technical field
The utility model relates to LED manufacturing equipment technical field, is specifically a kind of multi-functional clamp of surface mounted device LED die bonder.
Background technology
Bonder produces the visual plant of light-emitting diode (LED), its workflow is as follows: first feeding system is transported to the die bond support in storage device on charging channel, die bond support moves along charging channel and rests on and determines on position subsequently, at this moment the some rubber moulding group on support puts adhesion substance automatically, i.e. adhesion substance on the point of the crystal bonding area of die bond support, then chip is got by automatic pick-and-place apparatus from wafer disks, and by die bonding on the crystal bonding area of die bond support, namely die bond is completed, for the adopting surface mounted LED die bond course of work, die bond support lies low to enter on charging channel generally also needs fixture to locate, and work is entered for the die bond support of different size, then also need the fixture of configurations match separately, so not only hinder production process, increase the difficulty of process operation, and cost is high, be unfavorable for the large production of industrialization.
Although existing multi-purpose fixture can solve most problem, it also needs to carry out adjustment repeatedly before using, and can not accurate quick position, complicated operation, therefore, design a kind of can the multi-functional clamp of surface mounted device LED die bonder of quick adjustment location, have objective practicality.
Utility model content
Technical problem to be solved in the utility model is, overcomes the defect of prior art, the multi-functional clamp of the surface mounted device LED die bonder providing a kind of quick adjustment to locate.
For solving the problems of the technologies described above, the utility model proposes a kind of multi-functional clamp of surface mounted device LED die bonder, it comprises the first support, the second support and Duo Gen press strip, each press strip is located between the first support and the second support, press strip is provided with for fixing through hole, first support and the second support have the groove arranged along its length, groove is sliding combined with bolt, every root press strip configures two bolts, and bolt is connected with the nut for being pressed abd fixed on by press strip in respective holder through the exposed portion after through hole.
After adopting said structure, compared with prior art, the utility model has the following advantages: the aperture window dimension size that crystal bonding area is exposed is adjustable, the die bond support location meeting all size thus uses, can be general, meets industry and utilizes, and reduction production cost, structure is simple, easy to assembly, substantially increases operation ratio and the operability of equipment.
As improvement, groove is T-slot, and one end is opening, and the other end is closed, and like this, only assemble from one end in use, avoid dropping, structure is more reasonable.
As improvement, the first support and the second support afterbody are respectively provided with the lid of closing openings, and like this, press strip would not skid off support, also can avoid entering of impurity, thus avoid wearing and tearing, and structure is compact and reasonable more.
As improvement, the nut of bolt is stop nut, like this, other reasons would not be waited to get loose voluntarily because of vibration during routine use, add reliability of the present utility model.
Accompanying drawing explanation
Fig. 1 is the structural representation of the multi-functional clamp of the utility model surface mounted device LED die bonder.
Fig. 2 is the front view of the multi-functional clamp support of the utility model surface mounted device LED die bonder when not using.
Fig. 3 is the multi-functional clamp press strip of the utility model surface mounted device LED die bonder and the cutaway view of support connected mode.
Shown in figure, the 1, first support, the 2, second support, 3, press strip, 4, groove, 5, window, 6, bolt, 7, through hole, 8, stop nut, 9, lid, 10, fixed screw, 11, pad.
Embodiment
Below the utility model is described in further detail:
The utility model comprises the first support 1, second support 2 and Duo Gen press strip 3, each press strip 3 is located between the first support 1 and the second support 2, press strip 3 is provided with for fixing through hole 7, first support 1 and the second support 2 have the groove 4 arranged along its length, groove 4 is sliding combined with bolt 6, every root press strip 3 configures two bolts 6, and bolt 6 is connected with the nut 8 for being pressed abd fixed on by press strip 3 in respective holder through the exposed portion after through hole 7.
Each press strip 3 framework is identical, installation parallel to each other, mutually vertical with the second support 2 with the first support 1.
According to processing object, take off lid 9, to press strip 3 and the first support 1, second support 2 regulates, press strip 3 is locked by bolt 6, to be fixed between the first support 1 and second between 2, can fix in any position of support, press strip 3 is by support upper groove 4 displacement, regulate longitudinal width, press strip 3 passing hole system, namely the some through holes 7 arranged, and 2 mix packing ring (11) with bolt 6 through the through hole 7 on press strip 3 and lock between the first support 1 and second, according to the position adjustments transverse width of through hole 7, regulate the size of crystal bonding area window 5 at any time, assemble rear lid 9 groove 4 is closed, prevent impurity from entering, thus avoid wearing and tearing, the utility model has structure simple, dismounting fast can be carried out, quick adjustment is to the size needed, can boost productivity.
The above is only better embodiment of the present utility model, therefore all equivalences done according to structure, feature and the principle described in present patent application scope change or modify, and are included in the utility model patent claim.
Claims (4)
1. the multi-functional clamp of a surface mounted device LED die bonder, it comprises the first support (1), second support (2) and many press strips (3), it is characterized in that, each press strip (3) is located between the first support (1) and the second support (2), press strip (3) is provided with for fixing through hole (7), first support (1) and the second support (2) have the groove (4) arranged along its length, groove (4) is sliding combined with bolt (6), every root press strip (3) configuration two bolts (6), bolt (6) is connected with the nut (8) for being pressed abd fixed on by press strip (3) in respective holder through the exposed portion after through hole (7).
2. the multi-functional clamp of surface mounted device LED die bonder according to claim 1, is characterized in that, described groove (4) is T-slot, and one end is opening, and the other end is closed.
3. the multi-functional clamp of surface mounted device LED die bonder according to claim 2, is characterized in that, the first support (1) and the second support (2) afterbody are respectively provided with the lid (10) of closing openings.
4. the multi-functional clamp of surface mounted device LED die bonder according to claim 1, is characterized in that, nut (8) is stop nut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520583830.1U CN204760412U (en) | 2015-08-05 | 2015-08-05 | Multi -functional anchor clamps of solid brilliant machine of SMD LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520583830.1U CN204760412U (en) | 2015-08-05 | 2015-08-05 | Multi -functional anchor clamps of solid brilliant machine of SMD LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204760412U true CN204760412U (en) | 2015-11-11 |
Family
ID=54475092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520583830.1U Expired - Fee Related CN204760412U (en) | 2015-08-05 | 2015-08-05 | Multi -functional anchor clamps of solid brilliant machine of SMD LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204760412U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108282994A (en) * | 2018-03-28 | 2018-07-13 | 澳洋集团有限公司 | A kind of single-chip LED patch mounting brackets |
| CN111370553A (en) * | 2020-03-20 | 2020-07-03 | 苏州斯尔特微电子有限公司 | High-precision chip welding method of LED full-automatic die bonder |
-
2015
- 2015-08-05 CN CN201520583830.1U patent/CN204760412U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108282994A (en) * | 2018-03-28 | 2018-07-13 | 澳洋集团有限公司 | A kind of single-chip LED patch mounting brackets |
| CN108282994B (en) * | 2018-03-28 | 2024-04-09 | 澳洋集团有限公司 | Mounting bracket for single-chip LED patch |
| CN111370553A (en) * | 2020-03-20 | 2020-07-03 | 苏州斯尔特微电子有限公司 | High-precision chip welding method of LED full-automatic die bonder |
| CN111370553B (en) * | 2020-03-20 | 2021-08-24 | 苏州斯尔特微电子有限公司 | High-precision chip welding method of LED full-automatic die bonder |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: Jiaxing City, Zhejiang province 314400 Haining Economic Development Zone Haining City Jinli Road No. 2 Building 2 layer three Patentee after: ZHEJIANG WEIWEI OPTOELECTRONIC TECHNOLOGY CO., LTD. Address before: Haining city Chang Street Jinli road Jiaxing City, Zhejiang province 314400 No. 2 Patentee before: ZHEJIANG WEIWEI OPTOELECTRONIC CO., LTD. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151111 Termination date: 20180805 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |