CN204760357U - Chip image recognition device - Google Patents
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- CN204760357U CN204760357U CN201520331448.1U CN201520331448U CN204760357U CN 204760357 U CN204760357 U CN 204760357U CN 201520331448 U CN201520331448 U CN 201520331448U CN 204760357 U CN204760357 U CN 204760357U
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Abstract
The utility model provides a chip image recognition device, including an actuating mechanism, first conduction mechanism, first guide rail, a motion platform, the 2nd actuating mechanism, second conduction mechanism, second guide rail, the 2nd motion platform, wafer, camera device and display device, an actuating mechanism follows the first direction motion through the drive motion platform of first conduction mechanism on first guide rail, the 2nd actuating mechanism passes through the 2nd motion platform of drive of second conduction mechanism and moves along the second orientation on the second guide rail, first direction of motion perpendicular to second direction of motion, the wafer is fixed on chip image recognition device to follow a motion platform and the 2nd motion platform at first direction and second side's upward movement, camera device sets up in the wafer top for absorb simultaneously the image of a plurality of chips in real time, display device connects in camera device for the image that demonstration camera device absorbed.
Description
Technical field
The utility model relates to semiconductor packaging device field, more particularly, relates to a kind of chip image recognition device.
Background technology
In semiconductor packages, the quality of automatic die Bonder first identification chip, then moves to screen middle by qualified chip, and then soldering tip is come pick-up chip, and by chip attach on framework.Therefore main frame identification chip qualified chip is moved to the speed of service of the automatic die Bonder of the Time dependent of screen center.
Usually, after automatic die Bonder picks up a chip, by horizontal direction (or vertical direction), next chip is moved to screen center successively, then carry out chip identification.If qualified, then soldering tip pick-up chip, and be bonded on framework; If defective, then will move to screen center by next chip again, identify, qualified words are then picked up, and are bonded on framework, if defective, then circulate as previously mentioned, until recognize qualified chip.
This chip identification method simple practical, but the shortcoming independent holding time that is chip identification, affect complete machine speed; In addition when encountering continuous multiple chip and being defective, under eutectic die attach mode, because the chip of a upper bonding die still rests on high temperature furnace, therefore heating time one is long, possible defective chip.Therefore prior art need to improve.
Utility model content
The technical problems to be solved in the utility model is, overcome the above-mentioned defect of prior art, a kind of chip image recognition device is provided, by chip being identified fast and moving to display unit center, the quality of multiple chip can be identified simultaneously, and after pickup qualified chip, rapidly next qualified chip is moved to display unit central authorities by a graded, thus identification chip quality takies complete machine running time hardly, so improve the average running speed of automatic die Bonder, be conducive to the raising of product quality.
The utility model solves the technical scheme that its technical problem adopts: provide a kind of chip image recognition device, comprise the first driving mechanism, the first conduction mechanism, the first guide rail, the first motion platform, the second driving mechanism, the second conduction mechanism, the second guide rail, the second motion platform, wafer, camera head and display unit;
Described first driving mechanism drives described first motion platform to move along first direction on described first guide rail by described first conduction mechanism, and described second driving mechanism drives described second motion platform to move along second direction on described second guide rail by described second conduction mechanism; Described first direction of motion is perpendicular to described second direction of motion;
Described wafer is fixed on described chip image recognition device, and follows described first motion platform and described second motion platform moves upward at described first direction and described second party;
Described camera head is arranged at above described wafer, for while real time shooting multiple described wafer image; Described display unit is connected to described camera head, for showing the image of described camera head picked-up.
Preferably, the first origin sensor, the second origin sensor, the first limit sensor and the second limit sensor is also comprised;
Described first origin sensor and described first limit sensor are arranged at the two ends of described first conduction mechanism respectively, for controlling the moving range of described first motion platform;
Described second origin sensor and described second limit sensor are arranged at the two ends of described second conduction mechanism respectively, for controlling the moving range of described second motion platform.
Preferably, also comprise controller, described controller is connected to described first driving mechanism, described second driving mechanism, described first origin sensor, described second origin sensor, described first limit sensor and described second limit sensor; For control described chip image recognition device described first oppositely with the motion in described second direction, and the pickup of control chip.
Preferably, described controller comprises multiple pci bus slot, for connecting external module.
Preferably, motion-control module and image processing module is also comprised; Described motion-control module and described image processing module are all connected to described controller by described pci bus slot.
The invention also discloses the chip image recognition methods based on this chip image recognition device, it is characterized in that, comprise the following steps:
S100, start described chip image recognition device, described first motion platform all moves to corresponding origin position with described second motion platform;
S200, by regulating the position of described first motion platform and described second motion platform, described display screen central authorities are made to show the chip of predetermined number;
S300, suitable threshold is set, binary conversion treatment is carried out to the chip image that described display unit shows, make graphics chip and its background difference maximum, then select step pitch measuring and calculating, generate the mobile relation of described first direction and described second direction;
S400, chip pickup order is set;
S500, according to preset regular pick-up chip.
Preferably, described step S100 also comprises:
After starting described chip image recognition device, described first motion platform first moves to corresponding extreme position respectively with described second motion platform, after arriving corresponding extreme position, described first motion platform moves to corresponding origin position by corresponding extreme position more respectively with described second motion platform.
Preferably, described step S500 comprises the following steps:
Whether S501, nine chips judged in large square frame are qualified chip, judge whether chip exists breakpoint chip simultaneously;
S502, to pick up from first qualified chip by pickup order, and breakpoint chip position is recorded as breakpoint location, be stored in described controller;
S503, picked up chip from described first qualified chip after, new chip enters the position at chip place before pickup, picks up new chip;
S504, repetition step S501 to S503, after waiting for that qualified chip picks up by the rule preset by initial chip, pick up qualified chip by the rule preset again from described breakpoint location;
S505, repetition step S501 to S504.
Preferably, before step S100, also step is comprised:
S110, described motion-control module is connected to described controller, and connects described first driving mechanism, described second driving mechanism, described first origin sensor, described second origin sensor, described first limit sensor and described second limit sensor by described controller;
S120, described image module is connected to described controller;
S130, in the controller corresponding software and driver are installed.
Preferably, the movement function that described motion-control module comprises comprises a position movement function, continuously movement function, Aligning control movement function and moving interpolation function.
Implement the utility model and there is following beneficial effect: the quality that simultaneously can identify multiple chip, and after pickup qualified chip, rapidly next qualified chip is moved to display unit central authorities (namely next chip to be picked up whether qualified be identified in advance) by a graded, thus identification chip quality does not take complete machine running time, its " identification chip " and " pick-up chip " two actions complete in same sequential, so improve the average running speed of automatic die Bonder, be conducive to the raising of product quality.
Accompanying drawing explanation
Fig. 1 is the structural representation of the specific embodiment of the utility model chip image recognition device.
Fig. 2 is the schematic flow sheet of the utility model chip image recognition methods one embodiment.
Fig. 3 is the schematic flow sheet of another embodiment of the utility model chip image recognition methods.
Fig. 4 is the chip identification block diagram of the utility model chip image recognition methods.
Fig. 5 is the chip identification binary image of the utility model chip image recognition methods.
Fig. 6 a is the chip pickup sequential schematic of the utility model chip image recognition methods one embodiment.
Fig. 6 b is the chip pickup sequential schematic of another embodiment of the utility model chip image recognition methods.
Fig. 7 is the flow chart of the utility model chip image recognition methods.
Fig. 8 is the flow chart judging chip whether breakpoint chip.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described in further detail.
The utility model is for the independent holding time of conventional art chip identification in prior art, affect complete machine speed, chip is defective is the problem affecting chip pickup velocity, provide a kind of chip image recognition device, by chip being identified fast and moving to display unit center, the quality of multiple chip can be identified simultaneously, and after pickup qualified chip, rapidly next qualified chip is moved to display unit central authorities by a graded, thus identification chip quality takies complete machine running time hardly, so improve the average running speed of automatic die Bonder, be conducive to the raising of product quality.
In order to there be understanding clearly to technical characteristic of the present utility model, object and effect, now contrast accompanying drawing and describe embodiment of the present utility model in detail.
Fig. 1 is the structural representation of the specific embodiment of the utility model chip image recognition device.As shown in Figure 1, the utility model provides a kind of chip image recognition device, comprises the first driving mechanism 1, first conduction mechanism 2, first guide rail 3, first motion platform 4, second driving mechanism 5, second conduction mechanism 6, second guide rail 7, second motion platform 8, wafer 9, camera head 10 and display unit 11; First driving mechanism 1 drives the first motion platform 4 to move along first direction on the first guide rail by the first conduction mechanism 2, and the second driving mechanism 5 drives the second motion platform 8 to move along second direction on the second guide rail by the second conduction mechanism 6; First direction of motion is perpendicular to second direction of motion; Wafer 9 is fixed on chip image recognition device, and follows the first motion platform 4 and the second motion platform 8 moves in a first direction and a second direction; Camera head 10 is arranged at above wafer 9, for while real time shooting multiple wafer 9 image; Display unit 11 is connected to camera head 10, for showing the image that camera head 10 absorbs.In the present embodiment, the first driving mechanism 1 and the second driving mechanism 5 are step/servo motor; First conduction mechanism 2 and the second conduction mechanism 6 are rolling lead screw; First guide rail 3 and the second guide rail 7 comprise one or two slide rails, can be stable lead to the first motion platform 4 or the second motion platform 8.Camera head 10 is one and is with the ccd video camera of enlarging lens and display unit 11 to be a display, for the image of real time shooting wafer.
Chip image recognition device also comprises the first origin sensor 12, second origin sensor 13, first limit sensor 14 and the second limit sensor 15; First origin sensor 12 and the first limit sensor 14 are arranged at the two ends of the first conduction mechanism 2 respectively, for controlling the moving range of the first motion platform 4; Second origin sensor 13 and the second limit sensor 15 are arranged at the two ends of the second conduction mechanism 6 respectively, for controlling the moving range of the second motion platform 8.
Chip image recognition device also comprises controller, and controller is connected to the first driving mechanism 1, second driving mechanism 5, first origin sensor 12, second origin sensor 13, first limit sensor 14 and the second limit sensor 15; For control chip pattern recognition device in the first motion oppositely and in second direction, and the pickup of control chip.Controller comprises multiple pci bus slot, for connecting external module.Chip image recognition device also comprises motion-control module and image processing module; Motion-control module and image processing module are all connected to controller by pci bus slot.
In the present embodiment, an industrial computer with multiple pci bus slot, the relatively general computer mainly working stability of industrial computer, can not often crash.Having multiple pci bus slot is because have multiple motion control card, image card, signal input/output cards etc. to be all be plugged in pci bus slot, concrete number needs will be determined by the control performance of the function of automatic die Bonder and each card, and these card mutual when workings do not disturb.
The industrial computer adopted in the utility model is general industrial computer, motion control card, the standard configuration that image card Dou Shi specialized factory provides, they all once used in a large number in various industrial occasions, its stability and reliability are very high, thus the utility model does not need to develop complicated specialized control hardware, only need develop corresponding first in industrial computer, second motion platform control software design, by calling the bottom software of motion control card and image card, just can realize first, second motion platform moves on request, thus realize a kind of simple, reliable first, second motion platform control method.First, second motion platform motion of the present utility model accurately and reliably, highly versatile, can expand according to control overflow, there is good human-machine operation display interface, multipurpose can be realized based on first, second motion platform control design case of the present utility model, product quality is higher, and the equipment speed of service is faster.
First motion platform 4 is in low layer, when the first driving mechanism 1 drives the first conduction mechanism 2 to rotate, the first motion platform 4 be fixed on the first guide rail 3 produces the motion of first direction, the interval of motion is determined by the first limit sensor 14, and the first origin sensor 12 determines the initial position residing for the first motion platform 4.Second guide rail 7 side is fixed on the first motion platform 4, side and the second motion platform 8 link, when the second driving mechanism 5 drives the second conduction mechanism 6 to rotate, second motion platform 8 produces the motion of second direction, its limit of sports record is determined by the second limit sensor 15, and the second origin sensor 13 determines the initial position residing for the second motion platform 8.Wafer 9 is placed on the second motion platform 8, and above wafer 9, have one with the ccd video camera 14 of enlarging lens, the chip signal of picked-up, through image card, shows on a display 15 in real time.
Fig. 2 is the schematic flow sheet of the utility model chip image recognition methods one embodiment.As shown in Figure 2 (in Fig. 2, chip image carries out binary conversion treatment), the utility model additionally provides a kind of chip image recognition methods, based on above-mentioned chip image recognition device, comprises the following steps:
S100, bootrom pattern recognition device, the first motion platform 4 all moves to corresponding origin position with the second motion platform 8;
S200, position by adjustment first motion platform 4 and the second motion platform 8, make the chip of display screen central authorities display predetermined number; As shown in Figure 4, Fig. 4 is the chip identification block diagram of the utility model chip image recognition methods, this figure be camera head 10 absorb the original image (gray-scale map) obtained, for the ease of better understanding the course of work of chip image recognition device, the utility model directly provides this original image (i.e. Fig. 4).
S300, arrange suitable threshold, as shown in Figure 5, Fig. 5 is the chip identification binary image of the utility model chip image recognition methods.This is because computer is when processing this original image (image namely in Fig. 4), its treatment effeciency is slower, therefore in order to improve the identifying processing efficiency of computer, the utility model arranges an applicable threshold, when the gray value of chip pixel is greater than this threshold, this chip is in highlighted state, and (namely the grey scale pixel value of this chip is shown as 255, state as in Fig. 5), when the gray value of chip pixel is lower than this threshold, this chip is in dim condition (namely the grey scale pixel value of this chip is shown as 0), in this way, computer can be identified chip fast.The utility model carries out binary conversion treatment to the chip image that display unit shows, make graphics chip and its background difference maximum, then select step pitch measuring and calculating, generate the mobile relation of first direction and second direction; In practical application, judge that whether threshold is reasonable, mainly see that whether qualified chip image after binaryzation and its background (black borders namely in Fig. 5 between two chips) or the difference of defective chip be obvious, as long as significantly can distinguish qualified chip and defective chip, then this threshold is applicable threshold.In practical application, judge that chip is that the standard of defective chip is as follows: when the quantity of the high bright spot (namely gray value is the point of 255) among the pixel of (1) each chip is lower than self-defined numerical value, this chip is defective chip; (2) chip position generation skew or chip rotate and exceed set point, and this chip is defective chip; (3), when the distance between adjacent chips is less than self-defining value, these two pieces adjacent chips are defective chip.
S400, chip pickup order is set.
S500, according to preset regular pick-up chip.
Fig. 3 is the schematic flow sheet of another embodiment of the utility model chip image recognition methods.As shown in Figure 3, in another embodiment of chip image recognition methods, based on above-mentioned chip image recognition device, comprise the following steps:
After S100, bootrom pattern recognition device, first motion platform 4 first moves to corresponding extreme position respectively with the second motion platform 8, after arriving corresponding extreme position, the first motion platform 4 moves to corresponding origin position by corresponding extreme position more respectively with the second motion platform 8.In the present embodiment, after energising start, the second motion platform 8 moves, once after searching out extreme position towards the direction of the second limit sensor 15, second driving mechanism 5 counter-rotation immediately, until just stop when the second motion platform 8 moves to the position of the second origin sensor 13; Move simultaneously at the second driving mechanism 5, first motion platform 4 moves towards the first limit sensor 14 direction, once after searching out extreme position, the first driving mechanism 1 counter-rotation immediately, until just stop when the first motion platform 4 moves to the first origin sensor 13 position.
S200, position by adjustment first motion platform 4 and the second motion platform 8, make the chip of display screen central authorities display predetermined number; As shown in Figure 4, Fig. 4 is the chip identification block diagram of the utility model chip image recognition methods.In the present embodiment, by moving along first direction of motion and second direction of motion respectively by key control first motion platform 4, second motion platform 8, make the chip that display screen central authorities display nine is qualified, the square frame at adjustment center, spacing between the length of side+1/2 adjacent chips making it equal a chip, this is the scope identifying one single chip; The large square frame of adjustment outside, the spacing between the length of side+three adjacent chips making it equal three chips, this is the scope of identification nine chips.
S300, arrange suitable threshold, as shown in Figure 5, Fig. 5 is the chip identification binary image of the utility model chip image recognition methods.Binary conversion treatment is carried out to the chip image of display unit display, makes graphics chip and its background difference maximum, then select step pitch measuring and calculating, the mobile relation of generation first direction and second direction;
S400, chip pickup order is set; In the present embodiment, industrial computer identifies nine chips in large square frame simultaneously, and according to certain order pick-up chip: first pick-up chip 1, then the first motion platform 4 and the second motion platform 8 move, by in the little square frame in chip 2 shift-in center, (now, nine chips in large square frame change, and former chip 2 chosen by the little square frame in center, namely the sequence number of former chip 2 becomes new chip 1), then new to this chip 1 picks up; When chip 2 vacancy or be defective chip time, then the first motion platform 4 and the second motion platform 8 move, chip 3 to be moved in the little square frame in center (now, nine chips in large square frame change, former chip 3 chosen by the little square frame in center, namely the sequence number of former chip 3 becomes new chip 1), then new to this chip 1 picks up.
S500, according to preset regular pick-up chip.In the present embodiment, as shown in figure 6 a and 6b, Fig. 6 a is the chip pickup sequential schematic (pickup direction is from left to right) of the utility model chip image recognition methods one embodiment, Fig. 6 b is the chip pickup sequential schematic (pickup direction is for from right to left) of another embodiment of the utility model chip image recognition methods, as shown in Figure 7, Fig. 7 is the flow chart of the utility model chip image recognition methods.Step S500 is further comprising the steps of:
Whether S501, disposable nine chips judged in large square frame are qualified chip, judge whether nine chips in large square frame exist breakpoint chip simultaneously;
S502, to pick up from first qualified chip by pickup order, and breakpoint chip position is recorded as breakpoint location, be stored in controller;
S503, picked up chip from described first qualified chip after, (this chip is one in nine chips in large square frame to new chip, this chip is qualified chip and its sequence number closelys follow previous picked qualified chip) enter the position (namely in the little square frame in center) of picking up front chip place, new chip is picked up;
S504, repetition step S501-S503, until can pick up without qualified chip in large square frame, then the first motion platform 4 and the second motion platform 8 move, and first breakpoint location stored by institute's controller moves in the little square frame in center, picks up this breakpoint chip;
S505, repeat S501-S504.Due to the complexity of semiconductor chip worker core, sometimes nine chip positions in large square frame there will be vacancy or defective chip, arranging breakpoint chip can ensure when the chip of nine in large square frame is defective chip, automatic die Bonder can be adjusted to breakpoint chip place immediately and pick up, avoid and again other chips are detected, saved detection time.Breakpoint chip of the present utility model is defined as follows: in large square frame, except the chip picked up corresponding to the little square frame in center, when picking up one of them chip in order, other qualified chip may be caused not to be picked automatically, and the chip that can not be picked automatically is exactly breakpoint chip.In practical application, automatic die Bonder, once after having picked up chip, gets back to breakpoint location immediately, from breakpoint location, carry out pick-up chip operation.Concrete, see Fig. 8, in large square frame nine chip, qualified chip can move on in Main subrack (i.e. the little square frame in center) by main frame, be numbered No. 1 chip, this is the chip that will pick up at present, and judges that whether all the other eight chips are qualified, in order by first qualified chip shift-in Main subrack: if fruit chip 2 is qualified chips, then by chip 2 shift-in Main subrack; As defective in fruit chip 2, chip 3 is qualified, then by chip 3 shift-in Main subrack ..., the rest may be inferred, until chip 2,3,4,5,6,7,8 is all defective, as qualified in fruit chip 9, then by chip 9 shift-in Main subrack; If all defective, then shutdown of directly reporting to the police.When motion platform is by before in chip 2 shift-in Main subrack, breakpoint will be there is under three circumstances, as shown in Figure 8, also depict in figure after having picked up chip 1, the breakpoint that next pickup object may exist when being chip 3,4,5,6,7,8 respectively, if it is determined that there is breakpoint, then demand store breakpoint position.Rule that breakpoint takes that last in, first out, namely the last breakpoint stored, processes at first; The breakpoint stored at first, finally processes.
In the present embodiment, before step S100, also comprise step:
S110, motion-control module is connected to controller, for insert in the PCI slot of industrial computer by motion control card in the present embodiment; And connect the first driving mechanism 1, second driving mechanism 5, first origin sensor 12, second origin sensor 13, first limit sensor 14 and the second limit sensor 15 by controller;
S120, image module is connected to controller; For image card is inserted in the PCI slot of industrial computer in the present embodiment;
S130, in the controller corresponding software and driver are installed.The present embodiment for install following software on industrial computer: more than Windows2000 version, MicrosoftVisualStudio6.0, motion control card driver, image card driver.
The industrial computer operating system used in the utility model adopts more than Windows2000 version, this is mainly because Windows2000 operating system is more stable, network service is reliable, convenient in order to describe, example is developed as with the kinetic control system under Windows2000 operating system, the motion control card of all access pci buss, signal input/output cards are all supported in the secondary development under Windows2000 operating system, and its dynamic link library is the Windows32 position dynamic link library of standard.
Install hardware according to aforesaid step, MicrosoftVisualStudio6.0(or more version is installed in start) and the driver of motion control card and signal input/output cards, startup visual c++, a newly-built engineering, step is as follows:
(1), MicrosoftVisualC++6.0 is opened in double-click, the New menu item in main menu File is selected in its development interface, eject New dialog box, in dialog box, click Projects label, choose MFCAppWizard (exe) item wherein.Then key in the path of engineering access site in Location frame on the right, then key in engineering name DieAPS in Projectname frame, click the first step that OK button enters MFCAppWizard.
(2), in the first step of MFCAppWizard, select Multipledocuments item, then click Next button, enter second step.
(3), at the second step of MFCAppWizard, select None item, then click Next button, enter the 3rd step.
(4), in MFCAppWizard the 3rd step, select None item and ActiveXControls item, then click Next button, enter the 4th step.
(5), in MFCAppWizard the 4th step, Dockingtoolbar item, Initialstatusbar item, Printingandprintpreview item, 3Dcontrols item and Normal item is selected.Then click Next button, enter the 5th step.
(6), in MFCAppWizard the 5th step, select MFCstandard item, Yes, please item and AsasharedDLL item, then click Next button, enter the 6th step.
(7), in MFCAppWizard the 6th step, this dialog box lists the class that MFCAppWizard is this Program Generating and the filename that will generate.
(8), click Finish button, eject engineering characteristics and describe dialog box, comprise Application Type, the class comprised and component parts etc.
(9), the DLL of application program with motion control card is linked, adopt hiding link (also can adopt display link, difference just in programming), be that DLL, LIB, H dynamic link library file copies in project file DieAPS by mounted motion control card file type.
(10) " Settings " menu item under " Project " menu, is selected.
(11), " Link " Shipping Options Page is switched to, storehouse (file type the is .lib) filename of input motion control card in " Object/librarymodules " hurdle.
(12) add the statement file of the function library header file of motion control card, in the application, like this dynamic library file of motion control card is added into chip image identification control program.
(13), select " Files " item in " AddToProject " under " Project " menu, the header file of signal input/output cards is added chip image identification control program.
(14), click " New " item in " AddToProject " under " Project " menu, select " C++SourceFile " item, create the application program that will be applied to chip image identification control signal I/O control card.
(15) " Settings " menu under " Project " menu, is clicked, open dialog box, in " Link " page, arranging " Catgory " is " input ", the library file name of input signal input/output cards in " Object/librarymodules ", then clicks " OK ".
(16), in chip image recognition application, call the control function of motion control card, signal I/O control card, coding, makes the first motion platform 4 and the second motion platform 8 move as requested.
The main a little position movement function of movement function of motion control card, continuously movement function, Aligning control movement function and moving interpolation function.The motion of some position refers to the speed of each axle by setting separately, acceleration and stroke motion, until arrival desired location, continuous motion refers to the speed of each axle by setting separately, acceleration movement, until there is the outside of respective direction spacing, alarm signal or halt instruction just stop motion, Aligning control motion refers to the speed of each axle by setting separately, acceleration movement, until there is outside initial point signal, limit signal, alarm signal or halt instruction just stop, and moving interpolation is multiaxis links according to certain algorithm, controlled shaft is with entering to start, and arrive target location simultaneously.
By reference to the accompanying drawings embodiment of the present utility model is described above; but the utility model is not limited to above-mentioned embodiment; above-mentioned embodiment is only schematic; instead of it is restrictive; those of ordinary skill in the art is under enlightenment of the present utility model; do not departing under the ambit that the utility model aim and claim protect, also can make a lot of form, these all belong within protection of the present utility model.
Claims (5)
1. a chip image recognition device, it is characterized in that, comprise the first driving mechanism (1), the first conduction mechanism (2), the first guide rail (3), the first motion platform (4), the second driving mechanism (5), the second conduction mechanism (6), the second guide rail (7), the second motion platform (8), wafer (9), camera head (10) and display unit (11);
Described first driving mechanism (1) drives described first motion platform (4) to move along first direction on described first guide rail by described first conduction mechanism (2), and described second driving mechanism (5) drives described second motion platform (8) to move along second direction on described second guide rail by described second conduction mechanism (6); Described first direction of motion is perpendicular to described second direction of motion;
Described wafer (9) is fixed on described chip image recognition device, and follows described first motion platform (4) and described second motion platform (8) and move upward at described first direction and described second party;
Described camera head (10) is arranged at described wafer (9) top, for while real time shooting multiple described wafer (9) image; Described display unit (11) is connected to described camera head (10), for showing the image that described camera head (10) absorbs.
2. chip image recognition device according to claim 1, is characterized in that, also comprises the first origin sensor (12), the second origin sensor (13), the first limit sensor (14) and the second limit sensor (15);
Described first origin sensor (12) and described first limit sensor (14) are arranged at the two ends of described first conduction mechanism (2) respectively, for controlling the moving range of described first motion platform (4);
Described second origin sensor (13) and described second limit sensor (15) are arranged at the two ends of described second conduction mechanism (6) respectively, for controlling the moving range of described second motion platform (8).
3. chip image recognition device according to claim 2, it is characterized in that, also comprise controller, described controller is connected to described first driving mechanism (1), described second driving mechanism (5), described first origin sensor (12), described second origin sensor (13), described first limit sensor (14) and described second limit sensor (15); For control described chip image recognition device in said first direction with the motion in described second direction, and the pickup of control chip.
4. chip image recognition device according to claim 3, is characterized in that, described controller comprises multiple pci bus slot, for connecting external module.
5. chip image recognition device according to claim 4, is characterized in that, also comprises motion-control module and image processing module; Described motion-control module and described image processing module are all connected to described controller by described pci bus slot.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104900558A (en) * | 2015-05-21 | 2015-09-09 | 佛山市蓝箭电子股份有限公司 | Chip image recognition device and method |
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| CN104900558A (en) * | 2015-05-21 | 2015-09-09 | 佛山市蓝箭电子股份有限公司 | Chip image recognition device and method |
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