CN204731377U - A kind of Ya Ce mechanism - Google Patents
A kind of Ya Ce mechanism Download PDFInfo
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- CN204731377U CN204731377U CN201520366918.8U CN201520366918U CN204731377U CN 204731377 U CN204731377 U CN 204731377U CN 201520366918 U CN201520366918 U CN 201520366918U CN 204731377 U CN204731377 U CN 204731377U
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Abstract
A kind of Ya Ce mechanism of the present utility model, comprise assembly under track, and the test bench be arranged under track in the middle part of assembly, and the IC to be measured be arranged on above test bench, and the stock stop be arranged on the right side of test bench, and be connected with back-moving spring with assembly two ends under track, and be connected with assembly on track with the upper end of back-moving spring, and the IC binder insulator be arranged on track above assembly, and be arranged on and press down counterbalance weight above IC binder insulator, and be arranged on the pressure survey cylinder pressed down above counterbalance weight, and the pressure be arranged on above pressure survey cylinder surveys travel adjustment.The adjustable IC pressure of the utility model surveys stroke, guarantee that IC presses lining weighing apparatus, it is high that pressure surveys precision, and pressure is surveyed effective, make the producer can grasp the yields of IC accurately, it is connected with back-moving spring between assembly two ends under assembly and track again on track, conveniently upwards resets to assembly on track, and efficiency is high, structure is simple, safeguard simple, cost is low, uses simple, practical.
Description
Technical field
The utility model relates to a kind of Ya Ce mechanism, particularly relates to a kind of carrying out IC and presses the mechanism surveyed.
Background technology
When tradition Ya Ce mechanism carries out pressure survey to IC, it is provided with buffering spacer usually on IC to be tested, and this makes IC press survey precision low, and the producer is difficult to the yields grasping IC accurately.And traditional Ya Ce mechanism is not owing to be provided with on laterally zygomorphic track assembly under assembly and track, and back-moving spring is provided with between assembly under assembly and track on track, easily occur when making it survey IC pressure that pressure survey is uneven, IC pressure surveys the phenomenons such as stroke is unadjustable, pressure survey is uneven, its complex structure, cost is high.Therefore, carry out there is the deficiency of above-mentioned technical matters when pressing and survey for traditional Ya Ce mechanism to IC, the applicant researches and develops one and to be provided with on track assembly under assembly and track, and be provided with test bench above assembly under track, test bench can carry IC to be measured, track is connected with back-moving spring between assembly two ends under assembly and track, convenient assembly on track is upwards resetted, track is provided with IC binder insulator above assembly, be provided with above IC binder insulator and press down counterbalance weight, press down above counterbalance weight and be provided with pressure survey cylinder, pressure is surveyed above cylinder and is provided with pressure survey travel adjustment, make to press down counterbalance weight and IC binder insulator and surveyed by pressure that travel adjustment is adjustable presses down stroke, and then regulate IC pressure to survey stroke, guarantee that IC presses lining weighing apparatus, it is high that pressure surveys precision, pressure is surveyed effective, make the producer can grasp the yields of IC accurately, efficiency is high, structure is simple, safeguard simple, cost is low, use simple, fast, practical, a kind of Ya Ce mechanism of being convenient to extensively promote the use of really belongs to necessary.
Summary of the invention
The technical problems to be solved in the utility model is to provide one and is provided with on track assembly under assembly and track, and be provided with test bench above assembly under track, test bench can carry IC to be measured, track is connected with back-moving spring between assembly two ends under assembly and track, convenient assembly on track is upwards resetted, track is provided with IC binder insulator above assembly, be provided with above IC binder insulator and press down counterbalance weight, press down above counterbalance weight and be provided with pressure survey cylinder, pressure is surveyed above cylinder and is provided with pressure survey travel adjustment, make to press down counterbalance weight and IC binder insulator and surveyed by pressure that travel adjustment is adjustable presses down stroke, and then regulate IC pressure to survey stroke, guarantee that IC presses lining weighing apparatus, it is high that pressure surveys precision, pressure is surveyed effective, make the producer can grasp the yields of IC accurately, efficiency is high, structure is simple, safeguard simple, cost is low, use simple, fast, practical, be convenient to the Ya Ce mechanism extensively promoted the use of.The utility model is achieved through the following technical solutions:
A kind of Ya Ce mechanism, comprise assembly under track, and the test bench be arranged under track in the middle part of assembly, and the IC to be measured be arranged on above test bench, and the stock stop be arranged on the right side of test bench, and be connected with back-moving spring with assembly two ends under track, and be connected with assembly on track with the upper end of back-moving spring, and the IC binder insulator be arranged on track above assembly, and be arranged on and press down counterbalance weight above IC binder insulator, and be arranged on the pressure survey cylinder pressed down above counterbalance weight, and the pressure be arranged on above pressure survey cylinder surveys travel adjustment.
As preferably, described pressure surveys cylinder, press down counterbalance weight is connected with IC binder insulator and is connected guide pillar.
As preferably, on described track under assembly and track assembly in being symmetrical arranged up and down.
As preferably, described in press down counterbalance weight and IC binder insulator combines in T set up of character patt ern.
A kind of Ya Ce mechanism of the present utility model, comprise assembly under track, and the test bench be arranged under track in the middle part of assembly, and the IC to be measured be arranged on above test bench, and the stock stop be arranged on the right side of test bench, and be connected with back-moving spring with assembly two ends under track, and be connected with assembly on track with the upper end of back-moving spring, and the IC binder insulator be arranged on track above assembly, and be arranged on and press down counterbalance weight above IC binder insulator, and be arranged on the pressure survey cylinder pressed down above counterbalance weight, and the pressure be arranged on above pressure survey cylinder surveys travel adjustment.The utility model is by being provided with on track assembly under assembly and track, and be provided with test bench above assembly under track, test bench can carry IC to be measured, track is connected with back-moving spring between assembly two ends under assembly and track, convenient assembly on track is upwards resetted, track is provided with IC binder insulator above assembly, be provided with above IC binder insulator and press down counterbalance weight, press down above counterbalance weight and be provided with pressure survey cylinder, pressure is surveyed above cylinder and is provided with pressure survey travel adjustment, make to press down counterbalance weight and IC binder insulator and surveyed by pressure that travel adjustment is adjustable presses down stroke, and then regulate IC pressure to survey stroke, guarantee that IC presses lining weighing apparatus, it is high that pressure surveys precision, pressure is surveyed effective, make the producer can grasp the yields of IC accurately, efficiency is high, structure is simple, safeguard simple, cost is low, use simple, fast, practical, be convenient to extensively promote the use of.
Accompanying drawing explanation
For ease of illustrating, the utility model is described in detail by following preferred embodiment and accompanying drawing.
Fig. 1 is the structural representation of a kind of Ya Ce mechanism of the present utility model.
Embodiment
In the present embodiment, as shown in Figure 1, a kind of Ya Ce mechanism of the present utility model, comprise assembly 1 under track, and the test bench 2 be arranged under track in the middle part of assembly 1, and the IC3 to be measured be arranged on above test bench 2, and the stock stop 4 be arranged on the right side of test bench 2, and be connected with back-moving spring 5 with assembly under track 1 two ends, and be connected with assembly 6 on track with the upper end of back-moving spring 5, and the IC binder insulator 7 be arranged on track above assembly 6, and be arranged on and press down counterbalance weight 8 above IC binder insulator 7, and be arranged on the pressure survey cylinder 9 pressed down above counterbalance weight 8, and the pressure be arranged on above pressure survey cylinder 9 surveys travel adjustment 10.
Wherein, described pressure is surveyed cylinder 9, is pressed down counterbalance weight 8 and be connected with IC binder insulator 7 and be connected guide pillar 11.
Wherein, on described track, assembly 6 is be symmetrical arranged up and down with assembly under track 1.
Wherein, press down counterbalance weight 8 described in combine in T set up of character patt ern with IC binder insulator 7.
During operation, IC3 automatic charging to be measured is on test bench 2, and the drive of pressure survey cylinder 9 presses down counterbalance weight 8 and presses down stroke motion to IC downwards with IC binder insulator 7, and pressure surveys travel adjustment 10 for regulating IC pressure survey stroke, guarantee pressure lining weighing apparatus, pressure measurement precision is high.After pressure survey has operated, on track, assembly upwards can carry out reset operation by back-moving spring 5.The operation of this Ya Ce mechanism whole process can regulate, flexibility of operation is strong, robotization, intelligence degree are high, solve and easily to occur when traditional IC pressure is surveyed that pressure is surveyed uneven, IC pressure and surveyed that stroke is unadjustable, pressure surveys imbalance, complex structure, cost are high, the producer is difficult to grasp accurately the problems such as the yields of IC.
A kind of Ya Ce mechanism of the present utility model, comprise assembly under track, and the test bench be arranged under track in the middle part of assembly, and the IC to be measured be arranged on above test bench, and the stock stop be arranged on the right side of test bench, and be connected with back-moving spring with assembly two ends under track, and be connected with assembly on track with the upper end of back-moving spring, and the IC binder insulator be arranged on track above assembly, and be arranged on and press down counterbalance weight above IC binder insulator, and be arranged on the pressure survey cylinder pressed down above counterbalance weight, and the pressure be arranged on above pressure survey cylinder surveys travel adjustment.The utility model is by being provided with on track assembly under assembly and track, and be provided with test bench above assembly under track, test bench can carry IC to be measured, track is connected with back-moving spring between assembly two ends under assembly and track, convenient assembly on track is upwards resetted, track is provided with IC binder insulator above assembly, be provided with above IC binder insulator and press down counterbalance weight, press down above counterbalance weight and be provided with pressure survey cylinder, pressure is surveyed above cylinder and is provided with pressure survey travel adjustment, make to press down counterbalance weight and IC binder insulator and surveyed by pressure that travel adjustment is adjustable presses down stroke, and then regulate IC pressure to survey stroke, guarantee that IC presses lining weighing apparatus, it is high that pressure surveys precision, pressure is surveyed effective, make the producer can grasp the yields of IC accurately, efficiency is high, structure is simple, safeguard simple, cost is low, use simple, fast, practical, be convenient to extensively promote the use of.
Above-described embodiment; a just example of the present utility model; be not for limiting enforcement of the present utility model and interest field, all technical schemes identical or equivalent with content described in the utility model claim, all should be included in the utility model protection domain.
Claims (4)
1. a Zhong Yace mechanism, it is characterized in that: comprise assembly under track, and the test bench be arranged under track in the middle part of assembly, and the IC to be measured be arranged on above test bench, and the stock stop be arranged on the right side of test bench, and be connected with back-moving spring with assembly two ends under track, and be connected with assembly on track with the upper end of back-moving spring, and the IC binder insulator be arranged on track above assembly, and be arranged on and press down counterbalance weight above IC binder insulator, and be arranged on the pressure survey cylinder pressed down above counterbalance weight, and the pressure be arranged on above pressure survey cylinder surveys travel adjustment.
2. a kind of Ya Ce mechanism according to claim 1, is characterized in that: described pressure surveys cylinder, press down counterbalance weight is connected with IC binder insulator and is connected guide pillar.
3. a kind of Ya Ce mechanism according to claim 1, is characterized in that: on described track under assembly and track assembly in being symmetrical arranged up and down.
4. a kind of Ya Ce mechanism according to claim 1, is characterized in that: described in press down counterbalance weight and IC binder insulator and combine in T set up of character patt ern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520366918.8U CN204731377U (en) | 2015-06-01 | 2015-06-01 | A kind of Ya Ce mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520366918.8U CN204731377U (en) | 2015-06-01 | 2015-06-01 | A kind of Ya Ce mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204731377U true CN204731377U (en) | 2015-10-28 |
Family
ID=54389715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520366918.8U Active CN204731377U (en) | 2015-06-01 | 2015-06-01 | A kind of Ya Ce mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204731377U (en) |
-
2015
- 2015-06-01 CN CN201520366918.8U patent/CN204731377U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 523000 Building 9, No. 32, Hengli Yucai Road, Hengli Town, Dongguan City, Guangdong Province Patentee after: Dongguan Huayue Semiconductor Technology Co.,Ltd. Address before: 523000 area a, first floor, building 2, workshop 17, road 1, Beian Industrial Zone, Huangjiang Town, Dongguan City, Guangdong Province Patentee before: DONGGUAN HAYE AUTOMATION EQUIPMENT Co.,Ltd. |