CN204720421U - A kind of pancake semiconductor product plastic package die - Google Patents
A kind of pancake semiconductor product plastic package die Download PDFInfo
- Publication number
- CN204720421U CN204720421U CN201520431339.7U CN201520431339U CN204720421U CN 204720421 U CN204720421 U CN 204720421U CN 201520431339 U CN201520431339 U CN 201520431339U CN 204720421 U CN204720421 U CN 204720421U
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- semiconductor product
- pancake
- die
- plastic packaging
- plastic package
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of pancake semiconductor product plastic package die, be provided with die cavity in its die ontology, described die cavity comprises an inwall bottom surface corresponding with the bottom of described pancake semiconductor product, and described inwall bottom surface is the arcwall face of middle part indent.The arcwall face of the utility model by by the inwall floor design of the die cavity in die ontology being middle part indent, namely the distortion after plastic packaging is made up in epoxy seal semiconductor product process, after plastic packaging completes, bottom semiconductor product, middle part can become plane because of distortion, inner concave can not be formed, can not break during installation, thus fundamentally solve pancake semiconductor product because of plastic packaging and be out of shape the crack damage problem caused, and plastic packaging process need not change, later stage does not do any process, is convenient to implement and promote.
Description
Technical field
The utility model relates to a kind of plastic package die, particularly relates to a kind of pancake semiconductor product plastic package die adopting novel die cavity.
Background technology
Mostly all have buckling deformation in various degree after pancake semiconductor product plastic packaging, major influence factors has: (1) because of inner frame design shape and structure asymmetric; (2) two sides packaging plastic layer thickness difference larger two sides amount of contraction is different; (3) when encapsulating cool to room temperature under about 175 ° of conditions of heating, predominant package material lead frame (most is copper) also can cause different with plastic packaging material coefficient of thermal expansion is out of shape again; (4) when mould molding, epoxy-plastic packaging material generation sequence of chemical reaction generation internal stress also can buckling deformation.So above multiple physics and chemistry reason causes plastic packaged products profile to occur irregular deformation warpage, when product uses to terminal client, screw-driving pressure will make product by pressure break, directly scraps then and there or produces micro-crack, leaving hidden danger of quality when consumer uses.Although many kinds of measures can be used to go to reduce distortion as lead frame structure design, amendment plastic packaging material formula, adjustment plastic packaging molding technique parameter, the smoothing of adjustment Post isothermal treatment etc. in actual production, can improve in various degree and can not thoroughly solve.Such as: two kinds of now conventional modes, one is changed stress intensity by the data of adjustment plastic packaging material coefficient of thermal expansion thus reached reduction warping phenomenon, but can not eliminate completely, moreover product packaging appearance structure is varied does not have versatility, because formulated certainly will increase cost; Two is the later stage reduce the warpage degree of packaging part by heat treatment mode, thoroughly can not solve, and there is the high shortcoming of post-processed efficiency low cost.These traditional approachs can not thoroughly be dealt with problems, be because the intrinsic physical property of material cannot change the different pieces of information of different materials, interiors of products structural design can not be all symmetrical, and these two reasons cannot change, there are differences and will be out of shape, the possibility of pressure break when mounted will be deposited.
Traditional pancake semiconductor product plastic package die, as shown in Figure 1, be provided with die cavity 2 in its die ontology 1, die cavity 2 comprises an inwall bottom surface corresponding with the bottom of semiconductor product, the i.e. lower inner wall surface of die cavity 2 in Fig. 1, this inwall bottom surface is the plane of standard of comparison.As shown in Figure 2, with the distortion that the semiconductor product 3 of this conventional flat shape semiconductor product plastic package die plastic packaging can occur to a certain degree, verify according to long-term observation, after semiconductor product plastic packaging, distortion is irregular, but structural strain's trend is that central low surrounding is high, the middle part of the bottom of semiconductor product 3 bottom of semiconductor product 3 (namely in Fig. 2 and Fig. 3) can indent, because the installing hole 31 of semiconductor product 3 is in center, so as shown in Figure 3, when semiconductor product 3 being installed with screw (not shown), space can be left between the bottom surface of semiconductor product 3 and heating panel 4, screw is through the installing hole 31 of semiconductor product 3 and the installing hole 41 of heating panel 4 and compress the large surface, outside (upper surface in Fig. 3) of semiconductor product 3, due to the distortion of semiconductor product 3, screw is caused to aim at the space in the middle part of semiconductor product 3 to the pressure F in the middle part of semiconductor product 3, the reaction force N of heating panel 4 pairs of semiconductor products 3 then aims at the edge of semiconductor product 3, because capsulation material is epoxy resin, hard especially after forming and hardening, hardness is at more than HRC60, toughness is very poor, so be easy to cause semiconductor product 3 by pressure break in installation process, cause the chip in semiconductor product 3 damaged and cause product directly to be scrapped then and there, or generation micro-crack, hidden danger of quality is left when consumer uses.
Utility model content
The purpose of this utility model is just to provide a kind of pancake semiconductor product plastic package die to solve the problem, higher by the evenness of the pancake semiconductor product of this mould plastic packaging.
The utility model is achieved through the following technical solutions above-mentioned purpose:
A kind of pancake semiconductor product plastic package die, be provided with die cavity in its die ontology, described die cavity comprises an inwall bottom surface corresponding with the bottom of described pancake semiconductor product, and described inwall bottom surface is the arcwall face of middle part indent.
Particularly, the indent height of described inwall bottom surface is that one of percentage for described inwall bottom width is to 1/20th.
As preferably, the indent height of described inwall bottom surface is the sixtieth to a thirtieth of described inwall bottom width.
The beneficial effects of the utility model are:
The arcwall face of the utility model by by the inwall floor design of the die cavity in die ontology being middle part indent, namely the distortion after plastic packaging is made up in epoxy seal semiconductor product process, after plastic packaging completes, bottom semiconductor product, middle part can become plane because of distortion, inner concave can not be formed, can not break during installation, thus fundamentally solve pancake semiconductor product because of plastic packaging and be out of shape the crack damage problem caused, and plastic packaging process need not change, later stage does not do any process, is convenient to implement and promote.
Accompanying drawing explanation
Fig. 1 is the broken section structural representation of conventional flat shape semiconductor product plastic package die, and the structure of die cavity is mainly shown in figure;
Fig. 2 is the main TV structure schematic diagram with the shaping pancake semiconductor product of conventional flat shape semiconductor product plastic package die plastic packaging;
Fig. 3 is with the shaping main TV structure schematic diagram of pancake semiconductor product when being installed on heating panel of conventional flat shape semiconductor product plastic package die plastic packaging;
Fig. 4 is the broken section structural representation of pancake semiconductor product plastic package die described in the utility model, and the structure of die cavity is mainly shown in figure;
Fig. 5 is the main TV structure schematic diagram with the shaping pancake semiconductor product of pancake semiconductor product plastic package die plastic packaging described in the utility model;
Fig. 6 is with the shaping main TV structure schematic diagram of pancake semiconductor product when being installed on heating panel of pancake semiconductor product plastic package die plastic packaging described in the utility model.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in further detail:
As shown in Figure 4, pancake semiconductor product plastic package die described in the utility model, die cavity 5 is provided with in its die ontology 1, die cavity 5 comprises an inwall bottom surface 51 corresponding with the bottom of pancake semiconductor product (the pancake semiconductor product 6 see Fig. 5 and Fig. 6), inwall bottom surface 51 is the arcwall face of middle part indent (being to recessed in FIG), the indent height of inwall bottom surface 51 be one of percentage for inwall bottom surface 51 width to 1/20th, preferred sixtieth to a thirtieth.
As shown in Figure 5, be plane with the bottom 62 of the shaping pancake semiconductor product 6 of pancake semiconductor product plastic package die plastic packaging described in the utility model, its source is: at the plastic packaging initial stage, the bottom of not shaping pancake semiconductor product 6 is consistent with the shape of inwall bottom surface 51, the evagination arcwall face corresponding with the indent arc face of inwall bottom surface 51, but after plastic packaging terminates, pancake semiconductor product 6 makes the middle part indent of bottom it 62 because of its metaboly, thus make the middle part of its evagination inwardly shrink and flush with edge, thus the outer surface forming bottom 62 is the effect of plane.The installing hole 61 being positioned at pancake semiconductor product 6 center is also show in Fig. 5.
As shown in Figure 6, with the shaping pancake semiconductor product 6 of pancake semiconductor product plastic package die plastic packaging described in the utility model when being installed on heating panel 4, the outer surface of the bottom 62 of pancake semiconductor product 6 and heating panel 4 plane-plane contact, owing to being plane, there is no space between the two, so when screw (not shown) is through the installing hole 61 of pancake semiconductor product 6 and the installing hole 41 of heating panel 4 and when compressing large surface, outside (upper surface in Fig. 6) of pancake semiconductor product 6, screw aims at the middle part of pancake semiconductor product 6 to the pressure F in the middle part of pancake semiconductor product 6, the reaction force N of heating panel 4 pairs of pancake semiconductor products 6 then aims at the edge of pancake semiconductor product 6, owing between the bottom 62 of pancake semiconductor product 6 and heating panel 4 being the plane-plane contact of two planes, so pancake semiconductor product 6 can not by pressure break, even if firmly also can remain intact comparatively greatly harmless.
Above-described embodiment is preferred embodiment of the present utility model; it is not the restriction to technical solutions of the utility model; as long as without the technical scheme that creative work can realize on the basis of above-described embodiment, all should be considered as falling within the scope of the rights protection of the utility model patent.
Claims (3)
1. a pancake semiconductor product plastic package die, is provided with die cavity in its die ontology, and described die cavity comprises an inwall bottom surface corresponding with the bottom of described pancake semiconductor product, it is characterized in that: described inwall bottom surface is the arcwall face of middle part indent.
2. pancake semiconductor product plastic package die according to claim 1, is characterized in that: the indent height of described inwall bottom surface is that one of percentage for described inwall bottom width is to 1/20th.
3. pancake semiconductor product plastic package die according to claim 2, is characterized in that: the indent height of described inwall bottom surface is the sixtieth to a thirtieth of described inwall bottom width.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520431339.7U CN204720421U (en) | 2015-06-19 | 2015-06-19 | A kind of pancake semiconductor product plastic package die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520431339.7U CN204720421U (en) | 2015-06-19 | 2015-06-19 | A kind of pancake semiconductor product plastic package die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204720421U true CN204720421U (en) | 2015-10-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520431339.7U Expired - Fee Related CN204720421U (en) | 2015-06-19 | 2015-06-19 | A kind of pancake semiconductor product plastic package die |
Country Status (1)
| Country | Link |
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| CN (1) | CN204720421U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111029265A (en) * | 2019-12-26 | 2020-04-17 | 珠海格力电器股份有限公司 | Plastic package mold and method for preventing QFN (quad Flat No lead) mold package frame from warping |
-
2015
- 2015-06-19 CN CN201520431339.7U patent/CN204720421U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111029265A (en) * | 2019-12-26 | 2020-04-17 | 珠海格力电器股份有限公司 | Plastic package mold and method for preventing QFN (quad Flat No lead) mold package frame from warping |
| CN111029265B (en) * | 2019-12-26 | 2021-11-23 | 珠海格力电器股份有限公司 | Plastic package mold and method for preventing QFN (quad Flat No lead) mold package frame from warping |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151021 Termination date: 20190619 |