CN204686291U - A kind of copper phosphor tin flux coated brazingrod ring - Google Patents
A kind of copper phosphor tin flux coated brazingrod ring Download PDFInfo
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- CN204686291U CN204686291U CN201520230580.3U CN201520230580U CN204686291U CN 204686291 U CN204686291 U CN 204686291U CN 201520230580 U CN201520230580 U CN 201520230580U CN 204686291 U CN204686291 U CN 204686291U
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Abstract
A kind of copper phosphor tin flux coated brazingrod ring, it is made up of ring-type copper phosphor tin solder core and coating, it is characterized in that: described coating uniform fold is in the surface of ring-type copper phosphor tin solder core.The alternative silver-containing solder of coating copper phosphor tin solder described in the utility model, and achieve brazing flux convenient, quantitatively, add in advance efficiently, have easy to assembly, easily realize automated production, low cost and other advantages, can be used for most of copper alloys such as soldering red copper, brass, bronze, be a kind of function admirable, new copper solder with low cost, the pipeline soldering of the industries such as air-conditioning, refrigeration, machinery can be widely used in.
Description
Technical field
The utility model relates to a kind of flux coated brazingrod, and particularly a kind of copper phosphor tin coating ring-type solder, belongs to Novel welding material field.
Background technology
The fusing point of silver-base solder is moderate, good manufacturability, and there is good intensity, toughness, electric conductivity and corrosion resistance, extensive use .Cu-P solder is obtained with its low fusing point in each field of modern industry, good soldering processes performance, the advantages such as distinctive self-fluxing effect (to red copper soldering) and cheap price, being widely used in the soldering of Copper and its alloy, is solder desirable in 500 ~ 800 DEG C of temperature ranges.Cu-P solder mainly contains Cu-P binary solder and Ag-Cu-P ternary solder two class, Cu-P-Ag ternary solder adds Ag in Cu-P binary solder, not only can reduce the fusing point of solder, improve plasticity and the wetability of solder, reduce the resistance coefficient of soldered fitting, intensity and the toughness of solder can also be improved.BCu89PAg and BCu91PAg is two kinds of Cu-P-Ag solders of brazing brass or red copper large usage quantity in current air-conditioning, refrigeration industry.The Cu-P-Ag solder of better performances and silver solder need consume more noble metal silver, more and more higher along with noble metal silver price, cause the processing cost of the manufacturer of the industries such as air-conditioning, refrigeration, machinery, electrical equipment, valve pipe fitting greatly to improve.In order to reduce costs, development environment-friendly type is study frontier and the focus in domestic and international soldering field without silver or low-silver solder always.At present, in copper brazing alloy, joint silver, silver-substituted solder have achieved suitable progress, can add tin, can reduce the fusion temperature of solder further, improve tensile strength and the ductility of solder simultaneously in copper-phosphorus brazing alloy.During soldering copper and copper alloy, it successfully can substitute traditional silver-containing solder, has good economic benefit and huge social benefit.But, but more difficult by the oxide-film of phosphorus ligands tin, need separately with brazing flux.During soldering, brazing flux is coated in joint to be welded before gluing brazing flux use or heating by silk or strip-like copper phosphor tin solder in advance in advance, the consumption that this kind of soldering processes complexity, production efficiency is low, not easily accurately control brazing flux, often occur that brazing flux adds too much or adds non-uniform phenomenon, brazing flux is caused to waste the more difficult cleaning of brazing flux residue, perishable joint.
Summary of the invention
The purpose of this utility model provides a kind of environmental protection, fusing point copper phosphor tin flux coated brazingrod ring that is low, with low cost, easily accurate control brazing flux consumption just for weak point existing in above-mentioned prior art.
The purpose of this utility model realizes by following technique measures:
Copper phosphor tin flux coated brazingrod ring of the present utility model, it is made up of ring-type copper phosphor tin solder core and coating, and described coating uniform fold is in the surface of ring-type copper phosphor tin solder core.
Ring-type copper phosphor tin solder core described in the utility model is individual pen structure, also can be by the many toroidal ring structures of axis of single copper phosphor tin solder core coiling, and the spacing between every two adjacent rings is 0 ~ 1 mm.
The copper of ring-type described in the utility model phosphor tin solder core is annulus round or oblate loop shaped; Described coating weight accounts for 0.5% ~ 16.0% of solder ring gross weight; The thickness of coating is 0.05 mm ~ 0.60 mm.
Copper phosphor tin solder core described in the utility model is by the P of 6.8% ~ 7.2%, the Sn of 0.4% ~ 3%, the Zr of 0.02% ~ 0.5%, the Si of 0.01% ~ 0.4%, the rare earth of 0.01% ~ 0.025%, and all the other are that the raw material of the weight ratio of Cu is prepared from.Described coating is the brazing flux of 50% ~ 70%, adhesive, the flexibilizer of 1% ~ 4%, the solvent composition of 20% ~ 50% of 1% ~ 5% by weight ratio.
More specifically: solder core described in the utility model is copper phosphor tin, containing appropriate P element, P after fusing in liquid solder can go back cupric oxide, the cuprous oxide that native copper surface has generated, play remove oxide-film from brazing flux effect, therefore coating described in the utility model is less relative to the content of other coating solder, coating accounts for 0.5% ~ 16.0% of solder ring gross weight, and the thickness of coating is 0.05 ~ 0.60 mm.The coating of solder described in the utility model sprays by brazing flux liquid the outside being coated to ring-type copper phosphor tin solder core and obtains, and described brazing flux liquid is by the brazing flux of 50% ~ 70%, adhesive, the flexibilizer of 1% ~ 4%, the solvent composition of 20% ~ 50% of 1% ~ 5%.During soldering ordinary copper alloy, brazing flux can use the silver-colored brazing fluxes such as QJ102; After the bonding agent burning that described brazing flux liquid adopts, carbon remains in 10 below ppm, and solvent is TC acetate, acetone etc., and adds the flexibilizer of 1% ~ 4%, with ensure coating have enough to mould, toughness and moisture resistance.
The beneficial effects of the utility model are as follows:
Coating copper phosphor tin brazing filler metal melts temperature described in the utility model is low, and good fluidity, has good wetting and spreading performance, reliable in quality, during soldering copper and copper alloy, it successfully can substitute traditional silver-containing solder, has good economic benefit and huge social benefit.The utility model achieves brazing flux convenience, quantitatively, adds in advance efficiently, have easy to assembly, easily realize automated production, low cost and other advantages, effectively reduce the use amount of solder flux, accurate light, stay-in-grade joint can be obtained, and significantly reduce labour intensity and the environmental pollution of brazing process.Can be used for most of copper alloys such as soldering red copper, brass, bronze, is a kind of function admirable, new copper solder with low cost, can be widely used in the pipeline soldering of the industries such as air-conditioning, refrigeration, machinery.
Accompanying drawing explanation
Fig. 1 multi-turn copper phosphor tin flux coated brazingrod ring schematic diagram.
Fig. 2 is the side view of Fig. 1.
Sequence number in figure: 1-ring-type copper phosphor tin solder core, 2-coating.
Fig. 3 is individual pen copper phosphor tin flux coated brazingrod ring schematic diagram.
Detailed description of the invention:
As shown in Figure 1, 2, copper phosphor tin flux coated brazingrod ring of the present utility model, it is made up of ring-type copper phosphor tin solder core 1 and coating 2, and described coating uniform fold is in the surface of ring-type copper phosphor tin solder core; Described ring-type copper phosphor tin solder core is annulus round or oblate loop shaped; Described coating weight accounts for 0.5% ~ 16.0% of solder ring gross weight; The thickness of coating is 0.05 ~ 0.60 mm.
Ring-type copper phosphor tin solder core described in the utility model is by the many toroidal ring structures of axis of single copper phosphor tin solder core coiling, and the spacing between every two adjacent rings is 0 ~ 1 mm.Also can be individual pen structure (as shown in Figure 3).
Copper phosphor tin solder core described in the utility model is by the P of 6.8% ~ 7.2%, the Sn of 0.4% ~ 3%, the Zr of 0.02% ~ 0.5%, the Si of 0.01% ~ 0.4%, the rare earth of 0.01% ~ 0.025%, and all the other are that the raw material of the weight ratio of Cu is prepared from.Described coating is the brazing flux of 50% ~ 70%, adhesive, the flexibilizer of 1% ~ 4%, the solvent composition of 20% ~ 50% of 1% ~ 5% by weight ratio.
Embodiment 1:
The preparation process of copper phosphor tin flux coated brazingrod ring of the present utility model comprises: a) Cu, Cu-P intermediate alloy, Sn, Cu-Si intermediate alloy, Zr and rare earth are prepared in proportion and carry out melting and be cast into the bar-shaped BCu90P7Sn2.5ZrSi brazing filler metal alloy ingot casting of Φ 50 mm (alloying component is: the P of 6.8% ~ 7.2%, the Sn of 0.4% ~ 3%, the Zr of 0.02% ~ 0.5%, the Si of 0.01% ~ 0.4%, the rare earth of 0.01% ~ 0.025%, all the other are Cu), cut rising head then ladle barrow to be pruned and descale, stand-by; B) solder extrusion equipment system is warming up to 460 DEG C, the ingot casting that car is good is placed in preheating in Muffle furnace, and preheat temperature is 470 DEG C, preheated ingot casting is put into the mould cylinder of extrusion equipment, be squeezed into the solder wire of Φ 1.1 mm, and be drawn to Φ 0.8 mm solder wire; C) copper phosphor tin solder wire diluted acid good for drawing is cleaned, and Passivation Treatment, put into the charging tray of ring apparatus processed after cleaning, copper phosphor tin solder wire is turned to the multi-turn ring-type solder that internal diameter is Φ 6.0 mm; D) coating materials such as adding QJ102 silver brazing flux, QPAC40 adhesive, flexibilizer, the solvent of activating agent is weighed in the ratio of 60:3:4:33 respectively, admixed togetherly make coating material mixture, described coating material mixture to be placed in container and to add a certain amount of solvent, make flux solution, then brazing flux liquid is sprayed the outside being coated to ring-type copper phosphor tin solder core; E) dry, namely obtain finished product copper phosphor tin flux coated brazingrod ring.
Embodiment 2:
With embodiment one unlike by adjust the preheat temperature of copper phosphor tin solder wire and shaping heating-up temperature and Reasonable adjustment mould, can be made into the individual pen ring-type solder that internal diameter is Φ 8.0 mm, and increasing pressing technique.
Claims (5)
1. a copper phosphor tin flux coated brazingrod ring, it is made up of ring-type copper phosphor tin solder core and coating, it is characterized in that: described coating uniform fold is in the surface of ring-type copper phosphor tin solder core.
2. copper phosphor tin flux coated brazingrod ring according to claim 1, is characterized in that: described ring-type copper phosphor tin solder core is individual pen structure.
3. copper phosphor tin flux coated brazingrod ring according to claim 1, is characterized in that: described ring-type copper phosphor tin solder core is by the many toroidal ring structures of axis of single copper phosphor tin solder core coiling, and the spacing between every two adjacent rings is 0 mm ~ 1 mm.
4. copper phosphor tin flux coated brazingrod ring according to claim 1, is characterized in that: described ring-type copper phosphor tin solder core is annulus round or oblate loop shaped.
5. copper phosphor tin flux coated brazingrod ring according to claim 1, is characterized in that: described coating weight accounts for 0.5% ~ 16.0% of solder ring gross weight; The thickness of coating is 0.05 ~ 0.60 mm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520230580.3U CN204686291U (en) | 2015-04-17 | 2015-04-17 | A kind of copper phosphor tin flux coated brazingrod ring |
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| CN201520230580.3U CN204686291U (en) | 2015-04-17 | 2015-04-17 | A kind of copper phosphor tin flux coated brazingrod ring |
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| CN204686291U true CN204686291U (en) | 2015-10-07 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108436321A (en) * | 2018-02-07 | 2018-08-24 | 郑州机械研究所有限公司 | A kind of included brazing flux type solder ring and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108436321A (en) * | 2018-02-07 | 2018-08-24 | 郑州机械研究所有限公司 | A kind of included brazing flux type solder ring and preparation method thereof |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Fengyang high tech Industrial Development Zone, Henan province Zhengzhou city 450001 Street No. 10 Patentee after: Zhengzhou Machinery Research Institute Co., Ltd. Address before: Fengyang high tech Industrial Development Zone, Henan province Zhengzhou city 450001 Street No. 10 Patentee before: Zhengzhou Research Institute of Mechanical Engineering |
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| CP01 | Change in the name or title of a patent holder |