CN204680900U - A kind of semiconductor laser tube core sintering fixture - Google Patents
A kind of semiconductor laser tube core sintering fixture Download PDFInfo
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- CN204680900U CN204680900U CN201520368289.2U CN201520368289U CN204680900U CN 204680900 U CN204680900 U CN 204680900U CN 201520368289 U CN201520368289 U CN 201520368289U CN 204680900 U CN204680900 U CN 204680900U
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Abstract
A kind of semiconductor laser tube core sintering fixture, comprise base, fixed leg and briquetting, fixed leg is fixed on base, base is at least provided with one group of fixed leg, each group fixed leg is two, two fixed legs of each group arrange a briquetting, and briquetting is provided with two guide holes, is sleeved on two fixed legs by two guide holes.The utility model structure is simple; cost is low, easy and simple to handle, can be placed in nitrogen protection case easily, effectively prevents solder to be oxidized when high temperature sintering; can realize the tube core of noise spectra of semiconductor lasers and the heat sink sintering carrying out rapid batch, production efficiency is high.
Description
Technical field
The utility model relates to a kind of sintering method for semiconductor laser tube core and fixture, belongs to semiconductor laser tube core sintering technology field.
Background technology
Along with the progress of science and technology and the development of society, laser is progressively expanded in the application in each field.Particularly emerging semiconductor laser, have that volume is little, lightweight, electro-optical efficiency is high, the life-span is long and high reliability, progressively instead of traditional gas and the application market of solid state laser, be widely used in the fields such as industrial processes, medical treatment, display, amusement, communication and security.The distinctive volume of tube core due to semiconductor laser is little, power is high, is unfavorable for the heat radiation of tube core.The used heat that during energising, tube core produces needs to discharge in time, otherwise can cause overheated, brings out the inefficacy of laser.Therefore the heat dispersion of semiconductor laser becomes the key factor affecting its life and reliability, need effectively to be evacuated by the heat sink heat production to tube core, this requires that the connection between heat sink and tube core meets the characteristics such as high heat conductance, low resistance, solid and reliable, antifatigue.Thus, semiconductor laser tube core is sintered to heat sink on method be one of key technology of semiconductor laser application.
The agglomerating plants such as the alloying furnace generally adopted at present, are singulated dies is placed on heat sink rear heat-agglomerating, do not apply pressure to tube core.Due to during solder fusing on heat sink, there is certain mobility, tube core can be caused and heat sink between occur sintering cavity, also may cause the skew of die site, make luminous position and direction produce deflection, qualification rate is lower, and can reduce the life and reliability of laser.In addition, have adopt suction nozzle pick up tube core be positioned over heat sink on, carry out the equipment sintered of heating again, adopt suction nozzle to pressurize mode make to sinter a laser tube core at every turn, to be sintered complete and cool after change next group tube core and heat sink sintering again, efficiency is lower, and equipment is comparatively complicated, be unfavorable for, by airtight for sintering environment, solder being easily oxidized.
Chinese patent literature CN101515702 proposes a kind of semiconductor laser tube core sintering device and using method thereof, and first the method moves to empty place away from front apron by sticking up depression bar; With suction spindle by the heat sink front apron place being drawn onto device, suction spindle pulls after removing to dial backward and pulls, be put between stage clip post and front apron by heat sink, with suction spindle, tube core to be sintered is drawn onto heat sink edge under microscopic visualization and puts aligning, after suction spindle is removed, depression bar is stuck up in movement under microscopic visualization, the pressing sticking up depression bar is accurately dropped on the top of tube core; Sintering is completed under vacuum and nitrogen protection.The weak point of the method is once to sinter a laser, is not suitable for batch sinter; And whole device feature is more, the precise part needed for processing and assembling is comparatively difficult, and manufacturing cost is high.
CN103311797A proposes the sintering method of a kind of semiconductor device sintering fixture and semiconductor laser multi-tube core, the method under the microscope with adsorption machine semiconductor laser tube core is placed on solder heat sink on, upwards rise lifting column, move in clamp base by being placed with the heat sink of tube core, under being placed in fixed leg, make fixed leg just to tube core, the spring now on lifting column cylinder is in impaction state; Slowly lifting column being put down, enabling fixed leg just to living tube core; Put down lifting column; spring on lifting column cylinder is to the downward power of lifting column; and drive fixed leg to exert pressure to tube core; by semiconductor laser tube core and be heat sinkly clamped between fixed leg bottom surface and base; live whole fixture with the protective cover clamshell being connected with nitrogen and seal, being then put on heating station and sintering.The weak point of the method is that whole device feature is more, and the fine features that machining needs is comparatively difficult, and manufacturing cost is high.Aborning in heating and cooling process repeatedly, parts easily deform, and cause fixture to use.
Summary of the invention
The utility model, for existing semiconductor laser tube core sintering technology Problems existing, proposes the semiconductor laser tube core sintering fixture that a kind of structure is simple, cost is low, easy and simple to handle, production efficiency is high.
Semiconductor laser tube core sintering fixture of the present utility model, by the following technical solutions:
This fixture, comprises base, fixed leg and briquetting, and fixed leg is fixed on base, base is at least provided with one group of fixed leg, each group fixed leg is two, and two fixed legs of each group arrange a briquetting, briquetting is provided with two guide holes, is sleeved on two fixed legs by two guide holes.
Described base is rectangle, square or circular.
Described base and briquetting adopt magnetic metal material to make, and fixed leg adopts non-magnetic metal material to make.Preferably, base adopts the magnetic stainless steel of tool to make, and briquetting adopts alnico magnet to make, and fixed leg adopts oxygen-free copper to make.
Above-mentioned clamp structure is simple, with low cost, reliably easy and simple to handle.Utilize magnetic briquetting gravity and and base between magnetic attraction, certain pressure is applied to tube core and sinters, can effectively reduce tube core and heat sink between sintering cavity, in the life-span of improving laser device, ensure the quality of product; The existence of magnetic attraction can ensure not easily to be shifted when briquetting presses down and between base, also can keep stablizing motionless after putting down, and promotes the yield of sintering.Briquetting can move up and down, height adjustable, thus can meet the sintering needs of the heat sink and different-thickness tube core of differing heights.
Clamp structure of the present utility model is simple; cost is low, easy and simple to handle, can be placed in nitrogen protection case easily, effectively prevents solder to be oxidized when high temperature sintering; can realize the tube core of noise spectra of semiconductor lasers and the heat sink sintering carrying out rapid batch, production efficiency is high.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model semiconductor laser tube core sintering fixture.
Fig. 2 is the structural representation of briquetting in the utility model fixture.
In figure: 1, base, 2, fixed leg, 3, briquetting, 4, laser tube core and heat sink, 5, guide hole.
Embodiment
As shown in Figure 1, semiconductor laser tube core sintering fixture of the present utility model, comprises base 1, fixed leg 2 and briquetting 3.Base 1 can be cuboid, square, cylinder or other shape, is preferably cuboid.Fixed leg 2 is threaded connection or the mode such as welding is fixed on base 1, fixed leg on base 1 is at least provided with one group, each group is two fixed legs, can place in distance between two fixed legs 2-20 laser tube core and heat sink 4 (under the microscope with adsorption machine semiconductor laser tube core is placed on solder heat sink on, form laser tube core and heat sink 4, heat sinkly refer to encapsulation and the fin that uses of cooling laser organ pipe core), to place 2-5 laser tube core and to be heat sinkly advisable, batch sinter can be carried out like this.Two fixed legs of each group arrange a briquetting 3.As Fig. 2, briquetting 3 is provided with two guide holes 5, is sleeved on two fixed legs by two guide holes.The centre-to-centre spacing of two guide holes 5 is consistent with the centre-to-centre spacing of two fixed legs 2 of one group of fixed leg, the section shape and size of two guide holes 5 is consistent with the section shape and size of fixed leg 2, to ensure that briquetting 3 freely can move up and down on two fixed legs 2, be limited on base 1, pressure sintering is carried out to laser tube core and heat sink 4.If the guide hole 5 on briquetting 3 is circular or square, so fixed leg 2 is also circular or square, and both sizes are suitable, ensures that briquetting 3 moves freely on two fixed legs 2.Perforate on briquetting 3 and fixed leg 2 circular, so that processing and cooperation.
Base 1 and briquetting 3 adopt magnetic metal material to make, wherein base can adopt the materials such as the magnetic cast iron of tool or stainless steel to make, briquetting can adopt the high-temperature magnetic material such as samarium cobalt magnet, alnico magnet to make, fixed leg adopts non-magnetic metal material to make, as stainless steel, copper base or alumina-base material etc.Preferably, base 1 adopts the magnetic stainless steel of tool to make, and briquetting 3 adopts alnico magnet to make, and fixed leg 2 adopts oxygen-free copper to make.
If base 1, fixed leg 2 and briquetting 3 all adopt non-magnetic metal material (as stainless steel, copper base or alumina-base material), in this case, although the gravity of briquetting 3 still can be utilized to carry out pressure sintering to laser tube core and heat sink 4, but briquetting 3 is not owing to having the magnetic attraction with base 1, lay with fetching process in be easily moved, cause tube core and heat sink 4 displacements, sintering contraposition is bad, is also inconvenient to operate.
Polishing is carried out at the bottom contact laser tube core of briquetting 3 and the position of heat sink 4, and the length of contact site can adjust according to the size of tube core to be sintered.During sintering briquetting 3 act on laser tube core and heat sink 4 pressure can by increase briquetting 3 thickness or increase its quantity adjustment.
The process that the utility model semiconductor laser tube core sintering fixture carries out sintering is as described below:
(1) under the microscope with adsorption machine semiconductor laser tube core is placed on solder heat sink on, form laser tube core and heat sink 4, laser tube core and heat sink 4 are arranged between each two fixed leg organizing fixed leg, each group places 2-5 laser tube core and heat sink 4;
(2) on two fixed legs of each group, place a briquetting 3, briquetting 3 moves down by self gravitation and with the magneticaction of base 1, exerts pressure to tube core; The position of fine setting laser thermal sediment and tube core 4, makes briquetting 3 just compress living laser tube core;
(3) seal after the protective cover cap being connected with nitrogen being lived whole fixture, be put on heating station, conventionally sinter.
Claims (4)
1. a semiconductor laser tube core sintering fixture, comprise base, fixed leg and briquetting, it is characterized in that: fixed leg is fixed on base, base is at least provided with one group of fixed leg, each group fixed leg is two, two fixed legs of each group arrange a briquetting, and briquetting is provided with two guide holes, is sleeved on two fixed legs by two guide holes.
2. semiconductor laser tube core sintering fixture according to claim 1, is characterized in that: described base is rectangle, square or circular.
3. semiconductor laser tube core sintering fixture according to claim 1, is characterized in that: described base and briquetting adopt magnetic metal material to make, and fixed leg adopts non-magnetic metal material to make.
4. the semiconductor laser tube core sintering fixture according to claim 1 or 3, it is characterized in that: described base adopts the magnetic stainless steel of tool to make, briquetting adopts alnico magnet to make, and fixed leg adopts oxygen-free copper to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520368289.2U CN204680900U (en) | 2015-06-01 | 2015-06-01 | A kind of semiconductor laser tube core sintering fixture |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520368289.2U CN204680900U (en) | 2015-06-01 | 2015-06-01 | A kind of semiconductor laser tube core sintering fixture |
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| CN204680900U true CN204680900U (en) | 2015-09-30 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104882781A (en) * | 2015-06-01 | 2015-09-02 | 山东华光光电子有限公司 | Semiconductor laser tube core sintering clamp and sintering method thereof |
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2015
- 2015-06-01 CN CN201520368289.2U patent/CN204680900U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104882781A (en) * | 2015-06-01 | 2015-09-02 | 山东华光光电子有限公司 | Semiconductor laser tube core sintering clamp and sintering method thereof |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Tianchen Avenue high tech Zone of Ji'nan City, Shandong Province, No. 1835 250101 Patentee after: SHANDONG HUAGUANG OPTOELECTRONICS CO., LTD. Address before: Tianchen Avenue high tech Zone of Ji'nan City, Shandong Province, No. 1835 250101 Patentee before: Shandong Huaguang Photoelectronic Co., Ltd. |