CN204680690U - 高色彩饱和度的led装置 - Google Patents

高色彩饱和度的led装置 Download PDF

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Publication number
CN204680690U
CN204680690U CN201520431789.6U CN201520431789U CN204680690U CN 204680690 U CN204680690 U CN 204680690U CN 201520431789 U CN201520431789 U CN 201520431789U CN 204680690 U CN204680690 U CN 204680690U
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China
Prior art keywords
high color
color saturation
led matrix
tool high
line
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Expired - Fee Related
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CN201520431789.6U
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English (en)
Inventor
吕兆宇
刘睿凯
刘家齐
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Xinmao Technology (shenzhen) Co Ltd
Zhongshan Liqi Lighting Co Ltd
LUSTROUS INTERNATIONAL Tech Ltd
Original Assignee
Xinmao Technology (shenzhen) Co Ltd
Zhongshan Liqi Lighting Co Ltd
LUSTROUS INTERNATIONAL Tech Ltd
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Application filed by Xinmao Technology (shenzhen) Co Ltd, Zhongshan Liqi Lighting Co Ltd, LUSTROUS INTERNATIONAL Tech Ltd filed Critical Xinmao Technology (shenzhen) Co Ltd
Priority to CN201520431789.6U priority Critical patent/CN204680690U/zh
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

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Abstract

本实用新型是一种具高色彩饱和度的LED装置,其具有:一基板;多个LED芯片及多条连接导线,位于该基板的一表面上;一复合荧光胶层,其包覆所述多个LED芯片及所述多条连接导线;以及一透明盖体,其包覆该复合荧光胶层;其中,该复合荧光胶层系和所述多个LED芯片搭配以产生一非白光。

Description

高色彩饱和度的LED装置
技术领域
本实用新型有关于LED(alternating current light emitting diode;交流型发光二极管)装置,特别是关于一种具高色彩饱和度的LED装置。
背景技术
一般的LED照明装置,不管是以AC电源或DC电源供电,其常见的色光为暖白光或冷白光。
当有非白光需求时,例如装潢或广告需求,一般的做法是外加一彩色灯罩或一滤光件。然而,此作法会增加成本,且亦无法提供具高色彩饱和度的非白光。另外,当用在水中以提供情境照明时,现有的LED照明装置亦有容易发生短路的问题。
为解决前述的问题,人们亟需一新颖的LED装置。
实用新型内容
本实用新型的一目的在于揭露一种具高色彩饱和度的LED装置,其可通过调配一复合荧光胶层的荧光粉组成提供各种具高色彩饱和度的非白光以满足装潢或广告需求。
本实用新型的另一目的在于揭露一种具高色彩饱和度的LED装置,其可满足水中情境照明需求。
为达前述目的,本实用新型提出的一种具高色彩饱和度的LED装置,其具有:
一基板;
多个LED芯片及多条连接导线,位于该基板的一表面上;
一复合荧光胶层,其包覆所述多个LED芯片及所述多条连接导线;以及
一透明盖体,其包覆该复合荧光胶层;
其中,该复合荧光胶层系和所述多个LED芯片搭配以产生一非白光。
在一实施例中,该基板是一铝基板。
在一实施例中,所述多条连接导线由金属制成。
在一实施例中,所述的复合荧光胶层包含多种荧光粉和一种树脂。
在一实施例中,该透明盖体包含一种透明树脂。
在一实施例中,该透明盖体呈一圆顶状。
依上述的技术方案,本实用新型乃可提供以下功效:
1、本实用新型的具高色彩饱和度的LED装置可通过调配一复合荧光胶层的荧光粉组成提供各种具高色彩饱和度的非白光以满足装潢或广告需求。
2、本实用新型的具高色彩饱和度的LED装置可提供防水效果以满足水中情境照明需求。
附图说明
图1为本实用新型具高色彩饱和度的LED装置其一实施例的剖面示意图。
图2为本实用新型具高色彩饱和度的LED装置其一实施例的外观示意图。
具体实施方式
为能进一步了解本发明的结构、特征及其目的,兹附以图式及较佳具体实施例的详细说明如后。
请参照图1,其为本实用新型具高色彩饱和度的LED装置其一实施例的剖面示意图。如图1所示,该具高色彩饱和度的LED装置具有一基板100、多个LED芯片110、多条连接导线120、一复合荧光胶层130、以及一透明盖体140。
基板100可为一铝基板以提供散热功能。
多个LED芯片110及多条连接导线120位于该基板100的一表面上,其中LED芯片110的色光可为蓝光、绿光、黄光、或红光,而连接导线120可由金属制成一例如金线。
复合荧光胶层130用以包覆所述多个LED芯片110及所述多条连接导线120,且其可和所述多个LED芯片搭配而产生一非白光(其可为由红光至紫光间的任一种色光)。复合荧光胶层130是通过以一比例选用多种荧光粉(荧光粉的颜色可为红、绿、橘、蓝、或黄等)再和一种树脂均匀混合而形成,以使其在光激致发光(photoluminescence;PL)过程激发出的色光可和LED芯片110的色光混出一具有高色彩饱和度的非白光。
透明盖体140用以包覆该复合荧光胶层130,可由一种透明树脂构成,且其可呈一圆顶状。
请参照图2,其为本实用新型具高色彩饱和度的LED装置其一实施例的外观示意图。如图2所示,该具高色彩饱和度的LED装置的透明盖体140是以一圆顶状覆盖在基板100上方。
本案所揭示者,乃较佳实施例,举凡局部的变更或修饰而源于本案的技术思想而为熟悉该项技艺的人所易于推知者-例如将透明盖体140的形状改为方形,俱不脱本案的专利权范畴。

Claims (6)

1.一种具高色彩饱和度的LED装置,其特征在于具有:
一基板;
多个LED芯片及多条连接导线,位于该基板的一表面上;
一复合荧光胶层,其包覆所述多个LED芯片及所述多条连接导线;以及
一透明盖体,其包覆该复合荧光胶层;
其中,该复合荧光胶层和所述多个LED芯片搭配以产生一非白光。
2.如权利要求1所述的具高色彩饱和度的LED装置,其特征在于,该基板是一铝基板。
3.如权利要求1所述的具高色彩饱和度的LED装置,其特征在于,所述多条连接导线由金属制成。
4.如权利要求1所述的具高色彩饱和度的LED装置,其特征在于,所述的复合荧光胶层包含多种荧光粉和一种树脂。
5.如权利要求1所述的具高色彩饱和度的LED装置,其特征在于,该透明盖体包含一种透明树脂。
6.如权利要求1所述的具高色彩饱和度的LED装置,其特征在于,该透明盖体呈一圆顶状。
CN201520431789.6U 2015-06-23 2015-06-23 高色彩饱和度的led装置 Expired - Fee Related CN204680690U (zh)

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