CN204680043U - The tower probe installing structure writing chip apparatus of a kind of smart card - Google Patents
The tower probe installing structure writing chip apparatus of a kind of smart card Download PDFInfo
- Publication number
- CN204680043U CN204680043U CN201520321980.5U CN201520321980U CN204680043U CN 204680043 U CN204680043 U CN 204680043U CN 201520321980 U CN201520321980 U CN 201520321980U CN 204680043 U CN204680043 U CN 204680043U
- Authority
- CN
- China
- Prior art keywords
- probe
- mount pad
- supporting base
- deck
- smart card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The utility model discloses the tower probe installing structure writing chip apparatus of a kind of smart card, comprise probe mount pad, described probe is arranged on probe mount pad; Also comprise and be located at mounting hole on deck and supporting base, wherein, described mounting hole runs through the both sides up and down of deck; Described supporting base be fixed in the upside of deck with mounting hole corresponding position; Described probe mount pad is arranged in mounting hole, and is connected with supporting base by linear slide mechanism.Probe installing structure compact conformation of the present utility model, take full advantage of the inner space of deck itself and supporting base, the adjacent distance write between chip unit is reduced, under the prerequisite that tower height limits, more chip unit can be set, increase work efficiency.
Description
Technical field
The utility model relates to the production equipment of smart card, is specifically related to the tower probe installing structure writing chip apparatus of a kind of smart card.
Background technology
In smart card production run, need to chip write relevant information (being referred to as to write chip) in card.Write chip apparatus mainly to comprise rotating disc type and write chip apparatus and towerly write chip apparatus, wherein, tower chip apparatus of writing linearly arranges multiplely to write chip unit, during work, these are write chip unit and move along rectilinear direction batch (-type), by card transport, card feeding is wherein carried out writing chip manufacture, and the card release writing chip will be completed.
The work writing chip is completed by card reader.In contact card reader, be provided with probe and circuit board, probe when writing chip on this probe contacts with chip, carries out data transmission.Described probe is arranged on probe mount pad, by lifting mechanism of popping one's head in, probe mount pad is lifted or is put down, realize the contact of probe and chip or unclamp during work.Write in chip apparatus tower, each writing in chip unit is provided with one for installing the deck of card reader, and described probe mount pad is arranged on deck, deck is also provided with the draw-in groove for crossing card.In prior art, such as, Authorization Notice No. is in " a kind of intelligence writes the probe lifting mechanism of chip apparatus " disclosed in the utility model of CN 204028966 U, probe mount pad is arranged on the downside of deck, because probe mount pad needs to move up and down and realize lifting and putting down of probe during work, therefore require the distance between deck downside and the draw-in groove below it to meet to pop one's head in the stroke needs of mount pad; In addition, when writing chip, the below of card also needs to arrange cushion block, for supporting card, to bear the pressure of probe to card; Therefore adjacent two gap widths write between chip unit must can meet the requirement arranging described probe mount pad, draw-in groove and cushion block, cause the distance write between chip unit excessive, structure is compact not, and under the prerequisite that tower height limits, the quantity writing chip unit is few.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, and provide a kind of smart card the tower probe installing structure writing chip apparatus, this probe installing structure can reduce the distance write between chip unit, makes structure compacter.
The purpose of this utility model is realized by following technical scheme:
The tower probe installing structure writing chip apparatus of smart card, comprises probe mount pad, and described probe is arranged on probe mount pad, and probe mount pad is arranged on deck; It is characterized in that, also comprise and be located at mounting hole on deck and supporting base, wherein, described mounting hole runs through the both sides up and down of deck; Described supporting base be fixed in the upside of deck with mounting hole corresponding position; Described probe mount pad is arranged in mounting hole, and is connected with supporting base by linear slide mechanism.
A preferred version of the present utility model, wherein, described supporting base comprises two to the side plate of downward-extension and the top board at top being connected to two side plates, and described two side plates are fixedly connected on deck, and described probe mount pad is connected on described top board by linear slide mechanism.
The object of above-mentioned preferred version is adopted to be, by arranging two side plates, make, between the end face of top board and deck upper surface, there is certain distance, not only can provide support for the card writing chip unit being positioned at the top of this deck, and also there is vertical direction spatial for holding probe mount pad in this supporting base, thus utilize the space occupied by supporting base fully, make structure compact as far as possible.
A preferred version of the present utility model, wherein, in the top board of described supporting base, is provided with emptiness avoiding hole in the probe corresponding position writing chip unit with the side of being located thereon.Its role is to, when writing chip apparatus and being in off working state, each probe write in chip unit is in releasing orientation, owing to being provided with described emptiness avoiding hole, these probes just can extend in described emptiness avoiding hole, thus the top board avoiding probe to be directly pressed on supporting base causes tissue damage.
A preferred version of the present utility model, wherein, described linear slide mechanism comprises the guide rod be arranged on the top board of supporting base and the guide pin bushing be arranged on probe mount pad, and described guide rod is formed through described guide pin bushing and is slidably matched.By cooperatively interacting of above-mentioned guide rod and guide pin bushing, realize the guiding of probe mount pad when lifting or put down, then coordinate probe lifting mechanism, realize lifting and putting down of probe.
A preferred version of the present utility model, wherein, is provided with spring between described probe mount pad and the top board of supporting base, and one end of this spring extend into be located at and pops one's head in the blind hole of mount pad, and the other end extend in the blind hole of the top board being located at supporting base.By arranging described spring, when probe puts down, probe is impelled to be pressed on chip.
A preferred version of the present utility model, described linear slide mechanism is two, is separately positioned on two diagonal angles of probe mount pad, makes guiding better accurately, stable.
A preferred version of the present utility model, wherein, the both sides of described deck are provided with two extension boards to downward-extension, and this extension board is provided with draw-in groove.
Principle of work of the present utility model is: by arranging the mounting hole running through the both sides up and down of deck on deck, and in the upside of deck, supporting base is set with mounting hole corresponding position, on the one hand, described supporting base can support the card writing chip unit being arranged in top, on the other hand, probe mount pad can pass through mounting hole and be set in supporting base, thus the space taken full advantage of in the space (i.e. mounting hole) of deck short transverse and the short transverse occupied by supporting base, thus shorten adjacent two distances write between chip unit, make compact conformation.
Describe from principle of work above, the utility model compared with prior art has following beneficial effect:
1, compact conformation, takes full advantage of the inner space of deck itself and supporting base, and the adjacent distance write between chip unit is reduced, and under the prerequisite that tower height limits, can arrange and more write chip unit, increase work efficiency.
2, structure is more simple, and assembling is more prone to; And write chip unit by supporting base by adjacent two and be closely linked, simplify the structure.
Accompanying drawing explanation
Fig. 1 is the tower structural representation writing an embodiment of the probe installing structure of chip apparatus of smart card of the present utility model.
Fig. 2 is the explosive view of Fig. 1 illustrated embodiment.
Fig. 3 is that Fig. 1 illustrated embodiment is applied to the tower structural representation write on chip apparatus.
Embodiment
Below in conjunction with embodiment and accompanying drawing, the utility model is described in further detail, but embodiment of the present utility model is not limited thereto.
See Fig. 1 ~ Fig. 3, the tower probe installing structure writing chip apparatus of smart card of the present utility model comprises probe mount pad 4, and described probe 5 is arranged on probe mount pad 4, and probe mount pad 4 is arranged on deck 2.In addition, also comprise and be located at mounting hole 2-1 on deck 2 and supporting base 3, wherein, described mounting hole 2-1 runs through the both sides up and down of deck 2; Described supporting base 3 be fixed in the upside of deck 2 with mounting hole 2-1 corresponding position; Described probe mount pad 4 is arranged in mounting hole 2-1, and is connected with supporting base 3 by linear slide mechanism.The both sides of described deck 2 are provided with two extension board 2-2 to downward-extension, and this extension board 2-2 is provided with draw-in groove 2-3.
See Fig. 1 ~ Fig. 3, described supporting base 3 comprises two to the side plate 3-1 of downward-extension and the top board 3-2 at top being connected to two side plate 3-1, described two side plate 3-1 are fixedly connected on deck 2, and described probe mount pad 4 is connected on described top board 3-2 by linear slide mechanism.By arranging two side plate 3-1, make, between the end face of top board 3-2 and deck 2 upper surface, there is certain distance, not only can provide support for the card 1 writing chip unit 8 being positioned at the top of this deck 2, and also there is vertical direction spatial for holding probe mount pad 4 in this supporting base 3, thus utilize the space occupied by supporting base 3 fully, make structure compact as far as possible.
See Fig. 1 ~ Fig. 3, in the top board 3-2 of described supporting base 3, be provided with emptiness avoiding hole 3-3 in the probe 5-1 corresponding position writing chip unit 8 with the side of being located thereon.Its role is to, when writing chip apparatus and being in off working state, each probe 5-1 write in chip unit 8 is in releasing orientation, owing to being provided with described emptiness avoiding hole 3-3, these probes 5-1 just can extend in described emptiness avoiding hole 3-3, thus avoid probe 5-1 to be directly pressed on the top board 3-2 of supporting base 3, cause probe 5-1 to damage.
See Fig. 1 ~ Fig. 3, described linear slide mechanism comprises the guide rod 7 be arranged on the top board 3-2 of supporting base 3 and the guide pin bushing 6 be arranged on probe mount pad 4, and described guide rod 7 is formed through described guide pin bushing 6 and is slidably matched.By cooperatively interacting of above-mentioned guide rod 7 and guide pin bushing 6, realize the guiding of probe mount pad 4 when lifting or put down, then coordinate probe lifting mechanism, realize lifting and putting down of probe 5-1.Described linear slide mechanism is two, is separately positioned on two diagonal angles of probe mount pad 4, makes guiding better accurately, stable.Be provided with spring between described probe mount pad 4 and the top board 3-2 of supporting base 3, one end of this spring extend into be located at and pops one's head in the blind hole of mount pad 4, and the other end extend in the blind hole of the top board 3-2 being located at supporting base 3.By arranging described spring, when probe 5 puts down, probe 5-1 is impelled to be pressed on chip.
See Fig. 1 ~ Fig. 3, principle of work of the present utility model is: by arranging the mounting hole 2-1 running through the both sides up and down of deck 2 on deck 2, and in the upside of deck 2, supporting base 3 is set with mounting hole 2-1 corresponding position, on the one hand, described supporting base 3 can support the card 1 writing chip unit 8 being arranged in top, on the other hand, probe mount pad 4 can pass through mounting hole 2-1 and be set in supporting base 3, thus the space taken full advantage of in the space (i.e. mounting hole 2-1) of deck 2 short transverse and the short transverse occupied by supporting base 3, thus shorten adjacent two distances write between chip unit 8, make compact conformation.
Above-mentioned is the utility model preferably embodiment; but embodiment of the present utility model is not by the restriction of foregoing; change, the modification done under other any does not deviate from Spirit Essence of the present utility model and principle, substitute, combine, simplify; all should be the substitute mode of equivalence, be included within protection domain of the present utility model.
Claims (7)
1. the tower probe installing structure writing chip apparatus of smart card, comprises probe mount pad, and described probe is arranged on probe mount pad, and probe mount pad is arranged on deck; It is characterized in that, also comprise and be located at mounting hole on deck and supporting base, wherein, described mounting hole runs through the both sides up and down of deck; Described supporting base be fixed in the upside of deck with mounting hole corresponding position; Described probe mount pad is arranged in mounting hole, and is connected with supporting base by linear slide mechanism.
2. the tower probe installing structure writing chip apparatus of smart card according to claim 1, it is characterized in that, described supporting base comprises two to the side plate of downward-extension and the top board at top being connected to two side plates, described two side plates are fixedly connected on deck, and described probe mount pad is connected on described top board by linear slide mechanism.
3. the tower probe installing structure writing chip apparatus of smart card according to claim 2, is characterized in that, in the top board of described supporting base, is provided with emptiness avoiding hole in the probe corresponding position writing chip unit with the side of being located thereon.
4. the tower probe installing structure writing chip apparatus of the smart card according to Claims 2 or 3, it is characterized in that, described linear slide mechanism comprises the guide rod be arranged on the top board of supporting base and the guide pin bushing be arranged on probe mount pad, and described guide rod is formed through described guide pin bushing and is slidably matched.
5. the tower probe installing structure writing chip apparatus of smart card according to claim 4, it is characterized in that, spring is provided with between described probe mount pad and the top board of supporting base, one end of this spring extend into be located at and pops one's head in the blind hole of mount pad, and the other end extend in the blind hole of the top board being located at supporting base.
6. the tower probe installing structure writing chip apparatus of smart card according to claim 4, is characterized in that, described linear slide mechanism is two, is separately positioned on two diagonal angles of probe mount pad.
7. the tower probe installing structure writing chip apparatus of smart card according to claim 1, is characterized in that, the both sides of described deck are provided with two extension boards to downward-extension, and this extension board is provided with draw-in groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520321980.5U CN204680043U (en) | 2015-05-16 | 2015-05-16 | The tower probe installing structure writing chip apparatus of a kind of smart card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520321980.5U CN204680043U (en) | 2015-05-16 | 2015-05-16 | The tower probe installing structure writing chip apparatus of a kind of smart card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204680043U true CN204680043U (en) | 2015-09-30 |
Family
ID=54179718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520321980.5U Expired - Fee Related CN204680043U (en) | 2015-05-16 | 2015-05-16 | The tower probe installing structure writing chip apparatus of a kind of smart card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204680043U (en) |
-
2015
- 2015-05-16 CN CN201520321980.5U patent/CN204680043U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 510520 Guangdong city of Guangzhou province Tianhe District Guangshan Road No. 500 building (Building 3) tissue culture Patentee after: GUANGZHOU MINGSEN MECH.&ELEC. EQUIPMENT CO., LTD. Address before: 510640 Guangdong Province, Guangzhou Tianhe District, No. 87 ban 1 floor, 2 floor Patentee before: Guangzhou Mingsen Mech. & Elec. Equipment Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150930 Termination date: 20200516 |