CN204673176U - A kind of intelligent card chip welder - Google Patents
A kind of intelligent card chip welder Download PDFInfo
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- CN204673176U CN204673176U CN201520321890.6U CN201520321890U CN204673176U CN 204673176 U CN204673176 U CN 204673176U CN 201520321890 U CN201520321890 U CN 201520321890U CN 204673176 U CN204673176 U CN 204673176U
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- 230000007246 mechanism Effects 0.000 claims abstract description 123
- 238000003466 welding Methods 0.000 claims abstract description 34
- 230000033001 locomotion Effects 0.000 claims abstract description 15
- 230000008878 coupling Effects 0.000 claims abstract description 13
- 238000010168 coupling process Methods 0.000 claims abstract description 13
- 238000005859 coupling reaction Methods 0.000 claims abstract description 13
- 230000009471 action Effects 0.000 claims abstract description 11
- 238000005476 soldering Methods 0.000 claims description 28
- 230000003139 buffering effect Effects 0.000 claims description 20
- 230000008859 change Effects 0.000 claims description 6
- 230000001360 synchronised effect Effects 0.000 claims description 5
- 239000011159 matrix material Substances 0.000 claims description 3
- 230000002452 interceptive effect Effects 0.000 abstract description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 30
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
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- 230000001105 regulatory effect Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 210000004243 sweat Anatomy 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
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- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
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Abstract
The utility model discloses a kind of intelligent card chip welder, comprise weld assembly and drive weld assembly to perform the driving mechanism of welding action, described driving mechanism comprises drive motors, slide block, the lead-screw drive mechanism of driving slide block movement and the coupling assembling of connection sliding block and weld assembly, wherein, described drive motors and slide block are arranged on the frame for chip Handling device, described frame is provided with the chute extended along X-direction, and described slide block is arranged in this chute; Leading screw one end in described lead-screw drive mechanism is through described slide block, and the other end is connected with drive motors by power drive mechanism.Intelligent card chip welder of the present utility model can be avoided interfering with chip belt conveying mechanism, and make the design of chip belt conveying mechanism, installment and debugging convenient, equipment volume is less compacter.
Description
Technical field
The utility model relates to smart card manufacturing equipment, is specifically related to a kind of intelligent card chip welder.
Background technology
In the production process of double-interface smart card, need by chips welding on the antenna of card, then by chip package in card.The welding job completing chip mainly comprises following several actions: 1, utilize chip cutting means that the chip stamping-out be arranged on chip belt is become chip one by one, blanking movement carries out in blanking die; 2, utilize chip handling device to be picked up by the chip cut, and adjust the attitude of chip, move to welding post place; 3, utilize card transport that card to be welded is transported to welding post; 4, welder is utilized to be welded together by the antenna be positioned on the chip at welding post place and card.
In prior art, chip cutting means and chip handling device are arranged on the side of card transport, welder is arranged on the opposite side of card transport, is provided with chip belt conveying mechanism in the below of welding post, and the throughput direction of this chip belt conveying mechanism is perpendicular to card throughput direction.Because welder is arranged on by card transport side, in order to not interfere, mutually must avoid between this welder and chip belt conveying mechanism, cause design, installment and debugging difficulty greatly, increasing device volume.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, a kind of intelligent card chip welder is provided, this intelligent card chip welder can be avoided interfering with chip belt conveying mechanism, make the design of chip belt conveying mechanism, installment and debugging convenient, equipment volume is less, compacter.
The purpose of this utility model is realized by following technical scheme:
A kind of intelligent card chip welder, comprise weld assembly and drive weld assembly to perform the driving mechanism of welding action, it is characterized in that: described driving mechanism comprises drive motors, slide block, the lead-screw drive mechanism of driving slide block movement and the coupling assembling of connection sliding block and weld assembly, wherein, described drive motors and slide block are arranged on the frame for chip Handling device, described frame is provided with the chute extended along X-direction, and described slide block is arranged in this chute; Leading screw one end in described lead-screw drive mechanism is through described slide block, and the other end is connected with drive motors by power drive mechanism.
A preferred version of the present utility model, wherein, described coupling assembling comprises vertical adjustment mechanism, this vertical adjustment mechanism is made up of vertical slide mechanism and threaded adjusting mechanism, and described vertical slide mechanism comprises the vertical guide be connected with slide block and the vertical sliding part be connected in vertical guide; The adjusting screw(rod) that described threaded adjusting mechanism comprises the upper adjusting seat be located in vertical guide, is located at the lower adjusting seat on vertical sliding part and is connected on upper adjusting seat and lower adjusting seat, is threaded connection anatomical connectivity between described adjusting screw(rod) and lower adjusting seat.
By arranging above-mentioned vertical adjustment mechanism, the vertical position of soldering tip in weld assembly can be regulated, thus as required soldering tip can be adjusted to the correct position of vertical direction.The principle regulated is: by rotating adjusting screw(rod), thus drive vertical sliding part to slide in vertical guide, and move to suitable position.
A preferred version of the present utility model, wherein, described coupling assembling also comprises elastic buffering mechanism, this elastic buffering mechanism comprises the upper mount pad be connected on vertical sliding part, arrange lower mount pad below mount pad, be connected to X between mount pad and lower mount pad to slide mechanism and the elastic buffering mechanism that is located between upper mount pad and lower mount pad, wherein, described X comprises to slide mechanism and is arranged on X bottom upper mount pad to slide rail be fixed on the X at lower mount pad top to slide, and described X is connected to slide rail to slide with X; Described elastic buffering mechanism comprises the buffer bar be connected on lower mount pad, and this buffer bar is from bottom to top through the cushion hole be located on upper mount pad; Locating part and buffer spring is provided with in described upper mount pad, this locating part and buffer spring are arranged on the both sides of buffer bar along X-direction, wherein, described locating part is positioned at the side near soldering tip, buffer spring is positioned at opposite side, and the end of described locating part and buffer spring to extend in cushion hole and acts on buffer bar.
The object arranging above-mentioned elastic buffering mechanism to be when performing welding action as weld assembly provides buffering: during welding, driving mechanism drives soldering tip in weld assembly along X-direction towards antenna to be welded and chip motion, and scolding tin antenna being pressed on chip realizes welding, when soldering tip Contact antenna and scolding tin, there is certain impulsive force, adopt above-mentioned elastic buffering mechanism that soldering tip can be avoided to produce excessive impact to antenna and chip, prevent antenna to be pressed down.The operation principle of this elastic buffering mechanism is: under normality, and buffer bar is pushed against on locating part by described buffer spring, and the weld assembly be now connected on lower mount pad is positioned at X-direction foremost; Perform in welding course of action, when soldering tip Contact antenna and chip and when producing impulsive force backward to lower mount pad, described buffer spring just plays cushioning effect, make mount pad and lower mount pad produce X at X to slide mechanism place and move to current buffer.
Preferably, be provided with in described upper mount pad two be oppositely arranged and the installing hole be communicated with cushion hole, described locating part and buffer spring arrange in one of them installing hole respectively; Described locating part is screw, and this screw is threaded with installing hole; The outer end of the installing hole corresponding with buffer spring is provided with closeouts.Adopt screw formation locating part can regulate the position of locating part, described closeouts is set for carrying out spacing to buffer spring.
A preferred version of the present utility model, wherein, described coupling assembling also comprises Y-axis micro-adjusting mechanism, this Y-axis micro-adjusting mechanism comprises bottom mount pad, is arranged on the Y-direction slide mechanism between lower mount pad and bottom mount pad and finely tunes actuating unit, wherein, described bottom mount pad is located at the below of lower mount pad; Described Y-direction slide mechanism comprises the Y-direction slideway arranged bottom lower mount pad and the Y-direction sliding part being fixed on mount pad top, bottom, and described Y-direction sliding part is connected with Y-direction slideway; Described fine setting actuating unit comprises fine adjustment shaft, is located at the eccentric shaft of fine adjustment shaft lower end and is located at the fine setting hole in Y-direction sliding part, and described fine adjustment shaft vertically passes through lower mount pad, and is connected with lower mount pad by rotation connection structure; Described eccentric shaft coupling is in described fine setting hole; Described weld assembly is arranged on the mount pad of bottom.
Adopt the effect of above-mentioned Y-axis micro-adjusting mechanism to be that the fine setting of Y direction is carried out in the position of butt welding connected components, make soldering tip aim at antenna in Y direction.The operation principle of this Y-axis micro-adjusting mechanism is: drive eccentric shaft turns by rotating fine adjustment shaft, thus moves Y-direction slideway and bottom mount pad moves along Y-axis by finely tuning pore area, realizes the adjustment to weld assembly Y-direction position.
Preferably, described fine adjustment shaft is made up of described buffer bar, makes same parts have two functions, is conducive to simplifying structure; Described rotation connection structure comprises the shaft shoulder be located on fine adjustment shaft and the limit base being fixed on lower mount pad top; Described fine adjustment shaft passes from limit base, and be provided with the spacing hole matched with the described shaft shoulder in limit base, the described shaft shoulder is limited in spacing hole, and the lower end of the shaft shoulder is fitted on the end face of lower mount pad.Guarantee that fine adjustment shaft can freely rotate by above-mentioned rotation connection structure, with the axially-movable of limit fine adjustment shaft.
A preferred version of the present utility model, wherein, described Y-axis micro-adjusting mechanism is two, and each Y-axis micro-adjusting mechanism connects a weld assembly.Arrange two weld assemblies can weld two strip antennas on card simultaneously, improve welding efficiency; By the Y-direction distance of soldering tip in two adjustable two weld assemblies of Y-axis micro-adjusting mechanism, to adapt to the different distance between two strip antennas on card.
A preferred version of the present utility model, wherein, the soldering tip in described weld assembly comprises soldering tip matrix and weld part, and wherein, described weld part comprises weld part and lower weld part, is provided with the groove caved inward between described upper weld part and lower weld part; The end of described upper weld part extends out to the end exceeding lower weld part.
Adopt the effect of the soldering tip of said structure to be: upper weld part first Contact antenna top in welding process, and push against in antenna top insertion scolding tin, the heat now gone up on weld part passes to scolding tin rapidly, makes the rapid melting of scolding tin; Descend weld part ability Contact antenna bottom subsequently and be pushed down in sky in the scolding tin of melting, weld part is very little to the impulsive force of the bottom of antenna at present for this, can not cause damage to the bottom of antenna, the bottom of antenna be there will not be and fracture, ensure that welding quality.Further, first contact scolding tin due to upper weld part during welding and stretch in scolding tin, therefore, it is possible to allow the rapid melting of scolding tin, improve welding efficiency, and there will not be fried tin, avoiding producing tin sweat(ing), improve welding quality.
A preferred version of the present utility model, wherein, the end of described upper weld part is arc-shaped, the damage to antenna when compressing antenna to alleviate; The gradual change type structure that the end of described upper weld part is large in middle little, upper and lower two, being convenient to weld part like this when being pressed on scolding tin by antenna, reducing resistance, weld part on this can be rapidly inserted in scolding tin, thus allows the rapid melting of scolding tin; In addition, gradual change type structure also makes weld part can not cause great impact in the process inserting scolding tin.
A preferred version of the present utility model, wherein, described power drive mechanism and drive motors be arranged on be located at chute end installing plate on, described power drive mechanism is synchronous belt drive mechanism.By described synchronous belt drive mechanism, by the power transmission of drive motors to the leading screw in lead-screw drive mechanism, thus drive skid.
Operation principle of the present utility model is: the frame for chip Handling device is arranged on the top of card transport, the drive motors be positioned in this frame drives slide block to do the movement of X-direction by power drive mechanism and lead-screw drive mechanism, thus drive weld assembly to do the motion of X-direction, weld assembly is close in the motion of X-direction or leaves the motion of antenna to be welded and chip, thus realizes the control to the welding action of weld assembly.
The utility model compared with prior art has following beneficial effect:
1, because welder of the present utility model is located at the frame for chip Handling device, and this frame is arranged on the top of card transport, therefore described welder is also positioned at the top of card transport, do not occupy the position of card transport side, thus can not interfere with chip belt conveying mechanism, make the design of chip belt conveying mechanism, installment and debugging convenient, equipment volume is less, compacter.
The X-axis slide block of the X-axis travel mechanism 2, in described slide block and chip handling device is arranged in same chute, make described chute both for leading to the X-axis slide block in chip handling device, also for leading to the slide block of this welder, make full use of the design feature of chute, make chip handling device and welder interrelated non-interference again, overall structure is compacter.
Accompanying drawing explanation
Fig. 1 ~ Fig. 5 is the structural representation of a detailed description of the invention of intelligent card chip welder of the present utility model, and wherein, Fig. 1 is front view, and Fig. 2 is top view, and Fig. 3 is left view, Fig. 4 and Fig. 5 is stereogram.
Fig. 6 is the A-A sectional view of Fig. 3.
Fig. 7 is the upward view (saving weld assembly) of Fig. 6.
Fig. 8 ~ Figure 10 is a concrete structure schematic diagram of soldering tip of the present utility model, and wherein, Fig. 8 is front view, and Fig. 9 is top view, and Figure 10 is stereogram.
Figure 11 is the using state figure that intelligent card chip welder of the present utility model and chip handling device, card transport and chip belt conveying mechanism are combined.
Detailed description of the invention
Below in conjunction with embodiment and accompanying drawing, the utility model is described in further detail, but embodiment of the present utility model is not limited thereto.
See Fig. 1 ~ Fig. 7, intelligent card chip welder of the present utility model comprises weld assembly 18 and drives weld assembly 18 to perform the driving mechanism of welding action.Described driving mechanism comprises drive motors 2, slide block 3, drives the lead-screw drive mechanism of slide block 3 movement and the coupling assembling of connection sliding block 3 and weld assembly 18, wherein, described drive motors 2 and slide block 3 are arranged on the frame 1 for chip Handling device, described frame 1 is provided with the chute 1-1 extended along X-direction, and described slide block 3 is arranged in this chute 1-1; Leading screw 4 one end in described lead-screw drive mechanism is through described slide block 3, and the other end is connected with drive motors 2 by power drive mechanism.Described X-axis is the trunnion axis perpendicular to card throughput direction, described weld assembly 18 along this direction close to antenna to be welded and chip.
See Fig. 1 ~ Fig. 5, described coupling assembling comprises vertical adjustment mechanism, elastic buffering mechanism and Y-axis micro-adjusting mechanism.Described Y-axis is the trunnion axis being parallel to card throughput direction.
See Fig. 1 ~ Fig. 5, described vertical adjustment mechanism is made up of vertical slide mechanism and threaded adjusting mechanism, and described vertical slide mechanism comprises the vertical guide 7 be connected with slide block 3 and the vertical sliding part 8 be connected in vertical guide 7; The adjusting screw(rod) 10 that described threaded adjusting mechanism comprises the upper adjusting seat 9 be located in vertical guide 7, is located at the lower adjusting seat 11 on vertical sliding part 8 and is connected on upper adjusting seat 9 and lower adjusting seat 11, is threaded connection anatomical connectivity between described adjusting screw(rod) 10 and lower adjusting seat 11.By arranging above-mentioned vertical adjustment mechanism, the vertical position of soldering tip 19 in weld assembly 18 can be regulated, thus as required soldering tip 19 can be adjusted to the correct position of vertical direction.The principle regulated is: by rotating adjusting screw(rod) 10, thus drive vertical sliding part 8 to slide in vertical guide 7, and move to suitable position.
See Fig. 1 ~ Fig. 7, described elastic buffering mechanism comprises the upper mount pad 12 be connected on vertical sliding part 8, arrange lower mount pad 13 below mount pad 12, be connected to X between mount pad 12 and lower mount pad 13 to slide mechanism and the elastic buffering mechanism that is located between upper mount pad 12 and lower mount pad 13, wherein, described X comprises to slide mechanism and is arranged on X bottom upper mount pad 12 to slide rail 15 be fixed on the X at lower mount pad 13 top to slide 20, and described X is connected to slide rail 15 to slide 20 with X; Described elastic buffering mechanism comprises the buffer bar 15 be connected on lower mount pad 13, and this buffer bar 15 is from bottom to top through the cushion hole 12-1 be located on upper mount pad 12; Locating part 22 and buffer spring 21 is provided with in described upper mount pad 12, this locating part 22 and buffer spring 21 are arranged on the both sides of buffer bar 15 along X-direction, wherein, described locating part 22 is positioned at the side near soldering tip 19, buffer spring 21 is positioned at opposite side, and the end of described locating part 22 and buffer spring 21 to extend in cushion hole 12-1 and acts on buffer bar 15.
The object arranging above-mentioned elastic buffering mechanism to be when performing welding action as weld assembly 18 provides buffering: during welding, driving mechanism drives soldering tip 19 in weld assembly 18 along X-direction towards antenna to be welded and chip motion, and scolding tin antenna being pressed on chip realizes welding, when soldering tip 19 Contact antenna and scolding tin, there is certain impulsive force, adopt above-mentioned elastic buffering mechanism that soldering tip 19 pairs of antennas and chip can be avoided to produce excessive impact, prevent antenna to be pressed down.The operation principle of this elastic buffering mechanism is: under normality, and buffer bar 15 is pushed against on locating part 22 by described buffer spring 21, and the weld assembly 18 be now connected on lower mount pad 13 is positioned at X-direction foremost; Perform in welding course of action, when soldering tip 19 Contact antenna and chip and when impulsive force is backward produced to lower mount pad 13, described buffer spring 21 just plays cushioning effect, makes mount pad 12 and lower mount pad 13 produce X at X to slide mechanism place and moves to current buffer.
Further, be provided with in described upper mount pad 12 two be oppositely arranged and the installing hole be communicated with cushion hole 12-1, described locating part 22 and buffer spring 21 arrange in one of them installing hole respectively; Described locating part 22 is screw, and this screw is threaded with installing hole; The outer end of the installing hole corresponding with buffer spring 21 is provided with closeouts 23.Adopt screw formation locating part 22 can regulate the position of locating part 22, described closeouts 23 is set for carrying out spacing to buffer spring 21.
See Fig. 1 ~ Fig. 7, described Y-axis micro-adjusting mechanism comprises bottom mount pad 16, is arranged on the Y-direction slide mechanism between lower mount pad 13 and bottom mount pad 16 and finely tunes actuating unit, and wherein, described bottom mount pad 16 is located at the below of lower mount pad 13; Described Y-direction slide mechanism comprises the Y-direction slideway arranged bottom lower mount pad 13 and the Y-direction sliding part 17 being fixed on mount pad 16 top, bottom, and described Y-direction sliding part 17 is connected with Y-direction slideway; Described fine setting actuating unit comprises fine adjustment shaft, is located at the eccentric shaft 15-1 of fine adjustment shaft lower end and is located at the fine setting hole 17-1 in Y-direction sliding part 17, and described fine adjustment shaft vertically passes through lower mount pad 13, and is connected with lower mount pad 13 by rotation connection structure; Described eccentric shaft 15-1 mates in described fine setting hole 17-1; Described weld assembly 18 is arranged on the mount pad 16 of bottom.
Adopt the effect of above-mentioned Y-axis micro-adjusting mechanism to be that the fine setting of Y direction is carried out in the position of butt welding connected components 18, make soldering tip 19 aim at antenna in Y direction.The operation principle of this Y-axis micro-adjusting mechanism is: drive eccentric shaft 15-1 to rotate by rotating fine adjustment shaft, thus drive Y-direction slideway and bottom mount pad 16 to move along Y-axis by fine setting hole 17-1, realize the adjustment of weld assembly 18Y to position.
Further, described fine adjustment shaft is made up of described buffer bar 15, makes same parts have two functions, is conducive to simplifying structure; Described rotation connection structure comprises the shaft shoulder be located on fine adjustment shaft and the limit base 24 being fixed on lower mount pad 13 top; Described fine adjustment shaft passes from limit base 24, and be provided with the spacing hole matched with the described shaft shoulder in limit base 24, the described shaft shoulder is limited in spacing hole, and the lower end of the shaft shoulder is fitted on the end face of lower mount pad 13.Guarantee that fine adjustment shaft can freely rotate by above-mentioned rotation connection structure, with the axially-movable of limit fine adjustment shaft.
See Fig. 1 ~ 5, described Y-axis micro-adjusting mechanism is two, and each Y-axis micro-adjusting mechanism connects a weld assembly 18.Arrange two weld assemblies 18 can weld two strip antennas on card simultaneously, improve welding efficiency; By the Y-direction distance of soldering tip 19 in two adjustable two weld assemblies 18 of Y-axis micro-adjusting mechanism, to adapt to the different distance between two strip antennas on card.
See Fig. 1 ~ Fig. 5, described power drive mechanism and drive motors 2 be arranged on be located at chute 1-1 end installing plate 6 on, described power drive mechanism is synchronous belt drive mechanism 5.By described synchronous belt drive mechanism 5, by the power transmission of drive motors 2 to the leading screw 4 in lead-screw drive mechanism, thus slide block 3 is driven to slide.
See Fig. 8 ~ Figure 10, soldering tip 19 in described weld assembly 18 comprises soldering tip matrix and weld part 19-1, wherein, described weld part 19-1 comprises weld part 19-2 and lower weld part 19-3, is provided with the groove 19-4 caved inward between described upper weld part 19-2 and lower weld part 19-3; The end of described upper weld part 19-2 extends out to the end exceeding lower weld part 19-3.Adopt the effect of the soldering tip 19 of said structure to be: upper weld part 19-2 first Contact antenna top in welding process, and push against in antenna top insertion scolding tin, the heat now gone up on weld part 19-2 passes to scolding tin rapidly, makes the rapid melting of scolding tin; Descend weld part 19-3 ability Contact antenna bottom subsequently and sky be pushed down in the scolding tin of melting, weld part 19-3 is very little to the impulsive force of the bottom of antenna at present for this, damage can not be caused to the bottom of antenna, the bottom of antenna be there will not be and fracture, ensure that welding quality.Further, because first upper weld part 19-2 contacts scolding tin and stretch in scolding tin during welding, therefore, it is possible to allow the rapid melting of scolding tin, improve welding efficiency, and there will not be fried tin, avoid producing tin sweat(ing), improve welding quality.
See Fig. 8 ~ Figure 10, the end of described upper weld part 19-2 is arc-shaped, the damage to antenna when compressing antenna to alleviate; The end of described upper weld part 19-2 is the large gradual change type structure in middle little, upper and lower two, be convenient to weld part 19-2 like this when being pressed on scolding tin by antenna, reduce resistance, weld part 19-2 on this can be rapidly inserted in scolding tin, thus allow the rapid melting of scolding tin; In addition, gradual change type structure also makes weld part 19-2 can not cause great impact in the process inserting scolding tin.
See Fig. 1 ~ Figure 11, operation principle of the present utility model is: the frame 1 for chip Handling device a is arranged on the top of card transport c, the drive motors 2 be positioned in this frame 1 drives slide block 3 to do the movement of X-direction by power drive mechanism and lead-screw drive mechanism, thus drive weld assembly 18 to do the motion of X-direction, weld assembly 18 is close in the motion of X-direction or leaves the motion of antenna to be welded and chip, thus realizes the control to the welding action of weld assembly 18.
See Figure 11, because welder b of the present utility model is located at the frame for chip Handling device a, and this frame is arranged on the top of card transport c, therefore described welder b is also positioned at the top of card transport c, do not occupy the position of card transport c side, thus can not interfere with chip belt conveying mechanism d, make the design of chip belt conveying mechanism d, installment and debugging convenient, equipment volume is less compacter.The X-axis slide block of the X-axis travel mechanism in described slide block and chip handling device a is arranged in same chute 1-1, make described chute 1-1 both for leading to the X-axis slide block in chip handling device a, also for leading to the slide block 3 of this welder b, make full use of the design feature of chute 1-1, make chip handling device a and welder b interrelated non-interference again, overall structure is compacter.
Above-mentioned is the utility model preferably embodiment; but embodiment of the present utility model is not by the restriction of foregoing; change, the modification done under other any does not deviate from Spirit Essence of the present utility model and principle, substitute, combine, simplify; all should be the substitute mode of equivalence, be included within protection domain of the present utility model.
Claims (10)
1. an intelligent card chip welder, comprise weld assembly and drive weld assembly to perform the driving mechanism of welding action, it is characterized in that: described driving mechanism comprises drive motors, slide block, the lead-screw drive mechanism of driving slide block movement and the coupling assembling of connection sliding block and weld assembly, wherein, described drive motors and slide block are arranged on the frame for chip Handling device, described frame is provided with the chute extended along X-direction, and described slide block is arranged in this chute; Leading screw one end in described lead-screw drive mechanism is through described slide block, and the other end is connected with drive motors by power drive mechanism.
2. intelligent card chip welder according to claim 1, it is characterized in that, described coupling assembling comprises vertical adjustment mechanism, this vertical adjustment mechanism is made up of vertical slide mechanism and threaded adjusting mechanism, and described vertical slide mechanism comprises the vertical guide be connected with slide block and the vertical sliding part be connected in vertical guide; The adjusting screw(rod) that described threaded adjusting mechanism comprises the upper adjusting seat be located in vertical guide, is located at the lower adjusting seat on vertical sliding part and is connected on upper adjusting seat and lower adjusting seat, is threaded connection anatomical connectivity between described adjusting screw(rod) and lower adjusting seat.
3. intelligent card chip welder according to claim 2, it is characterized in that, described coupling assembling also comprises elastic buffering mechanism, this elastic buffering mechanism comprises the upper mount pad be connected on vertical sliding part, lower mount pad below mount pad is set, be connected to X between mount pad and lower mount pad to slide mechanism and the elastic buffering mechanism that is located between upper mount pad and lower mount pad, wherein, described X comprises to slide mechanism and is arranged on X bottom upper mount pad to slide rail be fixed on the X at lower mount pad top to slide, described X is connected to slide rail to slide with X, described elastic buffering mechanism comprises the buffer bar be connected on lower mount pad, and this buffer bar is from bottom to top through the cushion hole be located on upper mount pad, locating part and buffer spring is provided with in described upper mount pad, this locating part and buffer spring are arranged on the both sides of buffer bar along X-direction, wherein, described locating part is positioned at the side near soldering tip, buffer spring is positioned at opposite side, and the end of described locating part and buffer spring to extend in cushion hole and acts on buffer bar.
4. intelligent card chip welder according to claim 3, is characterized in that, be provided with in described upper mount pad two be oppositely arranged and the installing hole be communicated with cushion hole, described locating part and buffer spring arrange in one of them installing hole respectively; Described locating part is screw, and this screw is threaded with installing hole; The outer end of the installing hole corresponding with buffer spring is provided with closeouts.
5. intelligent card chip welder according to claim 3, it is characterized in that, described coupling assembling also comprises Y-axis micro-adjusting mechanism, this Y-axis micro-adjusting mechanism comprises bottom mount pad, is arranged on the Y-direction slide mechanism between lower mount pad and bottom mount pad and finely tunes actuating unit, wherein, described bottom mount pad is located at the below of lower mount pad; Described Y-direction slide mechanism comprises the Y-direction slideway arranged bottom lower mount pad and the Y-direction sliding part being fixed on mount pad top, bottom, and described Y-direction sliding part is connected with Y-direction slideway; Described fine setting actuating unit comprises fine adjustment shaft, is located at the eccentric shaft of fine adjustment shaft lower end and is located at the fine setting hole in Y-direction sliding part, and described fine adjustment shaft vertically passes through lower mount pad, and is connected with lower mount pad by rotation connection structure; Described eccentric shaft coupling is in described fine setting hole; Described weld assembly is arranged on the mount pad of bottom.
6. intelligent card chip welder according to claim 5, is characterized in that, described fine adjustment shaft is made up of described buffer bar; Described rotation connection structure comprises the shaft shoulder be located on fine adjustment shaft and the limit base being fixed on lower mount pad top; Described fine adjustment shaft passes from limit base, and be provided with the spacing hole matched with the described shaft shoulder in limit base, the described shaft shoulder is limited in spacing hole, and the lower end of the shaft shoulder is fitted on the end face of lower mount pad.
7. the intelligent card chip welder according to claim 5 or 6, is characterized in that, described Y-axis micro-adjusting mechanism is two, and each Y-axis micro-adjusting mechanism connects a weld assembly.
8. the intelligent card chip welder according to any one of claim 1 ~ 6, it is characterized in that, soldering tip in described weld assembly comprises soldering tip matrix and weld part, wherein, described weld part comprises weld part and lower weld part, is provided with the groove caved inward between described upper weld part and lower weld part; The end of described upper weld part extends out to the end exceeding lower weld part.
9. intelligent card chip welder according to claim 8, is characterized in that, the end of described upper weld part is arc-shaped; The end of described upper weld part is the large gradual change type structure in middle little, upper and lower two.
10. intelligent card chip welder according to claim 1, is characterized in that, described power drive mechanism and drive motors be arranged on be located at chute end installing plate on, described power drive mechanism is synchronous belt drive mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520321890.6U CN204673176U (en) | 2015-05-16 | 2015-05-16 | A kind of intelligent card chip welder |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201520321890.6U CN204673176U (en) | 2015-05-16 | 2015-05-16 | A kind of intelligent card chip welder |
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| CN204673176U true CN204673176U (en) | 2015-09-30 |
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| CN201520321890.6U Expired - Fee Related CN204673176U (en) | 2015-05-16 | 2015-05-16 | A kind of intelligent card chip welder |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113414528A (en) * | 2020-05-19 | 2021-09-21 | 中国第一汽车股份有限公司 | RFID card automatic positioning erection equipment |
| CN117548891A (en) * | 2024-01-12 | 2024-02-13 | 四川省宜宾威力化工有限责任公司 | Based on electron detonator processing welding set |
-
2015
- 2015-05-16 CN CN201520321890.6U patent/CN204673176U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113414528A (en) * | 2020-05-19 | 2021-09-21 | 中国第一汽车股份有限公司 | RFID card automatic positioning erection equipment |
| CN113414528B (en) * | 2020-05-19 | 2023-01-17 | 中国第一汽车股份有限公司 | RFID card automatic positioning erection equipment |
| CN117548891A (en) * | 2024-01-12 | 2024-02-13 | 四川省宜宾威力化工有限责任公司 | Based on electron detonator processing welding set |
| CN117548891B (en) * | 2024-01-12 | 2024-03-22 | 四川省宜宾威力化工有限责任公司 | Based on electron detonator processing welding set |
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Address after: 510520 Guangdong city of Guangzhou province Tianhe District Guangshan Road No. 500 building (Building 3) tissue culture Patentee after: GUANGZHOU MINGSEN MECH.&ELEC. EQUIPMENT CO., LTD. Address before: 510640 Guangdong Province, Guangzhou Tianhe District, No. 87 ban 1 floor, 2 floor Patentee before: Guangzhou Mingsen Mech. & Elec. Equipment Co.,Ltd. |
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