CN204651299U - Semiconductor device means for correcting - Google Patents
Semiconductor device means for correcting Download PDFInfo
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- CN204651299U CN204651299U CN201520298025.4U CN201520298025U CN204651299U CN 204651299 U CN204651299 U CN 204651299U CN 201520298025 U CN201520298025 U CN 201520298025U CN 204651299 U CN204651299 U CN 204651299U
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- rotating clamp
- semiconductor device
- pin hole
- spring
- pin
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Abstract
A kind of semiconductor device means for correcting, comprise the first rotating clamp, second rotating clamp on right side, the positioning seat being placed in the jaws of described first rotating clamp and the second rotating clamp and the base that are arranged on left side, the middle part of described positioning seat is provided with elasticity thimble, described elasticity thimble is through described positioning seat, the bottom of described first rotating clamp is provided with the first pin hole, be provided with the first pin in first pin hole, the two ends of described first pin are connected with described base.The bottom of described second rotating clamp is provided with the second pin hole, is provided with the second pin in the second pin hole, and the two ends of described second pin are connected with described base.The position being positioned at the left side of described first pin hole in the bottom surface of described first rotating clamp is provided with the first spring.The position being positioned at the left side of described second pin hole in the bottom surface of described second rotating clamp is provided with the second spring.The semiconductor device means for correcting of this structure can carry out position correction to semiconductor device efficiently.
Description
Technical field
The utility model relates to a kind of semiconductor device means for correcting, particularly relate to a kind of can efficiently to the semiconductor device means for correcting that the position of semiconductor device corrects.
Background technology
Current semiconductor device fabrication needs, by multiple machining process, also to need multiple processing stations accordingly.Needed first to correct the position of semiconductor device before these machining processes of beginning.If first do not corrected the position of semiconductor device, the course of processing can be caused smooth and easyly to carry out, time serious, also can produce a large amount of defective productss.So accurately carrying out position correction to semiconductor device is a problem demanding prompt solution.
Utility model content
The utility model want technical solution problem to be, provide a kind of can efficiently to the semiconductor device means for correcting that the position of semiconductor device corrects.
For solving above technical problem, the technical solution of the utility model is: a kind of semiconductor device means for correcting, it is characterized in that: the positioning seat comprising the jaws being arranged on first rotating clamp in left side, second rotating clamp on right side and being placed in described first rotating clamp and the second rotating clamp, the middle part of described positioning seat is provided with elasticity thimble, and described elasticity thimble is through described positioning seat.
As improvement of the present utility model, also comprise base, the bottom of described first rotating clamp is provided with the first pin hole, is provided with the first pin in the first pin hole, and the two ends of described first pin are connected with described base.
Further improve one as the utility model, the bottom of described second rotating clamp is provided with the second pin hole, is provided with the second pin in the second pin hole, and the two ends of described second pin are connected with described base.
Further improve as the utility model, the position being positioned at the left side of described first pin hole in the bottom surface of described first rotating clamp is provided with the first spring.
Further improve as the utility model, the position being positioned at the left side of described second pin hole in the bottom surface of described second rotating clamp is provided with the second spring.
Further improve two as the utility model, described elasticity thimble comprises thimble and the 3rd spring, and one end of described 3rd spring is conflicted on described thimble, the other end is conflicted on described first rotating clamp or the second rotating clamp.
Further improve as the utility model, described thimble comprises the support portion of the top and the spring mountings of bottom.
Further improve as the utility model, described thimble also comprises the stop part be arranged between described support portion and spring mountings, the cross-sectional area of described stop part is greater than the cross-sectional area of described support portion, and the cross-sectional area of described stop part is also greater than the cross-sectional area of described spring mountings.
Preferably, described 3rd spring is conflicted on the lower surface of described stop part, and described base is connected with rotating mechanism.
By implementing, the utility model is desirable obtains following beneficial effect:
A kind of semiconductor device means for correcting, comprise the positioning seat of the jaws being arranged on first rotating clamp in left side, second rotating clamp on right side and being placed in described first rotating clamp and the second rotating clamp, the middle part of described positioning seat is provided with elasticity thimble, and described elasticity thimble is through described positioning seat.When semiconductor device is placed on positioning seat, by gently pressing semiconductor device downwards, elasticity thimble can run downwards, and the first rotating clamp can to anticlockwise, and the second rotating clamp can to right rotation, when the pressure be applied to above semiconductor device is removed, elasticity thimble meeting resilience, the first rotating clamp can to right rotation, and the second rotating clamp can to anticlockwise, this makes it possible to, by the position automatic adjustment of semiconductor device, which achieves and carry out efficient position correction to semiconductor device.Semiconductor device means for correcting also comprises base, and the bottom of described first rotating clamp is provided with the first pin hole, is provided with the first pin in the first pin hole, and the two ends of described first pin are connected with described base.The bottom of described second rotating clamp is provided with the second pin hole, is provided with the second pin in the second pin hole, and the two ends of described second pin are connected with described base.The position being positioned at the left side of described first pin hole in the bottom surface of described first rotating clamp is provided with the first spring.The position being positioned at the left side of described second pin hole in the bottom surface of described second rotating clamp is provided with the second spring.Described elasticity thimble comprises thimble and the 3rd spring, and one end of described 3rd spring is conflicted on described thimble, the other end is conflicted on described first rotating clamp or the second rotating clamp.Described thimble comprises the support portion of the top and the spring mountings of bottom.Described thimble also comprises the stop part be arranged between described support portion and spring mountings, and the cross-sectional area of described stop part is greater than the cross-sectional area of described support portion, and the cross-sectional area of described stop part is also greater than the cross-sectional area of described spring mountings.Described 3rd spring is conflicted on the lower surface of described stop part, and described base is connected with rotating mechanism.This structure is ensureing, under the prerequisite of the position of semiconductor device being carried out to adjustment efficiently, greatly to have simplified again the structure of device itself, and this makes semiconductor device means for correcting structure more simple, and run more reliable, cost is lower, more easy to utilize.
Accompanying drawing explanation
Below in conjunction with Figure of description, further detailed description is done to the utility model, wherein:
Fig. 1 is structural representation of the present utility model;
Fig. 2 is fractionation structural representation of the present utility model;
Fig. 3 is working state schematic representation of the present utility model.
Embodiment
As shown in Figure 1, 2, a kind of semiconductor device means for correcting, comprise the first rotating clamp 10, second rotating clamp 20 on right side, the positioning seat 30 being placed in the jaws of described first rotating clamp 10 and the second rotating clamp 20 and the base 50 that are arranged on left side, the middle part of described positioning seat 30 is provided with elasticity thimble 40, and described elasticity thimble 40 is through described positioning seat 30.The bottom of described first rotating clamp 10 to be provided with in the first pin hole 11, first pin hole 11 and to be provided with the first pin 12, and the two ends of described first pin 12 are connected with described base 50.The bottom of described second rotating clamp 20 is provided with in the second pin hole 21, second pin hole 21 and is provided with the second pin 22, and the two ends of described second pin 22 are connected with described base 50.The position being positioned at the left side of described first pin hole 11 in the bottom surface of described first rotating clamp 10 is provided with the first spring 13.The position being positioned at the left side of described second pin hole 21 in the bottom surface of described second rotating clamp 20 is provided with the second spring 23.Described elasticity thimble 40 comprises thimble 41 and the 3rd spring 42, and one end of described 3rd spring 41 is conflicted on described thimble 41, the other end is conflicted on described first rotating clamp 10.Described thimble 41 comprises the support portion 411 of the top and the spring mountings 413 of bottom.Described thimble 41 also comprises the stop part 412 be arranged between described support portion 411 and spring mountings 413, the cross-sectional area of described stop part 412 is greater than the cross-sectional area of described support portion 411, and the cross-sectional area of described stop part 412 is also greater than the cross-sectional area of described spring mountings 413.Described 3rd spring 42 is conflicted on the lower surface of described stop part 412.Described base 50 is connected with rotating mechanism.
As shown in Figure 3, semiconductor device is placed on positioning seat 30, and when semiconductor device is pressed down, elasticity thimble 40 moves downward, and described first rotating clamp 10 is to anticlockwise, and the second rotating clamp 20 is to right rotation.When applying power on the semiconductor device and being removed, elasticity thimble 40 moves upward, and described first rotating clamp 10 is to right rotation, and the second rotating clamp 20 is to anticlockwise.Positioning seat 30, elasticity thimble 40, first rotating clamp 10 and the second position of rotating clamp 20 acting in conjunction to semiconductor device correct.
Must be pointed out, some non-restrictive explanations that above-described embodiment is just made the utility model.But person of skill in the art will appreciate that, do not departing under aim of the present utility model and scope, can make amendment to the utility model, replace and change, these amendments, replacement and change still belong to protection range of the present utility model.
Claims (10)
1. a semiconductor device means for correcting, it is characterized in that: the positioning seat (30) comprising the jaws being arranged on first rotating clamp (10) in left side, second rotating clamp (20) on right side and being placed in described first rotating clamp (10) and the second rotating clamp (20), the middle part of described positioning seat (30) is provided with elasticity thimble (40), and described elasticity thimble (40) is through described positioning seat (30).
2. semiconductor device means for correcting according to claim 1, it is characterized in that: also comprise base (50), the bottom of described first rotating clamp (10) is provided with the first pin hole (11), in first pin hole, (11) are provided with the first pin (12), and the two ends of described first pin (12) are connected with described base (50).
3. semiconductor device means for correcting according to claim 2, it is characterized in that: the bottom of described second rotating clamp (20) is provided with the second pin hole (21), be provided with the second pin (22) in second pin hole (21), the two ends of described second pin (22) are connected with described base (50).
4. semiconductor device means for correcting according to claim 3, is characterized in that: the position being positioned at the left side of described first pin hole (11) in the bottom surface of described first rotating clamp (10) is provided with the first spring (13).
5. semiconductor device means for correcting according to claim 4, is characterized in that: the position being positioned at the left side of described second pin hole (21) in the bottom surface of described second rotating clamp (20) is provided with the second spring (23).
6. according to the semiconductor device means for correcting in claim 2 to 5 described in any one, it is characterized in that: described elasticity thimble (40) comprises thimble (41) and the 3rd spring (42), one end conflict of described 3rd spring (41) is upper at described thimble (41), the other end is conflicted on described first rotating clamp (10) or the second rotating clamp (20).
7. semiconductor device means for correcting according to claim 6, is characterized in that: described thimble (41) comprises the support portion (411) of the top and the spring mountings (413) of bottom.
8. semiconductor device means for correcting according to claim 7, it is characterized in that: described thimble (41) also comprises the stop part (412) be arranged between described support portion (411) and spring mountings (413), the cross-sectional area of described stop part (412) is greater than the cross-sectional area of described support portion (411), and the cross-sectional area of described stop part (412) is also greater than the cross-sectional area of described spring mountings (413).
9. semiconductor device means for correcting according to claim 8, is characterized in that: described 3rd spring (42) is conflicted on the lower surface of described stop part (412).
10. semiconductor device means for correcting according to claim 9, is characterized in that: described base (50) is connected with rotating mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520298025.4U CN204651299U (en) | 2015-05-11 | 2015-05-11 | Semiconductor device means for correcting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520298025.4U CN204651299U (en) | 2015-05-11 | 2015-05-11 | Semiconductor device means for correcting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204651299U true CN204651299U (en) | 2015-09-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520298025.4U Active CN204651299U (en) | 2015-05-11 | 2015-05-11 | Semiconductor device means for correcting |
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| Country | Link |
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| CN (1) | CN204651299U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106269547A (en) * | 2015-12-31 | 2017-01-04 | 桂林斯壮微电子有限责任公司 | A kind of device positioning seat of testing, sorting machine |
-
2015
- 2015-05-11 CN CN201520298025.4U patent/CN204651299U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106269547A (en) * | 2015-12-31 | 2017-01-04 | 桂林斯壮微电子有限责任公司 | A kind of device positioning seat of testing, sorting machine |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |