CN204632723U - Wafer is stained with silver plate structure - Google Patents
Wafer is stained with silver plate structure Download PDFInfo
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- CN204632723U CN204632723U CN201520264329.9U CN201520264329U CN204632723U CN 204632723 U CN204632723 U CN 204632723U CN 201520264329 U CN201520264329 U CN 201520264329U CN 204632723 U CN204632723 U CN 204632723U
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- perforation
- region
- stained
- flexible glue
- wafer
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Abstract
The utility model relates to a kind of wafer and is stained with silver plate structure, and it is better durable that it enables wafer be stained with silver plate; Mainly: a metallic plate is provided with the perforation in multiple region, each region has multiple perforation of proper alignment, above each regional perforation, bottom surface is provided with integrated flexible glue layer, form glue hole in perforation place and can insert and determine wafer and be stained with silver, periphery in each region flexible glue layer is provided with connect apertures, and obtains shaping spacer, by the location of spacer, and the flexible glue layer in each region must be made to link, locate, reach and prevent from having lifted up disengaging and having obtained durable effect.
Description
Technical field
The utility model relates to a kind of wafer and is stained with silver plate structure, and its flexible glue layer making wafer be stained with silver plate positions wafer has better durable effect.
Background technology
Existing wafer is stained with the structure of silver plate, as shown in Figure 1, 2, 3, it is the perforation 11 that a metallic plate 10 is provided with multiple region, each region has the perforation 11 of multiple proper alignment, again above each regional perforation 11, bottom surface establishes integrated flexible glue layer 12, form glue hole 110 in perforation 11 place, can insert wafer 13 by the flexible glue elasticity in glue hole 110, silver paste 14 is stained with in this wafer 13 location; Above-mentioned structure, in fact have its own shortcomings: as shown in Figure 3, on each region, the periphery of bottom surface flexible glue layer 12, by metallic plate 10 is separated, therefore, when using for the moment in the future, the periphery of flexible glue layer 12 has the existing picture (as shown by dotted lines in figure 3) departing from and lifted up, cause out-of-flatness and affect and be stained with silver, in other words, existing wafer is stained with silver plate and is not comparatively durable.
Utility model content
Namely the utility model is improve above-mentioned existing shortcoming, major technique, object are: the periphery of each regional perforation of metallic plate establishes connect apertures, when one-body molded flexible glue layer, also one-body molded spacer while, each spacer makes the location that each region flexible glue layer links integrally and periphery is better, therefore, can obtain and more durablely do not depart from the effect of having lifted up.
For reaching above-mentioned purpose, the utility model provides a kind of wafer to be stained with silver plate structure, it comprises a metallic plate, described metallic plate is provided with multiple region, each region has the perforation of multiple proper alignment respectively, above the perforation in each region, bottom surface is provided with integrated flexible glue layer, forms glue hole in perforation place; Multiple connect apertures is provided with between the perforation in each region, the periphery of the perforation in each region is also provided with multiple connect apertures, described flexible glue layer be provided with integratedly lay respectively at above perforation, the spacer of bottom surface, above described perforation, the spacer of bottom surface links one by connect apertures, thus prevents from each region flexible glue layer periphery from departing from having lifted up.
Preferably, be provided with in the desired location of described metallic plate and determine face.
The beneficial effects of the utility model are: above adjacent area, bottom surface flexible glue layer has spacer, and above being, the spacer of bottom surface is interconnected one, and the effect that can pin down, reach and prevent from departing from the effect of having lifted up.In like manner, above each region, the periphery of bottom surface flexible glue layer has spacer, above, the spacer of bottom surface is also connected one, can pin down and prevent from departing from the effect of having lifted up.Therefore, by above, bottom surface spacer is connected one, and must prevent from each region flexible glue layer periphery from departing from having lifted up, reached durable, guaranteed not lifted up the effect disturbed and be stained with silver-colored quality.In " determining face ", it can coordinate the location of machine, and metallic plate can be allowed to keep facing up, above not having, the problem mutually put upside down of bottom surface.
Accompanying drawing explanation
Fig. 1 is existing semi-finished metal plate stereogram.
Fig. 2 is existing constructing stereo figure.
Fig. 3 be existing wafer be stained with silver analyse and observe and flexible glue pull-up from schematic diagram.
Fig. 4 is the utility model semi-finished metal plate stereogram.
Fig. 5 is the utility model constructing stereo figure.
Fig. 6 is that the utility model wafer is stained with silver-colored cross-sectional schematic.
Primary symbols illustrates:
[existing]
10 metallic plate 110 glue holes
11 perforation 13 wafers
12 flexible glue layer 14 silver paste
[the utility model]
20 metallic plates 24 determine face
21 perforation 30 flexible glue layers
210 glue hole 31,32 spacers
22,23 connect apertures.
Embodiment
Refer to Fig. 4,5,6, a metallic plate 20 is provided with the perforation 21 in multiple region, and each region has the perforation 21 of multiple proper alignment, and above each regional perforation 21, bottom surface is provided with integrated flexible glue layer 30, forms glue hole 210 in perforation 21 place; Multiple connect apertures 22 is provided with between each regional perforation 21, the periphery of each regional perforation 21 is also provided with multiple connect apertures 23, when shaping flexible glue layer 30, simultaneously one-body molded be positioned at the zone line of flexible glue layer 30 above and the spacer 31 of bottom surface and be positioned at flexible glue layer 30 region, two edges above and bottom surface spacer 32, above, the spacer 31,32 of bottom surface links one by connect apertures 22,23; In addition, this metallic plate 20 setting place is provided with and determines face 24.
By above-mentioned structure, can obtain following effect, advantage: referring again to Fig. 6, above adjacent area, bottom surface flexible glue layer 30 has spacer 31, and above being, the spacer 31 of bottom surface is interconnected one, and the effect that can pin down, reach and prevent from departing from the effect of having lifted up.In like manner, above each region, the periphery of bottom surface flexible glue layer 30 has spacer 32, above, the spacer 32 of bottom surface is also connected one, can pin down and prevent from departing from the effect of having lifted up.Therefore, by above, bottom surface spacer is connected one, and must prevent from each region flexible glue layer 30 periphery from departing from having lifted up, reached durable, guaranteed not lifted up the effect disturbed and be stained with silver-colored quality.In " determining face 24 ", it can coordinate the location of machine, and metallic plate 20 can be allowed to keep facing up, above not having, the problem mutually put upside down of bottom surface.
In sum, structure of the present utility model really has splendid practicality and promotes effect, really meets new patent requirement, earnestly asks patent.
Claims (2)
1. wafer is stained with a silver plate structure, and it comprises a metallic plate, and described metallic plate is provided with multiple region, and each region has the perforation of multiple proper alignment respectively, and above the perforation in each region, bottom surface is provided with integrated flexible glue layer, forms glue hole in perforation place; It is characterized in that: between the perforation in each region, be provided with multiple connect apertures, the periphery of the perforation in each region is also provided with multiple connect apertures, described flexible glue layer be provided with integratedly lay respectively at above perforation, the spacer of bottom surface, above described perforation, the spacer of bottom surface links one by connect apertures.
2. wafer according to claim 1 is stained with silver plate structure, it is characterized in that, is provided with determines face at the desired location of described metallic plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520264329.9U CN204632723U (en) | 2015-04-28 | 2015-04-28 | Wafer is stained with silver plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520264329.9U CN204632723U (en) | 2015-04-28 | 2015-04-28 | Wafer is stained with silver plate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204632723U true CN204632723U (en) | 2015-09-09 |
Family
ID=54051723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520264329.9U Active CN204632723U (en) | 2015-04-28 | 2015-04-28 | Wafer is stained with silver plate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204632723U (en) |
-
2015
- 2015-04-28 CN CN201520264329.9U patent/CN204632723U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |