CN204625604U - Built-up type detects wafer - Google Patents

Built-up type detects wafer Download PDF

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Publication number
CN204625604U
CN204625604U CN201520166196.1U CN201520166196U CN204625604U CN 204625604 U CN204625604 U CN 204625604U CN 201520166196 U CN201520166196 U CN 201520166196U CN 204625604 U CN204625604 U CN 204625604U
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protective layer
filling orifice
built
face
wafer
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CN201520166196.1U
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白平辉
林咏翔
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TCI GENE MEDICAL Co Ltd
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TCI GENE MEDICAL Co Ltd
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Abstract

The utility model relates to a kind of built-up type and detects wafer; it comprises: a protection module and with protective layer and frame layer detects substrate; this detection substrate optionally combines to define a reaction zone with this frame layer; this reaction zone is defined by the end face of the bottom surface of this protective layer, this frame layer and this detection substrate to form; this protective layer is more equipped with the filling orifice being communicated to reaction zone; and this detection substrate has multiple probe, it is positioned at this reaction zone.According to the utility model; because protection module is optionally combined with this detection substrate by this frame layer; therefore flexible assembling protection module can be realized and detect the object of brilliant plate; built-up type detection wafer is beneficial to be stored or transport, thus promotes the ease of use that combined bio of the present utility model detects wafer.

Description

Built-up type detects wafer
Technical field
The utility model relates to a kind of raw doctor and detects association area, particularly relates to a kind of built-up type and detects wafer.
Background technology
Flourish along with biomedical detection technique, prior art has developed a kind of gene test wafer, the glass substrate of this gene test wafer or silicon substrate can lay thousands of extremely tens thousand of nucleotide probes (nucleotide probe), target DNA (desoxyribose nucleic acid) (DNA) or Yeast Nucleic Acid (RNA) in proven specific nucleotide probe and a corpse or other object for laboratory examination and chemical testing is utilized to carry out hybridization (hybridization), recycle the signal detection target dna of proven specific nucleotide probe or the existence of RNA, to reach the object of gene test.
No. 3745091st, U.S. Patent Bulletin case discloses a kind of biological reaction apparatus, and its substrate is installed with multiple room, to hold testing sample.As shown in Fig. 1 of this section of patent documentation, multiple rooms of this biological reaction apparatus had both taken up space and had had the shortcoming be easy to by damaging by pressure, caused the biological reaction apparatus of prior art to be unfavorable for being deposited in a large number or transporting.
No. 1138145Cth, China's Mainland patent of invention bulletin case discloses a kind of multiple-sample microarray biochip, it comprises the solid phase carrier of slide glass form and to be fixedly arranged on solid phase carrier, to separate and to arrange and can not multiple chambers of seepage mutually, micro probe array is furnished with, to complete multiple reaction simultaneously in each chamber.But, this section of patent documentation chamber that how teaching does not solve multiple-sample microarray biochip crushes easily or is unfavorable for the technique means of depositing in a large number or transporting, also undeclared technique means of how immediately assembling solid phase carrier and multiple chamber depending on user demand, cannot the shortcoming of flexible assembling so plant that multiple-sample microarray biochip still exists.
No. 100441301Cth, China's Mainland patent of invention bulletin case then discloses a kind of microarray hybridization device, and this device comprises the reaction chamber of a pad and cover plate type, by producing many micro-bubbles in reaction chamber, makes microarray surface form the mixing of better solution.But, how this section of patent documentation not yet teaching avoids microarray hybridization device to be unfavorable for the technique means of depositing or transporting, also undeclared how can the reaction chamber of assembled gasket and cover plate type immediately depending on user demand, thus realize the object of flexible assembling microarray hybridization device.
In view of the technological deficiency of the existence of prior art, still need the structure and configuration of the gene test wafer improving prior art at present, to improve the ease of use of gene test wafer.
Utility model content
In order to solve prior art Problems existing, the purpose of this utility model is to provide the combined bio of a kind of visual user demand and flexible assembling to detect wafer, thus the gene test wafer overcoming prior art is unfavorable for the problem of depositing in a large number or transporting.
For reaching aforementioned object, the utility model provides a kind of built-up type to detect wafer, and it comprises:
One protection module, it has a protective layer and a frame layer, and this protective layer has a relative end face and a bottom surface and one first filling orifice, and this first filling orifice runs through end face and the bottom surface of this protective layer, and this frame layer is arranged at the bottom surface of this protective layer;
One detects substrate; this detection substrate optionally combines to define a reaction zone with this frame layer; this detection substrate has a relative end face and a bottom surface and multiple probe; this reaction zone is defined by the end face of the bottom surface of this protective layer, this frame layer and this detection substrate to form; this first filling orifice is connected with this reaction zone; and described probe is arranged on the end face of this detection substrate, and be positioned at this reaction zone.
Preferably, the protective layer of this protection module has at least one removal hole, and this at least one removal hole runs through end face and the bottom surface of this protective layer, and is positioned at outside this reaction zone.
Preferably, this built-up type detects wafer and comprises a sample identification layer, and this sample identification layer is arranged on this detection substrate, and is positioned at outside this reaction zone.
Preferably, this built-up type detects wafer and comprises one first sealing ply, and this first sealing ply selective binding in the end face of this protective layer, and closes this first filling orifice.
Preferably, this protective layer has more the second filling orifice, and this second filling orifice runs through end face and the bottom surface of this protective layer, and this first filling orifice and this second filling orifice lay respectively at the relative both sides in this reaction zone; And this built-up type detection wafer comprises one first sealing ply and one second sealing ply; this first sealing ply and this second sealing ply selective binding are in the end face of this protective layer; and this first sealing ply closes this first filling orifice, this second sealing ply closes this second filling orifice.
Preferably, this protective layer has more the second filling orifice, and this second filling orifice runs through end face and the bottom surface of this protective layer, and this first filling orifice and this second filling orifice lay respectively at the relative both sides in this reaction zone; And this built-up type detection wafer comprises the second sealing ply, this second sealing ply selective binding is in the end face of this protective layer, and this second sealing ply closes this second filling orifice.
Preferably, described probe is that matrix-style arranges the central position be laid in this reaction zone, and this first filling orifice is arranged in the position of this protective layer this frame layer contiguous.
Preferably, described probe is that matrix-style arranges the central position be laid in this reaction zone, and this first filling orifice and the second filling orifice are arranged in the position of this protective layer this frame layer contiguous.
The beneficial effects of the utility model are:
1) according to the utility model, because this protection module is optionally be combined with each other with this detection substrate by this frame layer, therefore before assembling built-up type of the present utility model detects wafer, multiple protection module can be folded to establish mutually and deposit, and by multiple detection substrate mutually folded establishing deposit, save thus and deposit or transport the space that built-up type of the present utility model detects wafer; In addition; utilize the distributing style that protection module and detection substrate optionally be combined with each other; built-up type of the present utility model detects wafer and waits until before carrying out testing and starting; again protection module is incorporated into and detects on substrate; thus realize to protect module and detecting the object of brilliant plate by flexible assembling, promote the ease of use that combined bio of the present utility model detects wafer.
2) according to the utility model, this protection module, by combinations such as bonding, laminating or hot pressings, is optionally combined with this detection substrates into intimate by this frame layer.
3) according to the utility model, described probe can lay corresponding nucleotide probe according to the different target that detects.
Accompanying drawing explanation
Fig. 1 is the stereographic map that built-up type of the present utility model detects wafer.
Fig. 2 is the exploded view that built-up type of the present utility model detects wafer.
Fig. 3 is the vertical view that built-up type of the present utility model detects wafer.
Fig. 4 is the sectional view that built-up type of the present utility model detects wafer.
Fig. 5 A is the operation chart before assembling, self-shield module removing glued membrane.
Fig. 5 B is the operation chart detecting wafer with the use of a tool assembling built-up type.
Fig. 5 C is the operation chart be positioned over by protection module in assembling process on a tool.
Fig. 5 D be in assembling process by detect substrate be positioned over one be mounted with protection module tool on assembling schematic diagram.
Fig. 6 is the using state figure making the protection module of built-up type detection wafer and detection substrate be separated via removal hole with the use of tweezers.
Embodiment
Below coordinating accompanying drawing and preferred embodiment of the present utility model, setting forth the technique means that the utility model is taked for reaching predetermined utility model object further.
Refer to shown in Fig. 1, Fig. 2 and Fig. 4, built-up type of the present utility model detects wafer 1 and comprises a protection module 10, detection substrate 20, reaction zone 30, two sealing ply 40 (i.e. the first sealing ply and the second sealing ply), three removal hole 50 and sample identification layers 60.
Refer to shown in Fig. 2 to Fig. 4, described protection module 10 has a rectangular protective layer 11 and a rectangular frame layer 12.This protective layer 11 has relative end face 111 and bottom surface 112 and two filling orifices 113 (i.e. the first filling orifice and the second filling orifice); described filling orifice 113 runs through this end face 111 and bottom surface 112; in the present embodiment, two described filling orifices 113 are arranged in the relative both sides of this protective layer 11 respectively.This frame layer 12 is a black glue-line; This frame layer 12 is arranged at the bottom surface 112 of this protective layer 11; and simultaneously around two described filling orifices 113; this frame layer 12 has a relative end face and a bonding plane 121 and relative medial surface 122 and an outer side; this medial surface 122 and outer side are all between the end face and bonding plane 121 of this frame layer 12; the end face of this frame layer 12 is bonded in the bottom surface 112 of this protective layer 11, and this filling orifice 113 is arranged in the position of this protective layer 11 this frame layer 12 contiguous.
Described detection substrate 20 is optionally bonding with the bonding plane 121 of aforementioned frame layer 12, to define this reaction zone 30.This detection substrate 20 has a relative end face 21 and a bottom surface 22 and about 2000 probes 23; this reaction zone 30 be by the end face 21 of the bottom surface 112 of this protective layer 11, the medial surface 122 of this frame layer 12 and this detection substrate 20 define and form; for an accommodating hybridization reaction solution, and described filling orifice 113 is connected with this reaction zone 30.Described probe 23 is arranged on the end face 21 of this detection substrate 20, and is positioned at this reaction zone 30.Described probe 23 arranges in matrix-style the central position be laid in this reaction zone 30.
Please refer to shown in Fig. 1 to Fig. 3, described sealing ply 40 is optionally incorporated into the end face 111 of this protective layer 11, and correspondence is arranged on aforementioned two filling orifices 113 respectively, to close described filling orifice 113.Accordingly; this reaction zone 20 can be hedged off from the outer world by the end face 21 of the medial surface 122 of the bottom surface 112 of protective layer 11, this frame layer 12, this detection substrate 20 and described sealing ply 40, avoids hybridization reaction solution self seeding hole 113 seepage be placed in reaction zone 30 thus.
Described removal hole 50 through the end face 111 of this protective layer 11 and bottom surface 112, and is positioned at outside this reaction zone 30, and namely this removal hole 50 is arranged in the position of the outer side of this protective layer 11 this frame layer 12 contiguous, and is not connected with this reaction zone 30.
This sample identification layer 60 is arranged on this detection substrate 20, and is positioned at outside this reaction zone 30, and described removal hole 50 and this sample identification layer 60 are arranged at the relative both sides of this frame layer 12 respectively.
Accordingly; the protection module detecting wafer due to built-up type of the present utility model is optionally be combined with each other with this detection substrate by this frame layer; therefore deposit in depositing or multiple protection module can being folded to establish mutually in transport process; separately multiple detection substrate is folded to establish mutually and deposit, save this built-up type thus and detect the parking space of wafer or transport space.
Can understand for ease of haveing the knack of this those skilled in the art the assembling mode that built-up type of the present utility model detects wafer easily, below coordinating Fig. 5 A to Fig. 5 D to be described.
For guaranteeing to protect module to avoid tackiness that is contaminated and that avoid the only impurities adhere such as dust or batting to reduce protection module at the bonding plane of frame layer and detect between substrate, the bonding plane of the frame layer of this protection module is stained with a glued membrane.Refer to shown in Fig. 5 A, before assembling, first remove glued membrane 13A, with the bonding plane 121 of the frame layer 12 of this protection module 10 exposed.
Then, refer to shown in Fig. 5 B, adopt a tool 70A, this tool 70A has the alignment grooves 71A that a size corresponds to this protection module 10 and this detection substrate.
Then, refer to shown in Fig. 5 C, this protection module 10 is positioned in this alignment grooves 71A, and make the end face of protective layer 11 towards this tool 70a, with the bonding plane 121 of this this frame layer 12 exposed.
Finally, refer to shown in Fig. 5 D, will the end face of substrate 20 be detected towards this tool 70a, and make the bonding plane 121 of the frame layer 12 of the end face of detection substrate 20 and this protection module 10 bonding, the built-up type obtained as shown in Figure 1 can be assembled and detect wafer.
Accordingly; built-up type of the present utility model detects wafer and can adopt as above-mentioned assembling mode; but be not limited only to this; before carrying out testing and starting; again the entirety of this protection module 10 is bonded to and detects on substrate 20; reach the object that flexible assembling is protected module 10 and detected brilliant plate 20 thus, promote the ease of use that combined bio of the present utility model detects wafer 1.
Shown in Fig. 6; by protection module 10 wears the structure being formed with multiple removal holes 50; after built-up type detection wafer 1 of the present utility model carries out DNA hybridization reaction; user can with the use of the instrument of such as tweezers 80A; a wherein gripping end of tweezers 80A is stretched in removal hole 50; and be resisted against the bonding place of this frame layer 12 and this detection substrate 20; another gripping end of tweezers 80A is resisted against on protective layer 11; thus make dismounting on Global Macros module 10 Autonomous test substrate 20, in order to this detection substrate 20 of cleaning.
The above is only preferred embodiment of the present utility model, not any pro forma restriction is done to the utility model, although the utility model discloses as above with preferred embodiment, but and be not used to limit the utility model, any those skilled in the art, not departing from the scope of technical solutions of the utility model, make a little change when the technology contents of above-mentioned announcement can be utilized or be modified to the Equivalent embodiments of equivalent variations, in every case be the content not departing from technical solutions of the utility model, according to any simple modification that technical spirit of the present utility model is done above embodiment, equivalent variations and modification, all still belong in the scope of the utility model claim.

Claims (10)

1. built-up type detects a wafer, and it is characterized in that, it comprises:
One protection module, it has a protective layer and a frame layer, and this protective layer has a relative end face and a bottom surface and one first filling orifice, and this first filling orifice runs through end face and the bottom surface of this protective layer, and this frame layer is arranged at the bottom surface of this protective layer;
One detects substrate; this detection substrate optionally combines to define a reaction zone with this frame layer; this detection substrate has a relative end face and a bottom surface and multiple probe; this reaction zone is defined by the end face of the bottom surface of this protective layer, this frame layer and this detection substrate to form; this first filling orifice is connected with this reaction zone; and described probe is arranged on the end face of this detection substrate, and be positioned at this reaction zone.
2. built-up type according to claim 1 detects wafer, and it is characterized in that, the protective layer of this protection module has at least one removal hole, and this at least one removal hole runs through end face and the bottom surface of this protective layer, and is positioned at outside this reaction zone.
3. built-up type according to claim 1 and 2 detects wafer, it is characterized in that, this built-up type detects wafer and comprises a sample identification layer, and this sample identification layer is arranged on this detection substrate, and is positioned at outside this reaction zone.
4. built-up type according to claim 1 and 2 detects wafer, it is characterized in that, this built-up type detects wafer and comprises one first sealing ply, and this first sealing ply selective binding in the end face of this protective layer, and closes this first filling orifice.
5. built-up type according to claim 3 detects wafer, it is characterized in that, this built-up type detects wafer and comprises one first sealing ply, and this first sealing ply selective binding in the end face of this protective layer, and closes this first filling orifice.
6. built-up type according to claim 1 and 2 detects wafer, it is characterized in that, this protective layer also has the second filling orifice, and this second filling orifice runs through end face and the bottom surface of this protective layer, and this first filling orifice and this second filling orifice lay respectively at the relative both sides in this reaction zone; And this built-up type detection wafer comprises one first sealing ply and one second sealing ply; this first sealing ply and this second sealing ply selective binding are in the end face of this protective layer; and this first sealing ply closes this first filling orifice, this second sealing ply closes this second filling orifice.
7. built-up type according to claim 3 detects wafer, it is characterized in that, this protective layer also has the second filling orifice, and this second filling orifice runs through end face and the bottom surface of this protective layer, and this first filling orifice and this second filling orifice lay respectively at the relative both sides in this reaction zone; And this built-up type detection wafer comprises one first sealing ply and the second sealing ply; this first sealing ply and this second sealing ply selective binding are in the end face of this protective layer; and this first sealing ply closes this first filling orifice, this second sealing ply closes this second filling orifice.
8. built-up type according to claim 5 detects wafer, it is characterized in that, this protective layer also has the second filling orifice, and this second filling orifice runs through end face and the bottom surface of this protective layer, and this first filling orifice and this second filling orifice lay respectively at the relative both sides in this reaction zone; And this built-up type detection wafer comprises one second sealing ply, this second sealing ply selective binding is in the end face of this protective layer, and this second sealing ply closes this second filling orifice.
9. built-up type according to claim 1 and 2 detects wafer, and it is characterized in that, described probe is that matrix-style arranges the central position be laid in this reaction zone, and this first filling orifice is arranged in the position of this protective layer this frame layer contiguous.
10. built-up type according to claim 8 detects wafer, and it is characterized in that, described probe is that matrix-style arranges the central position be laid in this reaction zone, and this first filling orifice and the second filling orifice are arranged in the position of this protective layer this frame layer contiguous.
CN201520166196.1U 2015-03-24 2015-03-24 Built-up type detects wafer Active CN204625604U (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107815408A (en) * 2016-09-12 2018-03-20 台达电子国际(新加坡)私人有限公司 Using the nucleic acid analyzer of isothermal duplication mode
US10850281B2 (en) 2016-09-12 2020-12-01 Delta Electronics Int'l (Singapore) Pte Ltd Nucleic acid analysis apparatus
US11376581B2 (en) 2016-09-12 2022-07-05 Delta Electronics Int'l (Singapore) Pte Ltd Flow control and processing cartridge
US11426735B2 (en) 2016-09-12 2022-08-30 Delta Electronics Int'l (Singapore) Pte Ltd Nucleic acid analysis apparatus
US11478791B2 (en) 2016-09-12 2022-10-25 Delta Electronics Int'l (Singapore) Pte Ltd Flow control and processing cartridge

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107815408A (en) * 2016-09-12 2018-03-20 台达电子国际(新加坡)私人有限公司 Using the nucleic acid analyzer of isothermal duplication mode
US10850281B2 (en) 2016-09-12 2020-12-01 Delta Electronics Int'l (Singapore) Pte Ltd Nucleic acid analysis apparatus
CN107815408B (en) * 2016-09-12 2021-11-09 台达电子国际(新加坡)私人有限公司 Nucleic acid analysis device using isothermal amplification method
US11376581B2 (en) 2016-09-12 2022-07-05 Delta Electronics Int'l (Singapore) Pte Ltd Flow control and processing cartridge
US11426735B2 (en) 2016-09-12 2022-08-30 Delta Electronics Int'l (Singapore) Pte Ltd Nucleic acid analysis apparatus
US11478791B2 (en) 2016-09-12 2022-10-25 Delta Electronics Int'l (Singapore) Pte Ltd Flow control and processing cartridge

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