CN204622723U - 一种热压工艺用硅胶皮 - Google Patents
一种热压工艺用硅胶皮 Download PDFInfo
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- CN204622723U CN204622723U CN201520232142.0U CN201520232142U CN204622723U CN 204622723 U CN204622723 U CN 204622723U CN 201520232142 U CN201520232142 U CN 201520232142U CN 204622723 U CN204622723 U CN 204622723U
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- silicone rubber
- pressing process
- heat pressing
- layer
- screen
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- 229920002379 silicone rubber Polymers 0.000 title claims abstract description 54
- 239000004945 silicone rubber Substances 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 39
- 230000000694 effects Effects 0.000 abstract description 6
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201520232142.0U CN204622723U (zh) | 2015-04-17 | 2015-04-17 | 一种热压工艺用硅胶皮 |
Applications Claiming Priority (1)
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CN201520232142.0U CN204622723U (zh) | 2015-04-17 | 2015-04-17 | 一种热压工艺用硅胶皮 |
Publications (1)
Publication Number | Publication Date |
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CN204622723U true CN204622723U (zh) | 2015-09-09 |
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Family Applications (1)
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CN201520232142.0U Active CN204622723U (zh) | 2015-04-17 | 2015-04-17 | 一种热压工艺用硅胶皮 |
Country Status (1)
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CN (1) | CN204622723U (zh) |
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2015
- 2015-04-17 CN CN201520232142.0U patent/CN204622723U/zh active Active
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 518106, Gongming office, Guangming District, Guangdong, Shenzhen, will be on the first floor, No. 15, Yau Ma Tei Industrial Park, Shek Wai community, Shek Wai Patentee after: SHENZHEN HANYU NEW TECHNOLOGY CO.,LTD. Address before: 518106, Gongming office, Guangming District, Guangdong, Shenzhen, will be on the first floor, No. 15, Yau Ma Tei Industrial Park, Shek Wai community, Shek Wai Patentee before: SHENZHEN HANYUXIN ELECTRONICS TECHNOLOGY Co.,Ltd. |
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DD01 | Delivery of document by public notice |
Addressee: SHENZHEN HANYU NEW TECHNOLOGY CO.,LTD. Person in charge of patents Document name: payment instructions |
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DD01 | Delivery of document by public notice |