CN204621357U - Silica-based LED chip cutting optical splitter - Google Patents
Silica-based LED chip cutting optical splitter Download PDFInfo
- Publication number
- CN204621357U CN204621357U CN201520187895.4U CN201520187895U CN204621357U CN 204621357 U CN204621357 U CN 204621357U CN 201520187895 U CN201520187895 U CN 201520187895U CN 204621357 U CN204621357 U CN 204621357U
- Authority
- CN
- China
- Prior art keywords
- cutting
- light splitting
- led chip
- silica
- installing plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 32
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 20
- 230000003287 optical effect Effects 0.000 title claims abstract description 13
- 239000000377 silicon dioxide Substances 0.000 title claims abstract description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 14
- 229910052710 silicon Inorganic materials 0.000 abstract description 14
- 239000010703 silicon Substances 0.000 abstract description 14
- 238000000034 method Methods 0.000 abstract description 11
- 238000001354 calcination Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910002059 quaternary alloy Inorganic materials 0.000 description 1
- 229910052705 radium Inorganic materials 0.000 description 1
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 1
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The utility model relates to a kind of silica-based LED chip cutting optical splitter, belong to LED chip cutting technique field, for solving the technical problem of cutting efficiency, provide a kind of structure simple, easy to use, silicon chip in cutting process is avoided to produce prying, the silica-based LED chip cutting optical splitter that cutting efficiency is high, the technical scheme adopted is that base is provided with installing plate, installing plate is provided with ladder hole, light splitting eyeglass is provided with in ladder hole, the lower end of light splitting eyeglass is provided with location plug screw, the upper end of light splitting eyeglass is provided with fine setting plug screw, light splitting eyeglass outer setting has lens orientation annulus, lens orientation annulus is bolted on installing plate, the utility model is widely used in the cutting of silica-based LED chip.
Description
Technical field
The utility model relates to a kind of silica-based LED chip cutting optical splitter, belongs to LED chip cutting technique field.
Background technology
Chip cutting technique is exactly by after hobboing cutter mechanical wear or radium-shine calcination in fact, then by splitting, big circular slice is split into the process of the little crystal grain of rectangle.
Silicon, as quaternary system LED chip base material, with cheap in the industry cycle, with the advantage fast fetching substituting metal base material that homalographic brightness is high, becomes main flow quaternary chip substrates gradually.
Silicon substrate quality is hard, crisp, frangible, and in traditional single-point laser cutting process, silicon chip easily produces prying, and cause two axle cutting horizontals to align, cutting action cannot complete smoothly.So the way can only repeatedly cutting same Cutting Road by low-power avoids slice, thin piece prying, but the shortcoming of this method is that the time is long, and efficiency is low, the appearance poor of Cutting Road repeatedly after calcination.If meet production in enormous quantities, personnel and board demand are large, the board cost caused and personnel cost high.
Utility model content
For solving the technical problem of cutting efficiency that prior art exists, it is simple that the utility model provides a kind of structure, easy to use, avoids silicon chip in cutting process to produce prying, silica-based LED chip cutting optical splitter that cutting efficiency is high.
For achieving the above object, the technical scheme that the utility model adopts is silica-based LED chip cutting optical splitter, it is characterized in that: comprise base, installing plate and light splitting eyeglass, described base is provided with installing plate, described installing plate is provided with ladder hole, light splitting eyeglass is provided with in described ladder hole, the lower end of described light splitting eyeglass is provided with location plug screw, the upper end of light splitting eyeglass is provided with fine setting plug screw, light splitting eyeglass outer setting has lens orientation annulus, and described lens orientation annulus is bolted on installing plate.
Compared with prior art, the utility model has following technique effect: the utility model structure is simple, silicon chip in cutting process not only can be avoided to produce prying, and can enhance productivity and yield, reduce board cost and human cost, can realize producing operation in enormous quantities.
Accompanying drawing explanation
Fig. 1 is the structural representation of optical splitter in the utility model.
Fig. 2 is the cross section structure schematic diagram of optical splitter in the utility model.
Fig. 3 is the theory diagram of radium-shine cutting in the utility model.
Detailed description of the invention
In order to make technical problem to be solved in the utility model, technical scheme and beneficial effect clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
As shown in Figure 1 and Figure 2, silica-based LED chip cutting optical splitter, comprise base 1, installing plate 2 and light splitting eyeglass 3, described base 1 is provided with installing plate 2, described installing plate 2 is provided with ladder hole 4, in described ladder hole 4, be provided with light splitting eyeglass 3, the lower end of described light splitting eyeglass 3 is provided with location plug screw 5, the upper end of light splitting eyeglass is provided with fine setting plug screw 6, and light splitting eyeglass 3 outer setting has lens orientation annulus 7, and described lens orientation annulus 7 is fixed on installing plate 2 by bolt 8.
Wherein have enough spaces between ladder hole 4 and honourable eyeglass 3, ensure that light splitting eyeglass 3 can Small-angle Rotation, bolt 5, for supporting, after angle adjust honourable eyeglass, is locked by finely tuning plug screw 6.
Using method as shown in Figure 3, is carried out according to following steps,
A, get silicon base chip example edition sheet, silicon base chip example edition is originally affixed on SPV224 tunica albuginea surface, is then placed on the load plate of laser cutting machine, and load plate is moved to below radium-shine source, and start vacuum and suck glued membrane;
B, optical splitter is arranged on after between laser source and amplifier and carries out trial cut, check that by the multiple radium-shine point that separates whether in the same horizontal line the cut channel on silicon base chip example edition sheet surface distinguishes, if do not exist, adjust spectroscopical lens angle, trial cut again, until by the multiple radium-shine point that separates in the same horizontal line; Getting a spectroscope is again arranged between amplifier and reflective mirror, then carries out trial cut, adjustment, until by the multiple radium-shine point that separates in the same horizontal line;
C, Modulating Power, measurement and inspection cutting-in, open radium-shine source power and measurement, beaten by radium-shine for multiple spot luminous point in amount instrument face, side, by adjustment electric current and frequency, the silicon base chip example edition that horizontally slips originally, then takes off silicon base chip example edition originally, under high-power microscope, checks cutting-in; Wherein the power output in radium-shine source is 3w, and cutting-in is 40-60um;
D, cutting-in get silicon base chip according to step a, b, c adjustment level after meeting, setting border, and confirmed standard point, starts cutting.
In cutting process, chip has multiple spot is radium-shine streaks chip surface simultaneously, be cut into example with silicon base chip, X-axis adds Y-axis and has 350 roads, the radium blanking method that traditional same Cutting Road repeatedly streaks, so minimum that to walk 350 × 3=1050 cutter, can cut, spent time nearly 40 minutes.And we are by the cutting method after the improvement of application optical splitter, only need to cut 350 cuttves, 13 minutes time, substantially increase production capacity, provide cost savings, improve the presentation quality of product.When carrying out cutting operation by said method, be equivalent to be streaked repeatedly by radium-shine point by the chip cut simultaneously, stop returning of silicon chip to melt problem in time, avoid bending, the generation of fin, and cross section yet very smooth of cutting vestige, do not have any impact in appearance.
The foregoing is only preferred embodiment of the present utility model, not in order to limit the utility model, all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should wrap within the scope of the utility model
.
Claims (1)
1. silica-based LED chip cutting optical splitter, it is characterized in that: comprise base, installing plate and light splitting eyeglass, described base is provided with installing plate, described installing plate is provided with ladder hole, be provided with light splitting eyeglass in described ladder hole, the lower end of described light splitting eyeglass is provided with location plug screw, and the upper end of light splitting eyeglass is provided with fine setting plug screw, light splitting eyeglass outer setting has lens orientation annulus, and described lens orientation annulus is bolted on installing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520187895.4U CN204621357U (en) | 2015-03-31 | 2015-03-31 | Silica-based LED chip cutting optical splitter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520187895.4U CN204621357U (en) | 2015-03-31 | 2015-03-31 | Silica-based LED chip cutting optical splitter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204621357U true CN204621357U (en) | 2015-09-09 |
Family
ID=54040418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520187895.4U Expired - Fee Related CN204621357U (en) | 2015-03-31 | 2015-03-31 | Silica-based LED chip cutting optical splitter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204621357U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104801851A (en) * | 2015-03-31 | 2015-07-29 | 山西南烨立碁光电有限公司 | Silicon-based LED chip cutting method and optical splitter for cutting silicon-based LED chips |
-
2015
- 2015-03-31 CN CN201520187895.4U patent/CN204621357U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104801851A (en) * | 2015-03-31 | 2015-07-29 | 山西南烨立碁光电有限公司 | Silicon-based LED chip cutting method and optical splitter for cutting silicon-based LED chips |
| CN104801851B (en) * | 2015-03-31 | 2019-01-18 | 山西南烨立碁光电有限公司 | Optical splitter is used in silicon substrate LED chip cutting method and its cutting |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150909 |