CN204609115U - A kind of compound heat preservation die plate - Google Patents

A kind of compound heat preservation die plate Download PDF

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Publication number
CN204609115U
CN204609115U CN201520331181.6U CN201520331181U CN204609115U CN 204609115 U CN204609115 U CN 204609115U CN 201520331181 U CN201520331181 U CN 201520331181U CN 204609115 U CN204609115 U CN 204609115U
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China
Prior art keywords
thickness
insulation layer
enhancement layer
die plate
layer
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CN201520331181.6U
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Chinese (zh)
Inventor
崔山山
贾文杰
扈晓燕
肖经纬
张亮
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SHANDONG CHUANGWEI EXTERNAL WALL INSULATION MATERIAL GROUP Co.,Ltd.
SHANDONG HUIXING TECHNOLOGY DEVELOPMENT Co.,Ltd.
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SHANDONG HUIXING TECHNOLOGY DEVELOPMENT Co Ltd
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Abstract

A kind of compound heat preservation die plate, comprise insulation layer, the upper end of described insulation layer is provided with enhancement Layer, and the thickness of described insulation layer is 5cm ~ 6.5cm, and the thickness of described insulation layer is 5 ~ 6.5:0.9 ~ 1 with the ratio of the thickness of upper enhancement Layer.The thickness of described insulation layer is 5cm ~ 6.5cm, can meet the requirement of architectural exterior insulation energy-conservation 75%, can reduce again the thickness of compound heat preservation die plate, reduces the area occupied of complex heat-preservation lamina membranacea, reduces weight and the cost of compound heat preservation die plate, convenient construction; The thickness of described insulation layer is 5 ~ 6.5:0.9 ~ 1 with the ratio of the thickness of upper enhancement Layer, to the selection of upper enhancement Layer thickness, the requirement of strength of the exterior sheathing as Cast-in-situ Concrete Structural Engineering can either be met, reduce again the thickness of upper enhancement Layer in the reasonable scope, the bonding strength of enhancement Layer and insulation layer in raising, reduces potential safety hazard, reduce the thickness of compound heat preservation die plate simultaneously, reduce the area occupied of complex heat-preservation lamina membranacea, reduce weight and the cost of compound heat preservation die plate, convenient construction.

Description

A kind of compound heat preservation die plate
Technical field
The utility model relates to the technical field of composite shuttering, particularly a kind of compound heat preservation die plate.
Background technology
Along with society and expanding economy, energy conservation and protection of the environment have become the common recognition of the mankind.In order to more effective energy conservation, energy saving building becomes an important problem, and improve the heat-insulating property of building, can play significant energy-saving effect, therefore, the demand of building to high performance heat insulating board increases thereupon.
Now conventional building exterior wall heat preserving template is FS composite thermal-insulating exterior formwork, FS composite thermal-insulating exterior formwork structure comprises XPS insulation layer, lower enhancement Layer and upper enhancement Layer etc., directly can be used as the exterior sheathing of Cast-in-situ Concrete Structural Engineering, be one by insulation and template and two, decrease working procedure and template consumption, without the need to doing other isothermal holding again, improve efficiency of construction, reducing engineering comprehensive cost.
But in use, in order to the requirement making composite thermal-insulating exterior formwork reach architectural exterior insulation energy-conservation 75%, XPS insulation layer thickness arranges excessive, makes composite thermal-insulating exterior formwork occur following defect: 1. composite thermal-insulating exterior formwork takies larger space; 2. the weight of Composite external insulation template is comparatively large, construction inconvenience; 3. cost is higher.
In order to make composite thermal-insulating exterior formwork as the exterior sheathing of Cast-in-situ Concrete Structural Engineering, need to reach enough intensity, if upper enhancement Layer, lower enhancement Layer is excessively thin, the intensity of composite thermal-insulating exterior formwork is lower, do not reach the requirement as exterior-wall heat insulation template, permanent exterior-wall heat insulation template can not be used as when concreting, if upper enhancement Layer, lower enhancement Layer is blocked up, although heat insulation formwork can be made to have larger intensity, but Composite external insulation template can be caused to occur following defect: 1. go up enhancement Layer, the weight of lower enhancement Layer is larger, can greatly reduce upper enhancement Layer, lower attachment force between enhancement Layer and insulation layer, XPS insulation layer and upper enhancement Layer, easily hollowing is produced between lower enhancement Layer, XPS insulation layer and upper enhancement Layer, lower enhancement Layer is easily peeled off, there is larger potential safety hazard, 2. take more space, 3. additionally increase cost, 4. weight increases, construction inconvenience.The deficiencies in the prior art part that Here it is.
Summary of the invention
Technical problem to be solved in the utility model, is exactly for the deficiency existing for prior art, and provides a kind of compound heat preservation die plate, can control the thickness of compound heat preservation die plate preferably.
This programme is achieved by the following technical measures: a kind of compound heat preservation die plate, comprise insulation layer, the upper end of described insulation layer is provided with enhancement Layer, and the thickness of described insulation layer is 5cm ~ 6.5cm, and the thickness of described insulation layer is 5 ~ 6.5:0.9 ~ 1 with the ratio of the thickness of upper enhancement Layer.
The technical characteristic of this programme also comprises: the lower end of above-mentioned insulation layer is provided with lower enhancement Layer, and the thickness of described insulation layer is 5 ~ 6.5:0.5 ~ 0.6 with the ratio of the thickness of lower enhancement Layer.
The technical characteristic of this programme also comprises: be provided with upper interface between above-mentioned insulation layer and upper enhancement Layer.
The technical characteristic of this programme also comprises: be provided with lower boundary layer between above-mentioned insulation layer and lower enhancement Layer.
The technical characteristic of this programme also comprises: above-mentioned insulation layer is modification extruded sheet.It is GPES rigid foam composite plastic warming plate in 201410516592.2 patents that described modification extruded sheet is preferably application number.
The technical characteristic of this programme also comprises: above-mentioned upper interface is the upper interface be made up of two component interfacial agents.
The technical characteristic of this programme also comprises: above-mentioned lower boundary layer is the lower boundary layer be made up of two component interfacial agents.
The technical characteristic of this programme also comprises: the thickness of above-mentioned insulation layer is 5.5cm ~ 6cm, and the thickness of described insulation layer is 5.5 ~ 6:0.9 ~ 1 with the ratio of the thickness of upper enhancement Layer.Adopt the technical program, the thickness of insulation layer selects 5.5cm ~ 6cm, on the one hand, the thickness of warming plate is suitable, insulation composite shuttering thickness is suitable, and make compound heat preservation die plate reach preferably heat insulation effect, on the other hand, composite insulation boards can be made to reach good intensity at the thickness of upper enhancement Layer corresponding to this thickness range of warming plate simultaneously, the thickness of upper enhancement Layer is moderate, average weight, upper enhancement Layer and insulation layer also have good bonding strength, therefore the thickness of warming plate is at 5.5cm ~ 6cm, take into account the requirements to composite insulation boards, composite insulation boards is made to have good combination property.
The technical characteristic of this programme also comprises: the thickness of above-mentioned insulation layer is 5.5cm ~ 6cm, and the thickness of described insulation layer is 5.5 ~ 6:0.5 ~ 0.6 with the ratio of the thickness of lower enhancement Layer.Adopt the technical program, the thickness of insulation layer selects 5.5cm ~ 6cm, on the one hand, the thickness of warming plate is suitable, insulation composite shuttering thickness is suitable, and make compound heat preservation die plate reach preferably heat insulation effect, on the other hand, composite insulation boards can be made to reach good intensity at the thickness of lower enhancement Layer corresponding to this thickness range of warming plate simultaneously, the thickness of lower enhancement Layer is moderate, average weight, lower enhancement Layer and insulation layer also have good bonding strength, therefore the thickness of warming plate is at 5.5cm ~ 6cm, take into account the requirements to composite insulation boards, composite insulation boards is made to have good combination property.
The beneficial effects of the utility model can be learnt from above-mentioned technical scheme: a kind of compound heat preservation die plate, comprise insulation layer, the upper end of described insulation layer is provided with enhancement Layer, the thickness of described insulation layer is 5cm ~ 6.5cm, and the thickness of described insulation layer is 5 ~ 6.5:0.9 ~ 1 with the ratio of the thickness of upper enhancement Layer.In this programme, the thickness of described insulation layer is 5cm ~ 6.5cm, can meet the requirement of architectural exterior insulation energy-conservation 75%, the thickness of compound heat preservation die plate can be reduced again, reduce the area occupied of complex heat-preservation lamina membranacea, reduce weight and the cost of compound heat preservation die plate, convenient construction; The thickness of described insulation layer is 5 ~ 6.5:0.9 ~ 1 with the ratio of the thickness of upper enhancement Layer, to the selection of upper enhancement Layer thickness, the requirement of strength of the exterior sheathing as Cast-in-situ Concrete Structural Engineering can either be met, reduce again the thickness of upper enhancement Layer in the reasonable scope, the bonding strength of enhancement Layer and insulation layer in raising, reduces potential safety hazard, reduce the thickness of compound heat preservation die plate simultaneously, reduce the area occupied of complex heat-preservation lamina membranacea, reduce weight and the cost of compound heat preservation die plate, convenient construction.
As can be seen here, the utility model compared with prior art, has substantive distinguishing features and progress, and its beneficial effect implemented also is apparent.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model embodiment 1.
Fig. 2 is the structural representation of the utility model embodiment 2.
In figure: 1-insulation layer, 2-upper interface, the upper enhancement Layer of 3-, boundary layer under 4-, enhancement Layer under 5-.
Detailed description of the invention
For the technical characterstic of this programme can be clearly demonstrated, below by detailed description of the invention, and in conjunction with its accompanying drawing, this programme is set forth.
embodiment 1
As shown in Figure 1, a kind of compound heat preservation die plate, comprise insulation layer 1, there is upper interface 2 upper end of described insulation layer 1, the upper end of described upper interface 2 is provided with enhancement Layer 3, and the thickness of described insulation layer 1 is 5 ~ 6.5cm, is preferably 5.5cm ~ 6cm, the thickness of described insulation layer 1 is 5 ~ 6.5:0.9 ~ 1 with the ratio of the thickness of upper enhancement Layer 3, is preferably 5.5 ~ 6:0.9 ~ 1.Described insulation layer 1 is modification extruded sheet, and it is GPES rigid foam composite plastic warming plate in 201410516592.2 patents that described modification extruded sheet is preferably application number.The thickness of described insulation layer 1 is 5cm ~ 6.5cm, can meet the requirement of architectural exterior insulation energy-conservation 75%, can reduce again the thickness of compound heat preservation die plate, reduces the area occupied of complex heat-preservation lamina membranacea, reduces weight and the cost of compound heat preservation die plate, convenient construction; The thickness of described insulation layer 1 is 5 ~ 6.5:0.9 ~ 1 with the ratio of the thickness of upper enhancement Layer 3, to the selection of upper enhancement Layer 3 thickness, the requirement of strength of the exterior sheathing as Cast-in-situ Concrete Structural Engineering can either be met, reduce again the thickness of upper enhancement Layer 3 in the reasonable scope, the bonding strength of enhancement Layer 3 and insulation layer 1 in raising, reduce potential safety hazard, reduce the thickness of compound heat preservation die plate simultaneously, reduce the area occupied of complex heat-preservation lamina membranacea, reduce weight and the cost of compound heat preservation die plate, convenient construction.
Described upper interface 2 is the upper interface be made up of two component interfacial agents.Two component interfacial agents can strengthen the adhesion strength between upper enhancement Layer 3 and insulation layer 1.
embodiment 2
A kind of compound heat preservation die plate, comprise insulation layer 1, the upper end of described insulation layer 1 is provided with upper interface 2, the upper end of described upper interface 2 is provided with enhancement Layer 3, the thickness of described insulation layer 1 is 5 ~ 6.5cm, be preferably 5.5cm ~ 6cm, the thickness of described insulation layer 1 is 5 ~ 6.5:0.9 ~ 1 with the ratio of the thickness of upper enhancement Layer 3, is preferably 5.5 ~ 6:0.9 ~ 1; The lower end of described insulation layer 1 is provided with lower boundary layer 4, is provided with lower enhancement Layer 5 below described lower boundary layer 4, and the thickness of described insulation layer 1 is 5 ~ 6.5:0.5 ~ 0.6 with the ratio of the thickness of lower enhancement Layer 5, is preferably 5.5 ~ 6:0.5 ~ 0.6.Described insulation layer 1 is modification extruded sheet, and it is GPES rigid foam composite plastic warming plate in 201410516592.2 patents that described modification extruded sheet is preferably application number.The thickness of described insulation layer 1 is 5cm ~ 6.5cm, the requirement of architectural exterior insulation energy-conservation 75% can be met, the thickness of compound heat preservation die plate can be reduced again, reduce the area occupied of complex heat-preservation lamina membranacea, reduce weight and the cost of compound heat preservation die plate, convenient construction, the thickness of described insulation layer 1 is 5 ~ 6.5:0.9 ~ 1 with the ratio of the thickness of upper enhancement Layer 3, the thickness of described insulation layer 1 is 5 ~ 6.5:0.5 ~ 0.6 with the ratio of the thickness of lower enhancement Layer 5, to the selection of upper enhancement Layer 3 and lower enhancement Layer 5 thickness, the requirement of strength of the exterior sheathing as Cast-in-situ Concrete Structural Engineering can either be met, reduce again the thickness of upper enhancement Layer 3 and lower enhancement Layer 5 in the reasonable scope, enhancement Layer 3 in raising, the bonding strength of lower enhancement Layer 5 and insulation layer 1, reduce potential safety hazard, reduce the thickness of compound heat preservation die plate simultaneously, reduce the area occupied of complex heat-preservation lamina membranacea, reduce weight and the cost of compound heat preservation die plate, convenient construction.
Described upper interface 2 is the upper interface be made up of two component interfacial agents; Described lower boundary layer 4 is the lower boundary layers be made up of two component interfacial agents.Upper interface 2, lower boundary layer 4 adopt two component interfacial agents can strengthen the bonding strength of insulation layer 1 and upper enhancement Layer 2, insulation layer 1 and lower enhancement Layer 4.
Can pass through without the technical characteristic described in the utility model or adopt existing techniques in realizing; do not repeat them here; certainly; above-mentioned explanation is not to restriction of the present utility model; the utility model is also not limited in above-mentioned embodiment; the change that those of ordinary skill in the art makes in essential scope of the present utility model, remodeling, interpolation or replacement, also should belong to protection domain of the present utility model.

Claims (9)

1. a compound heat preservation die plate, comprises insulation layer, and the upper end of described insulation layer is provided with enhancement Layer, it is characterized in that: the thickness of described insulation layer is 5cm ~ 6.5cm, and the thickness of described insulation layer is 5 ~ 6.5:0.9 ~ 1 with the ratio of the thickness of upper enhancement Layer.
2. compound heat preservation die plate according to claim 1, is characterized in that: the lower end of described insulation layer is provided with lower enhancement Layer, and the thickness of described insulation layer is 5 ~ 6.5:0.5 ~ 0.6 with the ratio of the thickness of lower enhancement Layer.
3. compound heat preservation die plate according to claim 1 and 2, is characterized in that: be provided with upper interface between described insulation layer and upper enhancement Layer.
4. compound heat preservation die plate according to claim 2, is characterized in that: be provided with lower boundary layer between described insulation layer and lower enhancement Layer.
5. compound heat preservation die plate according to claim 2, is characterized in that: described insulation layer is modification extruded sheet.
6. compound heat preservation die plate according to claim 3, is characterized in that: described upper interface is the upper interface be made up of two component interfacial agents.
7. compound heat preservation die plate according to claim 4, is characterized in that: described lower boundary layer is the lower boundary layer be made up of two component interfacial agents.
8. compound heat preservation die plate according to claim 1, is characterized in that: the thickness of described insulation layer is 5.5cm ~ 6cm, and the thickness of described insulation layer is 5.5 ~ 6:0.9 ~ 1 with the ratio of the thickness of upper enhancement Layer.
9. compound heat preservation die plate according to claim 2, is characterized in that: the thickness of described insulation layer is 5.5cm ~ 6cm, and the thickness of described insulation layer is 5.5 ~ 6:0.5 ~ 0.6 with the ratio of the thickness of lower enhancement Layer.
CN201520331181.6U 2015-05-21 2015-05-21 A kind of compound heat preservation die plate Ceased CN204609115U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520331181.6U CN204609115U (en) 2015-05-21 2015-05-21 A kind of compound heat preservation die plate

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Application Number Priority Date Filing Date Title
CN201520331181.6U CN204609115U (en) 2015-05-21 2015-05-21 A kind of compound heat preservation die plate

Publications (1)

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CN204609115U true CN204609115U (en) 2015-09-02

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Country Status (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108978990A (en) * 2018-07-04 2018-12-11 广东绿屋建筑科技工程有限公司 A kind of combined wall board of light heat-insulating and preparation method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108978990A (en) * 2018-07-04 2018-12-11 广东绿屋建筑科技工程有限公司 A kind of combined wall board of light heat-insulating and preparation method thereof

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GR01 Patent grant
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TR01 Transfer of patent right

Effective date of registration: 20210104

Address after: 257000 No.150 Fenhe Road, Dongying District, Dongying City, Shandong Province

Patentee after: SHANDONG HUIXING TECHNOLOGY DEVELOPMENT Co.,Ltd.

Patentee after: SHANDONG CHUANGWEI EXTERNAL WALL INSULATION MATERIAL GROUP Co.,Ltd.

Address before: No.150 Fenhe Road, Dongying District, Dongying City, Shandong Province 257091

Patentee before: SHANDONG HUIXING TECHNOLOGY DEVELOPMENT Co.,Ltd.

IW01 Full invalidation of patent right
IW01 Full invalidation of patent right

Decision date of declaring invalidation: 20200804

Decision number of declaring invalidation: 45584

Granted publication date: 20150902