CN204596765U - A kind of high-precision semiconductor multi-purpose type encapsulating mould - Google Patents
A kind of high-precision semiconductor multi-purpose type encapsulating mould Download PDFInfo
- Publication number
- CN204596765U CN204596765U CN201520252075.9U CN201520252075U CN204596765U CN 204596765 U CN204596765 U CN 204596765U CN 201520252075 U CN201520252075 U CN 201520252075U CN 204596765 U CN204596765 U CN 204596765U
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- China
- Prior art keywords
- guide pillar
- purpose type
- patrix
- encapsulating mould
- semiconductor multi
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- Expired - Fee Related
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model is a kind of high-precision semiconductor multi-purpose type encapsulating mould, comprise die shoe, and the counterdie be arranged on above die shoe, and the movable form be arranged on counterdie, and be arranged on movable form Nei Jiao road, and be arranged on the lamination slot of Jiao Dao both sides, and the suction hole be arranged in lamination slot, and be arranged on the arc groove of movable form end, and the guide pillar be arranged on above counterdie, and the spring be arranged on guide pillar, and the patrix be arranged on above guide pillar, and the guide pillar hole be arranged on patrix, and the gum-injecting port be arranged in the middle of patrix, and be arranged on the movable module of gum-injecting port both sides, described movable module has 4, is symmetrically distributed in the both sides of gum-injecting port, this kind of high-precision semiconductor multi-purpose type encapsulating mould has that precision is high, use cost is low, and the advantage that serviceability is good.
Description
Technical field
The utility model relates to a kind of high-precision semiconductor multi-purpose type encapsulating mould.
Background technology
At more and more flourishing present of electronics technology, the various electrical equipment in life constantly in update, and have the components and parts of various semiconductor to exist in electrical equipment, and the component quality of this kind of semiconductor directly affects performance and the useful life of electrical equipment.The components and parts of semiconductor are at volume and have multiple different existence in shape, they are all easily damaged, even if the impurity just in air also can damage components and parts, more moisture cannot be encountered, so semiconductor components and devices all needs to carry out packaging operation in outside before being used, at the outer wrap last layer containment vessel of whole components and parts, the more good of encapsulation more can play a protective role, so the accuracy of encapsulation just especially important, the a lot of encapsulating moulds had now are all on adopting, the mode that counterdie separates, between there is no too much connector, be easy to like this, when operation, deviation occurs, reduce the precision of operation, in addition, existing encapsulating mould is all fixing counterdie, once need component size, the shape difference of encapsulation just to need again to make a secondary mould, significantly improve use cost, also reducing serviceability simultaneously.
Utility model content
The utility model mainly solves the technical problem existing for prior art, thus provides that a kind of precision is high, use cost is low, and the high-precision semiconductor multi-purpose type encapsulating mould that serviceability is good.
Above-mentioned technical problem of the present utility model is mainly solved by following technical proposals:
A kind of high-precision semiconductor multi-purpose type encapsulating mould of the present utility model, comprise die shoe, and the counterdie be arranged on above die shoe, and the movable form be arranged on counterdie, and be arranged on movable form Nei Jiao road, and be arranged on the lamination slot of Jiao Dao both sides, and the suction hole be arranged in lamination slot, and be arranged on the arc groove of movable form end, and the guide pillar be arranged on above counterdie, and the spring be arranged on guide pillar, and the patrix be arranged on above guide pillar, and the guide pillar hole be arranged on patrix, and the gum-injecting port be arranged in the middle of patrix, and be arranged on the movable module of gum-injecting port both sides, described movable module has 4, is symmetrically distributed in the both sides of gum-injecting port.
As preferably, described guide pillar hole has 4, is symmetrically distributed in four arms of angle of patrix.
As preferably, described guide pillar has 4, and correspondence is positioned at the below in guide pillar hole.
As preferably, described spring has 4, and correspondence is distributed on guide pillar.
As preferably, described arc groove has 2, is symmetrically distributed in the two ends of movable form.
As preferably, described lamination slot has 4, is distributed in the both sides of Jiao Dao.
The beneficial effects of the utility model are: because high-precision semiconductor multi-purpose type encapsulating mould is provided with lamination slot, the size of lamination slot can be changed by superimposed sheets sections sheet, so just can meet same shape but the semiconductor components and devices of different size encapsulates, without the need to making encapsulating mould in addition because size is different, not only improve serviceability, reduce use cost simultaneously; Adopt the tactic pattern of guide pillar and spring, allow patrix and counterdie can not occur to greatest extent to offset when closed and after the ineffective power of patrix, to have certain resilience force voluntarily, this results in a fixing movement locus, produce the probability of deviation when decreasing operation, improve accuracy; The design of movable form, this kind of encapsulating mould can be replaced accordingly according to the shape of semiconductor components and devices, further increases serviceability, reduce use cost.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structure chart of a kind of high-precision semiconductor multi-purpose type of the utility model encapsulating mould;
Fig. 2 is the structure chart of counterdie in a kind of high-precision semiconductor multi-purpose type of the utility model encapsulating mould.
Embodiment
Below in conjunction with accompanying drawing, preferred embodiment of the present utility model is described in detail, to make advantage of the present utility model and feature can be easier to be readily appreciated by one skilled in the art, thus more explicit defining is made to protection range of the present utility model
As shown in Figure 1 to Figure 2, a kind of high-precision semiconductor multi-purpose type encapsulating mould, comprise die shoe 1, and the counterdie 2 be arranged on above die shoe 1, and the movable form 8 be arranged on counterdie 2, and be arranged on movable form 8 Nei Jiao road 9, and be arranged on the lamination slot 10 of both sides, glue road 9, and the suction hole 12 be arranged in lamination slot 10, and be arranged on the arc groove 13 of movable form 8 end, and the guide pillar 7 be arranged on above counterdie 2, and the spring 11 be arranged on guide pillar 7, and the patrix 3 be arranged on above guide pillar 7, and the guide pillar hole 6 be arranged on patrix 3, and the gum-injecting port 4 be arranged in the middle of patrix 3, and be arranged on the movable module 5 of gum-injecting port 4 both sides, described movable module 5 has 4, is symmetrically distributed in the both sides of gum-injecting port 4.
Described guide pillar hole 6 has 4, is symmetrically distributed in four arms of angle of patrix 3.Described guide pillar 7 has 4, and correspondence is positioned at the below in guide pillar hole 6.Described spring 11 has 4, and correspondence is distributed on guide pillar 7.Described arc groove 13 has 2, is symmetrically distributed in the two ends of movable form 8.Described lamination slot 10 has 4, is distributed in the both sides in glue road 9.
Mould and seal pressure machine, when operation, are assembled by this kind of high-precision semiconductor multi-purpose type encapsulating mould, and when mould closes, the movable module 5 of patrix 3 moves up and abdicates encapsulate position, makes semiconductor components and devices not damaged.FPC or other encapsulating material inhale on counterdie 2 by the suction hole 12 of counterdie 2 simultaneously, make it fixed, and then carry out packaging operation to semiconductor components and devices, inject colloid in glue road 9, around the components and parts of encapsulation, form corresponding colloid in gum-injecting port 4.After completing above operation, the ineffective power of patrix 3, spring 11 upwards resilience, allows patrix 3 separate encapsulation with counterdie 2.In addition, movable form 8 can be dismantled by arc groove 13, so just can replace movable form 8 according to the difformity of components and parts, allows this kind of encapsulating mould can be applicable to multiple difform component package simultaneously.
The beneficial effects of the utility model are: because high-precision semiconductor multi-purpose type encapsulating mould is provided with lamination slot, the size of lamination slot can be changed by superimposed sheets sections sheet, so just can meet same shape but the semiconductor components and devices of different size encapsulates, without the need to making encapsulating mould in addition because size is different, not only improve serviceability, reduce use cost simultaneously; Adopt the tactic pattern of guide pillar and spring, allow patrix and counterdie can not occur to greatest extent to offset when closed and after the ineffective power of patrix, to have certain resilience force voluntarily, this results in a fixing movement locus, produce the probability of deviation when decreasing operation, improve accuracy; The design of movable form, this kind of encapsulating mould can be replaced accordingly according to the shape of semiconductor components and devices, further increases serviceability, reduce use cost.
The above, be only embodiment of the present utility model, but protection range of the present utility model is not limited thereto, and any change of expecting without creative work or replacement, all should be encompassed within protection range of the present utility model.Therefore, the protection range that protection range of the present utility model should limit with claims is as the criterion.
Claims (6)
1. a high-precision semiconductor multi-purpose type encapsulating mould, it is characterized in that: comprise die shoe, and the counterdie be arranged on above die shoe, and the movable form be arranged on counterdie, and be arranged on movable form Nei Jiao road, and be arranged on the lamination slot of Jiao Dao both sides, and the suction hole be arranged in lamination slot, and be arranged on the arc groove of movable form end, and the guide pillar be arranged on above counterdie, and the spring be arranged on guide pillar, and the patrix be arranged on above guide pillar, and the guide pillar hole be arranged on patrix, and the gum-injecting port be arranged in the middle of patrix, and be arranged on the movable module of gum-injecting port both sides, described movable module has 4, is symmetrically distributed in the both sides of gum-injecting port.
2. a kind of high-precision semiconductor multi-purpose type encapsulating mould according to claim 1, is characterized in that: described guide pillar hole has 4, is symmetrically distributed in four arms of angle of patrix.
3. a kind of high-precision semiconductor multi-purpose type encapsulating mould according to claim 1, it is characterized in that: described guide pillar has 4, correspondence is positioned at the below in guide pillar hole.
4. a kind of high-precision semiconductor multi-purpose type encapsulating mould according to claim 1, is characterized in that: described spring has 4, and correspondence is distributed on guide pillar.
5. a kind of high-precision semiconductor multi-purpose type encapsulating mould according to claim 1, is characterized in that: described arc groove has 2, is symmetrically distributed in the two ends of movable form.
6. a kind of high-precision semiconductor multi-purpose type encapsulating mould according to claim 1, is characterized in that: described lamination slot has 4, is distributed in the both sides of Jiao Dao.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520252075.9U CN204596765U (en) | 2015-04-24 | 2015-04-24 | A kind of high-precision semiconductor multi-purpose type encapsulating mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520252075.9U CN204596765U (en) | 2015-04-24 | 2015-04-24 | A kind of high-precision semiconductor multi-purpose type encapsulating mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204596765U true CN204596765U (en) | 2015-08-26 |
Family
ID=53932889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520252075.9U Expired - Fee Related CN204596765U (en) | 2015-04-24 | 2015-04-24 | A kind of high-precision semiconductor multi-purpose type encapsulating mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204596765U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108987292A (en) * | 2017-06-05 | 2018-12-11 | 日月光半导体制造股份有限公司 | Packaging mold and semiconductor packaging process |
| TWI688054B (en) * | 2017-06-05 | 2020-03-11 | 日月光半導體製造股份有限公司 | Mold chase and method for making a package |
| CN115179489A (en) * | 2022-07-14 | 2022-10-14 | 铜陵中锐电子科技有限公司 | Semiconductor packaging mold and packaging method |
-
2015
- 2015-04-24 CN CN201520252075.9U patent/CN204596765U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108987292A (en) * | 2017-06-05 | 2018-12-11 | 日月光半导体制造股份有限公司 | Packaging mold and semiconductor packaging process |
| TWI688054B (en) * | 2017-06-05 | 2020-03-11 | 日月光半導體製造股份有限公司 | Mold chase and method for making a package |
| CN108987292B (en) * | 2017-06-05 | 2022-07-08 | 日月光半导体制造股份有限公司 | Packaging mold and semiconductor packaging process |
| CN115179489A (en) * | 2022-07-14 | 2022-10-14 | 铜陵中锐电子科技有限公司 | Semiconductor packaging mold and packaging method |
| CN115179489B (en) * | 2022-07-14 | 2024-04-30 | 铜陵中锐电子科技有限公司 | Semiconductor packaging mold and packaging method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150826 Termination date: 20200424 |