CN204566892U - The mini heat transfer machine of a kind of 3D vacuum - Google Patents

The mini heat transfer machine of a kind of 3D vacuum Download PDF

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Publication number
CN204566892U
CN204566892U CN201520019188.4U CN201520019188U CN204566892U CN 204566892 U CN204566892 U CN 204566892U CN 201520019188 U CN201520019188 U CN 201520019188U CN 204566892 U CN204566892 U CN 204566892U
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heating cabinet
vacuum
heating
alloy seal
dish
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晏国平
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Shenzhen City Yuxunda Electronic Co., Ltd.
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Yu Xunda Electronics Co Ltd Of Shenzhen
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Abstract

The utility model discloses the mini heat transfer machine of a kind of 3D vacuum, comprise heating cabinet, heating cabinet inner top is provided with circuit control panel, fan, vavuum pump, heat-generating pipe dish, and fan is positioned at above heat-generating pipe dish; The front of heating cabinet is provided with opening, after heating of metal pot body puts into opening, is combined into closed heating space with heating cabinet; In heating cabinet, the back lower place is provided with exhaust socket; Alloy seal dish is provided with in heating of metal pot body, alloy seal dish is provided with alloy seal frame, the groove that alloy seal frame lower end is offered is embedded with silica gel sealing film, and the groove that alloy seal dish upper periphery is offered is embedded with silica gel sealing ring, and alloy seal dish posterior end is provided with exhaust plug; Be provided with upper cover above heating cabinet, the dead ahead of upper cover is provided with display board, and upper tops is provided with vacuum display list.Compared with the vacuum hot transferred machine of the 3D of traditional approach, the utility model, based on Cycling hot-blast heating mode, accelerates the transmission of heat, makes temperature more even.

Description

The mini heat transfer machine of a kind of 3D vacuum
Technical field
The utility model relates to hot transfer apparatus technical field, specifically the mini heat transfer machine of a kind of 3D vacuum.
Background technology
Thermal-printing Technology is a kind of process for treating surface, by the means of hot stamping, makes the glued membrane with various pattern be overlying on article surface by Hot melt adhesive plaster, to improve value-added content of product.In the vacuum hot transferred field of 3D, in order to ensure quality and the efficiency of hot transfer printing, most important to the accuracy of heating and temperature control, stability.The accuracy of temperature, stability major embodiment are in time of heating, heating rate and heat affected zone temperature homogeneity.While increasingly automated application, also need the running precision possessing miniaturization, modularization, uniform and stable heating efficiency guarantee equipment.
The vacuum hot transferred machine of traditional 3D is generated heat by upper lower pot body and relies on heat radiation to carry out heating mould, is transferred object and heat-transferring printing paper.Mainly there is following problem in this traditional mode of heating: one, and traditional heating mode needs all to heat whole pot body cavity, cause temperature to rise slow, and power demand is large, so the vacuum hot transferred machine of traditional 3D all needs to adopt prior preheating; Two, the heating of pot body also can make the pot body exposed divide to there is high temperature safe hidden danger, and in use there will be smoke event; Three, traditional heating mode is generated heat by upper lower pot body, carry out heating mould by heat radiation, be transferred object and heat-transferring printing paper, be less than mould due to heat-transferring printing paper institute calorific requirement and be transferred object, actual add hanker heat-transferring printing paper temperature often higher than mould and the temperature being transferred object, make transferring effect general, color is bright-coloured not, true to nature.
Utility model content
The purpose of this utility model is to provide a kind of mini heat transfer machine of 3D vacuum based on Cycling hot-blast heating mode.
For achieving the above object, the utility model provides following technical scheme:
The mini heat transfer machine of a kind of 3D vacuum, comprise heating cabinet, described heating cabinet inner top is provided with circuit control panel, fan, vavuum pump, and described heating cabinet inner top is also provided with heat-generating pipe dish, and described fan is positioned at above heat-generating pipe dish; The front of described heating cabinet is provided with opening, for placing heating of metal pot body, after described heating of metal pot body puts into opening, is combined into closed heating space with heating cabinet; In described heating cabinet, the back lower place is provided with exhaust socket; Alloy seal dish is provided with in described heating of metal pot body, described alloy seal dish is provided with alloy seal frame, the groove that described alloy seal frame lower end is offered is embedded with silica gel sealing film, the groove that described alloy seal dish upper periphery is offered is embedded with silica gel sealing ring, and described alloy seal dish posterior end is provided with exhaust plug; Be provided with upper cover above described heating cabinet, the dead ahead of described upper cover is provided with display board, and described upper tops is provided with vacuum display list.
As further program of the utility model: described exhaust socket is arranged on below, center, rear portion in heating cabinet.
As further program of the utility model: described vacuum display list is arranged on upper tops dead astern.
As further program of the utility model: described alloy seal dish is fixed with at least 2 mould location column, for placing hot transfer printing body die.
As further program of the utility model: the quantity of described mould location column is 4, wherein in 2 mould location column in heating cabinet front, thermistor is housed, in order to detect the temperature of hot transfer printing body die.
Compared with prior art, the beneficial effects of the utility model are: the utility model, based on Cycling hot-blast heating mode, not only accelerates the transmission of heat, and make temperature more even, and hot transferring effect is better true to nature; The utility model effectively shortens hot transfer time, improves hot transfer efficiency.
Accompanying drawing explanation
Fig. 1 is the fractionation structural representation one of the mini heat transfer machine of a kind of 3D vacuum;
Fig. 2 is the fractionation structural representation two of the mini heat transfer machine of a kind of 3D vacuum;
Fig. 3 is the fractionation structural representation three of the mini heat transfer machine of a kind of 3D vacuum;
Fig. 4 is the fractionation structural representation four of the mini heat transfer machine of a kind of 3D vacuum;
Fig. 5 is the fractionation structural representation five of the mini heat transfer machine of a kind of 3D vacuum;
Fig. 6 is the combination schematic diagram of the mini heat transfer machine of a kind of 3D vacuum;
Fig. 7 is the circuit control panel circuit diagram one of the mini heat transfer machine of a kind of 3D vacuum;
Fig. 8 is the circuit control panel circuit diagram two of the mini heat transfer machine of a kind of 3D vacuum;
Fig. 9 is the circuit control panel circuit diagram three of the mini heat transfer machine of a kind of 3D vacuum;
Figure 10 is the circuit control panel circuit diagram four of the mini heat transfer machine of a kind of 3D vacuum;
Figure 11 is the circuit control panel circuit diagram five of the mini heat transfer machine of a kind of 3D vacuum;
Figure 12 is the circuit control panel circuit diagram six of the mini heat transfer machine of a kind of 3D vacuum;
Figure 13 is the circuit control panel circuit diagram seven of the mini heat transfer machine of a kind of 3D vacuum;
In figure: 1-heating cabinet, 2-circuit control panel, 3-fan, 4-vavuum pump, 5-heat-generating pipe dish, 6-heating of metal pot body, 7-exhaust socket, 8-alloy seal dish, 9-alloy seal frame, 10-silica gel sealing film, 11-silica gel sealing ring, 12-are vented plug, 13-upper cover, 14-display board, 15-vacuum display list.
Detailed description of the invention
Below in conjunction with the utility model embodiment and accompanying drawing, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
Refer to Fig. 1-Fig. 6, in the utility model embodiment, the mini heat transfer machine of a kind of 3D vacuum, comprise heating cabinet 1, heating cabinet 1 inner top is provided with circuit control panel 2, fan 3, vavuum pump 4, heating cabinet 1 inner top is also provided with heat-generating pipe dish 5, and one group of metal fan leaf of fan 3 is positioned at above heat-generating pipe dish 5; The front of heating cabinet 1 is provided with opening, for placing heating of metal pot body 6, after heating of metal pot body 6 puts into opening, is combined into closed heating space with heating cabinet 1; In heating cabinet 1, the back lower place is provided with exhaust socket 7, and preferably, exhaust socket 7 is arranged on below, center, rear portion in heating cabinet 1; Alloy seal dish 8 is provided with in heating of metal pot body 6, alloy seal dish 8 is provided with alloy seal frame 9, the groove that alloy seal frame 9 lower end is offered is embedded with silica gel sealing film 10, the groove that alloy seal dish 8 upper periphery is offered is embedded with silica gel sealing ring 11, and alloy seal dish 8 posterior end is provided with exhaust plug 12; Be provided with upper cover 13 above heating cabinet 1, the dead ahead of upper cover 13 is provided with display board 14, and upper cover 13 top is provided with vacuum display list 15, and preferably, vacuum display list 15 is arranged on dead astern, upper cover 13 top.Described alloy seal dish 8 is fixed with at least 2 mould location column, for placing hot transfer printing body die.Preferably, the quantity of mould location column is 4, wherein in 2 mould location column in heating cabinet 1 front, thermistor is housed, in order to detect the temperature of hot transfer printing body die.
Refer to Fig. 7-Figure 13, described circuit control panel 2 comprises photoelectrical coupler U1, photoelectrical coupler U2, photoelectrical coupler PU1, chip U4, three terminal integrated voltage stabilizer U6, chip U8, transformer T1, bidirectional triode thyristor SCE1, bidirectional triode thyristor SCE2; Wherein the model of photoelectrical coupler U1, photoelectrical coupler U2 is MOC3022, the model of photoelectrical coupler PU1 is PN8136, the model of chip U4 is STC15W408AS_20P, the model of three terminal integrated voltage stabilizer U6 is 78L05, the model of chip U8 is AT24C01, the model of transformer T1 is TRANS2, and the model of bidirectional triode thyristor SCE1 is BTA16-600, and the model of bidirectional triode thyristor SCE2 is BTA08; Concrete circuit structure is as follows:
The positive pole of the former limit light emitting diode of photoelectrical coupler U1 is connected with+5V DC voltage by resistance R3, one end of the secondary triode of photoelectrical coupler U1 is connected with output Zero line connector CP3, the other end of the secondary triode of photoelectrical coupler U1 is connected with AC zero wiring connector AC_N by resistance R5, and one end of the secondary triode of photoelectrical coupler U1 is also connected with resistance R5 by bidirectional triode thyristor SCE1; The positive pole of the former limit light emitting diode of photoelectrical coupler U2 is connected with+5V DC voltage by resistance R4, one end of the secondary triode of photoelectrical coupler U1 is connected with fan Zero line connector CP4, the other end of the secondary triode of photoelectrical coupler U1 is connected with AC zero wiring connector AC_N by resistance R6, and one end of the secondary triode of photoelectrical coupler U1 is also connected with resistance R6 by bidirectional triode thyristor SCE2;
AC zero wiring connector AC_N is connected with output live wire connector CP2 by thermistor RZ1, export live wire connector CP2 to be connected with fan live wire connector CP1, AC zero wiring connector AC_N is connected with interchange live wire connector AC_L by fuse F1, exchanges live wire connector AC_L and is connected with output live wire connector CP2 by fuse F1, AC zero wiring connector AC_N is connected with fuse F1 by electric capacity CX1, fuse F1 is connected with 1 pin of common mode inductance CM1 by resistance R20, 3 pin of common mode inductance CM1 are connected with AC zero wiring connector AC_N, 2 pin of common mode inductance CM1 are by diode D1, inductance L 1 is connected with 1 pin of transformer T1, 4 pin of common mode inductance CM1 are connected with inductance L 1 by diode D3, 2 pin of common mode inductance CM1 are by diode D2, diode D4 is connected with 4 pin of common mode inductance CM1, 2 pin of common mode inductance CM1 are held by diode D2 and GND1 and are connected, 2 pin of common mode inductance CM1 are by diode D1, electrochemical capacitor EC1 and GND1 holds connection, 1 pin of transformer T1 is held by electrochemical capacitor EC2 and GND1 and is connected, 2 pin of transformer T1 are by diode D5, resistance R7, electric capacity C6 is connected with 1 pin of transformer T1, resistance R7, electric capacity C6 is in parallel, 2 pin of transformer T1 are connected with 8 pin of driving chip U3, 8 pin of driving chip U3 are connected with 7 pin of driving chip U3, 1 pin of driving chip U3 is held with GND1 and is connected, 2 pin of driving chip U3 are held by electrochemical capacitor EC3 and GND1 and are connected, 3 pin of driving chip U3 are held by resistance R9 and GND1 and are connected, 4 pin of driving chip U3 are held by electric capacity C2 and GND1 and are connected, 4 pin of driving chip U3 are connected with one end of the secondary triode of photoelectrical coupler PU1, the other end of the secondary triode of photoelectrical coupler PU1 is held with GND1 and is connected, the positive pole of the former limit light emitting diode of photoelectrical coupler PU1 is connected with+12V DC voltage by resistance R12, the positive pole of the former limit light emitting diode of photoelectrical coupler PU1 is by resistance R12, resistance R13 is connected with the negative pole of the former limit light emitting diode of photoelectrical coupler PU1, the negative pole of the former limit light emitting diode of photoelectrical coupler PU1 is by Zener diode ZD1 ground connection, 1 pin of driving chip U3 is connected with 3 pin of transformer T1, 4 pin of transformer T1 are by diode D6, resistance R8 is connected with 2 pin of driving chip U3, 5 pin of transformer T1 are by diode D7, inductance L 2, resistance R11 is connected with the input of three terminal integrated voltage stabilizer U6, the voltage of+12V is connected with the input of three terminal integrated voltage stabilizer U6 by resistance R11, 6 pin of transformer T1 are connected with 1 pin of transformer T1 by electric capacity CY1, 5 pin of transformer T1 are by diode D7, electrochemical capacitor EC4 ground connection, the input of three terminal integrated voltage stabilizer U6 is by resistance R11, electrochemical capacitor EC5 ground connection, the input of three terminal integrated voltage stabilizer U6 is connected with+5V voltage, the input of three terminal integrated voltage stabilizer U6 is by electrochemical capacitor EC6 ground connection, the earth terminal ground connection of three terminal integrated voltage stabilizer U6, the output of three terminal integrated voltage stabilizer U6 is by resistance RT1, electric capacity C3 ground connection, resistance RT1 is also by resistance R2 ground connection,
3 pin of chip U4 are by resistance R2 ground connection, 4 pin of chip U4 are connected with 2 pin of thermistor connector CN1, 2 pin of thermistor connector CN1 are by resistance R1, electric capacity C1 ground connection, resistance R1, electric capacity C1 is in parallel, 1 pin of thermistor connector CN1 is connected with+5V voltage, 5 pin of chip U4 are connected with 6 pin of chip U4 by buzzer Y1, 5 pin of chip U4 are by electric capacity C7 ground connection, 6 pin of chip U4 are by electric capacity C8 ground connection, 8 pin of chip U4 are connected with+5V voltage, 8 pin of chip U4 are by electric capacity C4 ground connection, 9 pin of chip U4 are held with the P of triode Q2 by resistance R14 and are connected, one N of triode Q2 holds ground connection, another N end of triode Q2 is connected with 2 pin of vavuum pump connector CN3, 2 pin of vavuum pump connector CN3 are by diode D8, electric capacity C5 is connected with 1 pin of vavuum pump connector CN3, diode D8, electric capacity C5 is in parallel, 1 pin of vavuum pump connector CN3 is connected with+12V voltage, the 10 pin ground connection of chip U4, 11 pin of chip U4 are connected with the negative pole of the former limit light emitting diode of photoelectrical coupler U1, 12 pin of chip U4 are connected with 5 pin of LED display board connector CN2, 13 pin of chip U4 are connected with 4 pin of LED display board connector CN2, 14 pin of chip U4 are connected with 3 pin of LED display board connector CN2, 2 pin of LED display board connector CN2 are connected with+5V voltage, 2 pin of LED display board connector CN2 are connected with 1 pin of LED display board connector CN2 by electrochemical capacitor EC7, the 1 pin ground connection of LED display board connector CN2, 15 pin of chip U4 are connected with 5 pin of chip U8, 16 pin of chip U4 are connected with 6 pin of chip U8, 1 pin of chip U8, 2 pin of chip U8, 3 pin of chip U8, 4 pin of chip U8, the equal ground connection of 7 pin of chip U8, 5 pin of chip U8 are connected with 8 pin of chip U8 by resistance R15, 6 pin of chip U8 are connected with 8 pin of chip U8 by resistance R16, 17 pin of chip U4 are connected with the negative pole of the former limit light emitting diode of photoelectrical coupler U2, 18 pin of chip U4 are held with the P of triode Q1 by resistance R10 and are connected, one N of triode Q1 holds ground connection, another N end of triode Q1 is connected with one end of buzzer B1, the other end of buzzer B1 is connected with+12V voltage by resistance R17.
The operating procedure of the mini heat transfer machine of described 3D vacuum is: first will be transferred object and be enclosed within mould, then being posted by the heat-transferring printing paper bag of printed picture is being transferred on object, then be placed on the mould location silicagel column in alloy seal dish 8, lock movable alloy seal frame 9, make sealing in alloy seal dish 8, the alloy seal dish 8 of good seal is buckled in after in heating of metal pot body 6, heating of metal pot body 6 is loaded in heating cabinet 1, exhaust plug 12 on alloy seal dish 8 inserts in the exhaust socket 7 of below, center, rear portion in heating cabinet 1, open the power supply of vavuum pump 4, vacuumize in alloy seal disc 8, utilize the elasticity of silica gel sealing film 10 to realize closely knit coated to transferred object surface of heat-transferring printing paper, start heating power supply and fan power supply, the heat that heat-generating pipe dish 5 is produced is blown into heating of metal pot body 6 and makes to be transferred object and mold heated realizes hot transferring effect.
Compared with the vacuum hot transferred machine of the 3D of traditional approach, the utility model, based on Cycling hot-blast heating mode, not only accelerates the transmission of heat, and makes temperature more even, and hot transferring effect is better true to nature; The utility model effectively shortens hot transfer time, improves hot transfer efficiency.
To those skilled in the art, obvious the utility model is not limited to the details of above-mentioned one exemplary embodiment, and when not deviating from spirit of the present utility model or essential characteristic, can realize the utility model in other specific forms.Therefore, no matter from which point, all should embodiment be regarded as exemplary, and be nonrestrictive, scope of the present utility model is limited by claims instead of above-mentioned explanation, and all changes be therefore intended in the implication of the equivalency by dropping on claim and scope are included in the utility model.
In addition, be to be understood that, although this description is described according to embodiment, but not each embodiment only comprises an independently technical scheme, this narrating mode of description is only for clarity sake, those skilled in the art should by description integrally, and the technical scheme in each embodiment also through appropriately combined, can form other embodiments that it will be appreciated by those skilled in the art that.

Claims (5)

1. the mini heat transfer machine of 3D vacuum, comprise heating cabinet (1), it is characterized in that, described heating cabinet (1) inner top is provided with circuit control panel (2), fan (3), vavuum pump (4), described heating cabinet (1) inner top is also provided with heat-generating pipe dish (5), and described fan (3) is positioned at heat-generating pipe dish (5) top; The front of described heating cabinet (1) is provided with opening, for placing heating of metal pot body (6), after described heating of metal pot body (6) puts into opening, is combined into closed heating space with heating cabinet (1); Described heating cabinet (1) the interior back lower place is provided with exhaust socket (7); Alloy seal dish (8) is provided with in described heating of metal pot body (6), described alloy seal dish (8) is provided with alloy seal frame (9), the groove that described alloy seal frame (9) lower end is offered is embedded with silica gel sealing film (10), the groove that described alloy seal dish (8) upper periphery is offered is embedded with silica gel sealing ring (11), and described alloy seal dish (8) posterior end is provided with exhaust plug (12); Described heating cabinet (1) top is provided with upper cover (13), and the dead ahead of described upper cover (13) is provided with display board (14), and described upper cover (13) top is provided with vacuum display list (15).
2. the mini heat transfer machine of 3D vacuum according to claim 1, is characterized in that, described exhaust socket (7) is arranged on below, center, heating cabinet (1) interior rear portion.
3. the mini heat transfer machine of 3D vacuum according to claim 1, is characterized in that, described vacuum display list (15) is arranged on upper cover (13) dead astern, top.
4., according to the arbitrary described mini heat transfer machine of 3D vacuum of claim 1-3, it is characterized in that, described alloy seal dish (8) is fixed with at least 2 mould location column, for placing hot transfer printing body die.
5. the mini heat transfer machine of 3D vacuum according to claim 4, it is characterized in that, the quantity of described mould location column is 4, wherein in 2 mould location column in heating cabinet (1) front, thermistor is housed, in order to detect the temperature of hot transfer printing body die.
CN201520019188.4U 2015-01-12 2015-01-12 The mini heat transfer machine of a kind of 3D vacuum Active CN204566892U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107351561A (en) * 2017-05-24 2017-11-17 广州百赛贸易有限公司 A kind of ceramic cup surfaces externally and internally impression handling process
CN111907203A (en) * 2020-09-03 2020-11-10 义乌泰乐机械设备有限公司 Tunnel furnace batch 3D heat transfer machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107351561A (en) * 2017-05-24 2017-11-17 广州百赛贸易有限公司 A kind of ceramic cup surfaces externally and internally impression handling process
CN111907203A (en) * 2020-09-03 2020-11-10 义乌泰乐机械设备有限公司 Tunnel furnace batch 3D heat transfer machine

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Address after: 518000, Shenzhen, Guangdong, Baoan District Guanlan street community high and new technology park 1900044, three or four floor

Patentee after: Shenzhen City Yuxunda Electronic Co., Ltd.

Address before: 518000, Shenzhen, Guangdong, Baoan District Guanlan street community high and new technology park 1900044, three or four floor

Patentee before: Yu Xunda Electronics Co., Ltd. of Shenzhen