CN204539625U - PCB cooling device after a kind of pressing - Google Patents
PCB cooling device after a kind of pressing Download PDFInfo
- Publication number
- CN204539625U CN204539625U CN201420717910.7U CN201420717910U CN204539625U CN 204539625 U CN204539625 U CN 204539625U CN 201420717910 U CN201420717910 U CN 201420717910U CN 204539625 U CN204539625 U CN 204539625U
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- China
- Prior art keywords
- pcb
- section
- cooling
- cooling device
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 71
- 238000003825 pressing Methods 0.000 title abstract description 5
- 238000003475 lamination Methods 0.000 claims description 18
- 239000000498 cooling water Substances 0.000 claims description 10
- 238000005553 drilling Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 241001074085 Scophthalmus aquosus Species 0.000 abstract description 2
- 230000007423 decrease Effects 0.000 abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 2
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 238000005057 refrigeration Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
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- Metal Rolling (AREA)
Abstract
PCB cooling device after a kind of pressing provided by the utility model, it comprises a body, described body by some coiler fans, sun formula delivery section, can form controlled cooling model room; Wherein, described sun formula delivery section comprises one and enters plate section and an ejecting plate section, described in enter plate section entering for pcb board after pressing, described ejecting plate section is used for shifting out of pcb board after pressing; Can controlled cooling model room for regulating chilling temperature, comprise chilled water unit and thermostat arrangement; Described coiler fan is positioned at and above controlled cooling model room, can connects with chilled water unit; Described can one end, controlled cooling model room with enter plate section and connect, the other end connects with ejecting plate section.Described cooling device leading portion connects with torn edges station, and back segment connects with brill target station, thus, reduces production intensity, decreases the probability wiping card face; Improve production efficiency, decrease plate cooling cycle.
Description
Technical Field
The utility model relates to a printed wiring board preparation technical field especially relates to a PCB cooling device behind pressfitting.
Background
Nowadays, electronic technology is more and more diverse, and the PCB is also used as a basic PCB for electronic technology development and has never been developed and applied. At the present stage, the board surface of the PCB still has a certain inevitable temperature after hot pressing and cold pressing, the temperature of the board is usually between 40 ℃ and 60 ℃, the size of the board cannot be stabilized, and further the next target drilling process cannot be directly carried out, and generally, manual picking, placing and carrying are adopted, so that the board is easily scratched and scrapped.
At present, the universal use in the industry is that a multi-layer frame is added with a fan or cooled by natural wind, so that the operation action is increased, meanwhile, the PCB manufacturing period is prolonged (according to statistics, the average time consumption of a cold plate is more than or equal to 6H), and the temperature requirement of cooling the plate to an air conditioning room cannot be completely met.
Thus, the prior art is in need of improvement and advancement.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned prior art not enough, the utility model aims at providing a PCB cooling device behind pressfitting aims at solving the problem that the flower plate, the plate refrigeration cycle length are wiped easily that current PCB cooling device exists.
The technical scheme of the utility model as follows:
a PCB cooling device after lamination comprises a body, wherein the body consists of a plurality of coil fans, a solar conveying section and a controllable cooling chamber; wherein,
the solar conveying section comprises a board inlet section and a board outlet section, the board inlet section is used for the entry of the PCB after lamination, and the board outlet section is used for the exit of the PCB after lamination;
the controllable cooling chamber is used for adjusting the cooling temperature and comprises a cooling water device and a temperature controller device;
the coil pipe fan is positioned above the controllable cooling chamber and is connected with the cooling water device;
one end of the controllable cooling chamber is connected with the plate inlet section, and the other end of the controllable cooling chamber is connected with the plate outlet section.
PCB cooling device behind the pressfitting, wherein, the bottom of body is provided with 8 universal wheels.
PCB cooling device behind the pressfitting, wherein, the coil pipe fan sets for 2.
And the PCB cooling device after lamination, wherein the temperature controller device controls the temperature range to be 22-32 ℃.
And the PCB cooling device after lamination, wherein the front section of the cooling device is connected with the edge tearing station, and the rear section of the cooling device is connected with the target drilling station.
The utility model provides a PCB cooling device behind pressfitting compares the preceding following advantage that has:
A. the production intensity is reduced, and the probability of wiping the face of the flower plate is reduced: the front section of the cooling device is connected with the edge tearing station, and the rear section of the cooling device is connected with the target drilling station, so that the target drilling process can be directly carried out after the board is lowered, the manual board taking and placing and carrying actions are reduced, and the probability of wiping the board surface is reduced;
B. the production efficiency is improved, and the plate refrigeration cycle is reduced: the cooling device is provided with a cooling chamber with adjustable temperature, so that the pressed plate passes through the cooling chamber at a constant speed through the solar conveying section, and the aim of cooling the plate is fulfilled; meanwhile, a closed space for adding cooling water to the coil fan is designed, the temperature in the cooling chamber device can be controlled to be set according to the requirement of the ambient temperature of the target drilling machine, and the temperature of the plate after passing through the device is ensured to be consistent with the requirement of the target drilling machine.
Drawings
Fig. 1 is a schematic perspective view of a PCB cooling device after lamination according to a preferred embodiment of the present invention.
Detailed Description
The utility model provides a PCB cooling device behind pressfitting, for making the utility model discloses a purpose, technical scheme and effect are clearer, clear and definite, and it is right that the embodiment is lifted to follow with reference to the drawing the utility model discloses further detailed description. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Please refer to fig. 1, which is a schematic diagram illustrating a PCB cooling apparatus after lamination according to a preferred embodiment of the present invention. As shown in the figure, the post-lamination PCB cooling device includes a body, and the body is composed of a plurality of coil fans 100, a solar conveying section 200, and a controllable cooling chamber 300; the bottom of body is provided with 8 universal wheels. Preferably, the present embodiment sets the number of the coil fans 100 to 2. The solar conveying section 200 comprises a board inlet section 210 and a board outlet section 220, wherein the board inlet section 210 is used for the entry of the PCB after lamination, and the board outlet section 220 is used for the exit of the PCB after lamination; the controllable cooling chamber 300 is used for adjusting the cooling temperature, and includes a cooling water device and a thermostat device (not shown in the figure); the coil fan 100 is positioned above the controllable cooling chamber 300 and connected with a cooling water device; the controllable cooling chamber 300 is connected to the inlet plate section 210 at one end and the outlet plate section 220 at the other end.
Particularly, in the embodiment of the utility model provides an in, the PCB board after tearing the limit directly puts into board section 210 and gets into, solar formula conveying section 200 begins the operation, send into the PCB board at the uniform velocity in steerable cooling chamber 300, steerable cooling chamber 300 top design has 2 coil pipe fans, the cooling water device in the steerable cooling chamber 300 is inserted to the coil pipe fan, simultaneously through temperature controller device control cooling temperature, preferably, set for the controlled temperature scope and be 22-32 ℃, the plate can carry out next brill target flow after moving to board section 220 in proper order from going into board section 210.
Further, in this embodiment, the front section of the cooling device is connected to the edge tearing station, and the rear section of the cooling device is connected to the target drilling station, so that the PCB board with the torn edge can be directly put into the cooling device, and can directly enter the next target drilling process after being cooled, thereby reducing the actions of carrying, taking and placing the board by personnel, preventing the board from being scratched, and reducing the refrigeration cycle of the board.
To sum up, the PCB cooling device after lamination provided by the utility model comprises a body, wherein the body is composed of a plurality of coil fans, a solar conveying section and a controllable cooling chamber; the solar conveying section comprises a board inlet section and a board outlet section, the board inlet section is used for the entry of the PCB after lamination, and the board outlet section is used for the exit of the PCB after lamination; the controllable cooling chamber is used for adjusting the cooling temperature and comprises a cooling water device and a temperature controller device; the coil pipe fan is positioned above the controllable cooling chamber and is connected with the cooling water device; one end of the controllable cooling chamber is connected with the plate inlet section, and the other end of the controllable cooling chamber is connected with the plate outlet section. The front section of the cooling device is connected with the edge tearing station, and the rear section of the cooling device is connected with the drilling target station, so that the production strength is reduced, and the probability of wiping the face of the flower plate is reduced; the production efficiency is improved, and the refrigeration cycle of the plate is reduced.
It is to be understood that the invention is not limited to the above-described embodiments, and that modifications and variations may be made by those skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (5)
1. A PCB cooling device after lamination is characterized by comprising a body, wherein the body consists of a plurality of coil fans, a solar conveying section and a controllable cooling chamber; wherein,
the solar conveying section comprises a board inlet section and a board outlet section, the board inlet section is used for the entry of the PCB after lamination, and the board outlet section is used for the exit of the PCB after lamination;
the controllable cooling chamber is used for adjusting the cooling temperature and comprises a cooling water device and a temperature controller device;
the coil pipe fan is positioned above the controllable cooling chamber and is connected with the cooling water device;
one end of the controllable cooling chamber is connected with the plate inlet section, and the other end of the controllable cooling chamber is connected with the plate outlet section.
2. The post-press PCB cooling device of claim 1, wherein the bottom of the body is provided with 8 universal wheels.
3. The post-lamination PCB cooling device of claim 1, wherein the number of the coil fans is set to 2.
4. The post-press PCB cooling device of claim 1, wherein the temperature controller controls the temperature to be in a range of 22-32 ℃.
5. The post-press PCB cooling device of claim 1, wherein the cooling device has a front section connected to the edge tearing station and a rear section connected to the target drilling station.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420717910.7U CN204539625U (en) | 2014-11-26 | 2014-11-26 | PCB cooling device after a kind of pressing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420717910.7U CN204539625U (en) | 2014-11-26 | 2014-11-26 | PCB cooling device after a kind of pressing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204539625U true CN204539625U (en) | 2015-08-05 |
Family
ID=53753581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420717910.7U Expired - Fee Related CN204539625U (en) | 2014-11-26 | 2014-11-26 | PCB cooling device after a kind of pressing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204539625U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107889379A (en) * | 2017-11-20 | 2018-04-06 | 江西景旺精密电路有限公司 | Cooling means and device after a kind of PCB pressings |
-
2014
- 2014-11-26 CN CN201420717910.7U patent/CN204539625U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107889379A (en) * | 2017-11-20 | 2018-04-06 | 江西景旺精密电路有限公司 | Cooling means and device after a kind of PCB pressings |
| CN107889379B (en) * | 2017-11-20 | 2020-08-18 | 江西景旺精密电路有限公司 | Cooling method and device after PCB lamination |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150805 Termination date: 20211126 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |