CN204514771U - A kind of condensed fluid corrosion simulated experiment device - Google Patents
A kind of condensed fluid corrosion simulated experiment device Download PDFInfo
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- CN204514771U CN204514771U CN201520054113.XU CN201520054113U CN204514771U CN 204514771 U CN204514771 U CN 204514771U CN 201520054113 U CN201520054113 U CN 201520054113U CN 204514771 U CN204514771 U CN 204514771U
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Abstract
The utility model discloses a kind of condensed fluid analogue experiment installation, it comprises experiment container, lid, admission line and outlet pipe, the middle part of lid is provided with opening, work sample is respectively arranged with from bottom to top from opening part, semiconductor wafer and heat sink, work sample, screw rod is passed through between semiconductor wafer and heating radiator three, bolt coordinates fixing, work sample is step-like, at the upper surface of work sample, semiconductor wafer is installed, semiconductor wafer is connected with controller, semiconductor wafer is divided into thermoae district and cold polar region, cold polar region is close at the back side of work sample, thermoae district is close to by heat sink.By arranging semiconductor wafer at work specimen surface, reached the object of Simulated Water steam and other corrosivity escaping gas condensation by the temperature controlling semiconductor wafer, can accurate simulation wet gas, wet CO
2the corrosion condition that conveyance conduit and other volatile corrosion gas cause at pipeline and equipment surface formation condensed fluid.
Description
Technical field
The utility model belongs to material corrosion and guard technology field, is specifically related to a kind of condensed fluid corrosion simulated experiment device.
Background technology
Wet gas and wet CO
2in course of conveying, because pipeline external heat-insulation layer breaks, the reasons such as heat insulation effect is not good may cause the temperature of tube wall surface to be starkly lower than pipe interior rock gas or CO
2temperature, for submarine pipeline or non-buried pipeline, this temperature difference will be more obvious, the moisture of inner-walls of duct and other volatile matter form condensed fluid in tube wall surface condensation, pipeline generation condensed fluid is caused to corrode, this kind of corrosion mainly occurs in pipe interior the first half (9 o'clock to 3 o'clock parts), also referred to as top part corrosion, similar with dew point corrosion.
For the corrosion simulated research of condensed fluid, only has the accuracy accurately controlling the temperature of condensed fluid or the corrosion simulated result of temperature guarantee on test sample surface.Patent CN102692438A discloses a kind of dew point corrosion experiment device that can realize electro-chemical test, this device carries out condensing cooling by chilled water to condenser pipe, under the effect of chilled water, make the corrosive gas in condenser pipe and water vapor form dewdrop at test sample surface condensation, but this mode accurately can not control the temperature of test surfaces; Patent CN1657901A discloses a kind of high-temp high-pressure condensation water corrosion simulated experiment device, it by installing condenser in high temperature and high pressure kettle, the temperature controlling water in condenser controls vertically arranged specimen surface temperature on condenser sidewall, if a predetermined specimen surface temperature need be stabilized in need the long period, and be not easy to control, this must impact experimental result; In addition, due to sample at right angle setting, can drip under the effect at self gravitation at the drop of specimen surface condensation, the corrosion condition of wet gas pipe interior condensing droplet on inside pipe wall the first half surface can not be simulated.
Utility model content
Based on the technical matters existed in above-mentioned prior art, the utility model proposes a kind of condensed fluid analogue experiment installation, this device accurately can control condensate temperature; Work sample level is installed, more close to the corrosion condition that pipeline top condensed fluid causes.
Its technical solution comprises:
A kind of condensed fluid corrosion simulated experiment device, it comprises experiment container, lid, admission line and outlet pipe, described experiment container top is provided with flange, described lid is for sealing described experiment container, splendid attire corrosive liquid in described experiment container, described admission line, outlet pipe all stretches in described experiment container, described admission line stretches into below etching fluid, described outlet pipe is positioned at more than etching fluid, the middle part of described lid is provided with opening, work sample is respectively arranged with from bottom to top from described opening part, semiconductor wafer and heat sink, described work sample, screw rod is passed through between semiconductor wafer and heating radiator three, bolt coordinates fixing, described work sample is step-like, the upper surface of described work sample installs described semiconductor wafer, described semiconductor wafer is connected with controller, described semiconductor wafer is divided into thermoae district and cold polar region, described cold polar region is close at the back side of described work sample, described thermoae district is close to by described heat sink, the heat that described semiconductor wafer produces sheds from thermoae district through heat sink.
As a preferred version of the present utility model, above-mentioned flange is distributed with semi-circular recesses, in above-mentioned groove, is filled with O-ring seal.
As another preferred version of the present utility model, the upper and lower of above-mentioned lid is respectively arranged with the geometrical clamp being greater than above-mentioned lid area, above-mentioned geometrical clamp two ends are provided with screw rod and the bolt that is mated, and above-mentioned lid and experiment container to be connected with bolt by above-mentioned screw rod and to seal.
Described work sample directly contacts with the cold polar region of semiconductor wafer.The utility model proposes a kind of condensed fluid corrosion simulated experiment device, it arranges semiconductor wafer at work specimen surface, controlled by the temperature of controller to semiconductor wafer, reach the object of Simulated Water steam and other corrosivity escaping gas condensation by controlling the temperature of semiconductor wafer, and be reach object to water vapor and other corrosivity escaping gas condensations by the temperature of controlled cooling model water in prior art; Obviously, the utility model can make specimen surface arrive predetermined temperature fast by semiconductor wafer, and easy to operate easy to control, and in prior art by chilled water by work specimen surface temperature stabilization at a certain predetermined temperature, need the long period, the accuracy of experimental result can be affected.
The utility model by inlaying work sample on lid, work specimen surface installs semiconductor wafer, the cold polar region of semiconductor wafer is close to by work sample, the thermoae district of semiconductor wafer is close to by heat sink, makes the water vapor in experiment container and other corrosive gass at the surface condensation of sample that works under the peltier effect of semiconductor wafer; Due to the temperature of the cold pole of semiconductor wafer can be controlled rapidly and accurately, accurately condensate temperature can be controlled; Work sample level is installed, more close to the corrosion condition that pipeline top condensed fluid causes.
The utility model adopts the peltier effect of semiconductor wafer, can control to work in the corrosion simulated experiment of condensed fluid specimen surface (and condensed fluid) temperature rapidly and accurately, accurate simulation wet gas and wet CO
2conveyance conduit surface condensate corrosion condition.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, explanation clear, complete is further done to the utility model:
Fig. 1 is the structural representation of the utility model condensed fluid corrosion simulated experiment device;
In figure, 1, experiment container, 2, geometrical clamp, 3, screw rod and bolt, 4, admission line, 5, work sample, 6, heat sink, 7, screw rod and bolt, 8, semiconductor wafer, 9, outlet pipe, 10, O-ring seal, 11, lid.
Embodiment
The utility model discloses a kind of condensed fluid corrosion simulated experiment device, in order to make advantage of the present utility model, technical scheme clearly, clearly, below in conjunction with specific embodiment, explanation clear, complete further being done to the utility model.
Shown in composition graphs 1, the utility model, a kind of condensed fluid corrosion simulated experiment device, it comprises experiment container 1, lid 11, admission line 4 and outlet pipe 9, splendid attire etchant solution in experiment container 1, experiment container 1 and lid 11 are made by the material of corrosion resistance, flange is had at experiment container 1 top, flange is distributed with semi-circular recesses, the diameter of lid 11 is identical with the lip diameter of experiment container 1, namely lid 11 can cover the opening at experiment container 1 top completely, O-ring seal 10 is filled with in groove, the preferred O-ring seal 10 of the utility model is O type circle, O-ring seal 10 better seals to allow between lid and experiment container, geometrical clamp 2 is laid with above and below lid 11, the area of geometrical clamp 2 is greater than the area of lid 11, and after it covers lid, remaining i.e. extended spot around, at extended spot, screw rod and bolt are set, by screw rod and bolt, geometrical clamp is fixed, the sealing to lid 11 and experiment container 1 can be realized.
In lid 11 upper shed, inlay step-like work sample 5, the working surface of work sample 5 is concordant with the lower surface of lid 11, the upper surface of work sample 5 installs semiconductor wafer 8, the top of semiconductor wafer 8 arranges heat sink 6, the cold polar region of semiconductor wafer 8 is close at the back side of work sample 5, the thermoae district of semiconductor wafer 8 is close to by heat sink 6, work sample 5 is except working surface with except semiconductor wafer cold junction surface in contact, remaining surface all makes insulation processing, avoid crevice corrosion occurs, heat sink 6, be fixed by standing screw and bolt 7 between semiconductor wafer 8 and work sample 5, respectively experimental gas is passed into by admission line 4 and outlet pipe 9 before experiment and in experimentation, tail gas is discharged experiment container 1.
Semiconductor wafer 8 is connected with controller, controlled by the temperature of controller to semiconductor wafer 8 cold junction and work sample 5, the heat that semiconductor wafer 8 hot junction produces is dispelled the heat by heat sink 6, water vapor in experiment container 1 and other corrosive gass form condensed fluid at the surface condensation of work sample, corrosion is caused to work sample 5, if the condensation process of work specimen surface need be observed, endoscope can be inserted in experiment container lid 11 upper shed and observe.
Embodiment 1:
The present embodiment is mainly for normal pressure experiment container, and a kind of condensed fluid corrosion simulated experiment device, is made up of experiment container 1 and lid 11, and experiment container 1 and lid 11 make by the material of corrosion resistance; Add experimental solutions in experiment container 1, in the groove of the flange of experiment container 1, put into an O-ring seal 10; Experiment container 1 and lid are sealed;
In experiment container lid 11 upper shed, inlay step-like work sample 5, the working surface of work sample 5 is concordant with the lower surface of lid 11.Work sample 5 upper surface installs semiconductor wafer 8, and work sample 5 back side is close to the cold of semiconductor wafer 8 and is extremely gone up, heat sink 6 be close to semiconductor wafer 8 thermoae on; Work sample 5 remaining surface except working surface and the back side all makes insulation processing, avoids crevice corrosion occurs.
Heat sink 6, to be fixed by standing screw and bolt 7 between semiconductor wafer 8 and work sample 5, by draft tube 4 and escape pipe 9 experimental gas to be passed into before experiment and in experimentation and tail gas discharges experiment container 1.
Controlled by the temperature of controller to semiconductor wafer 8 cold junction and work sample 5, the heat that semiconductor wafer 8 hot junction produces is dispelled the heat by heat sink 6; Water vapor in experiment container 1 and and other corrosive gass work sample surface condensation formed condensed fluid, to work sample 5 cause corrosion.If the condensation process of work specimen surface need be observed, endoscope can be inserted in experiment container lid 11 upper shed and observe.
Embodiment 2:
This example is mainly for the experiment container of high temperature and high pressure kettle class, installment work sample 5 on kettle cover, work sample 5 upper surface installs semiconductor wafer 8, the work sample back side is close to the cold of semiconductor wafer 8 and is extremely gone up, heat sink 6 be close to semiconductor wafer 8 thermoae on, other connected mode is identical with normal pressure experiment container.
The cardinal principle analogy method of above-described embodiment 1, comprises the following steps:
In experiment container 1, add experimental solutions, in the groove of the flange of experiment container 1, put into an O-ring seal 10; Experiment container 1 and lid 11 are fixed by upper and lower two panels geometrical clamp 2 and standing screw and bolt 3, are sealed by O-ring seal 10; In lid 11 upper shed, inlay step-like work sample 5, the working surface of work sample 5 is concordant with the lower surface of lid 11, work sample 5 surface mount semiconductor wafer 8, the cold polar region of semiconductor wafer 8 is close at the work sample back side, and the thermoae district of semiconductor wafer 8 is close to by heat sink 6; Work sample 5 is except working surface and the back side, and remaining surface all makes insulation processing, avoids crevice corrosion occurs; Heat sink 6, to be fixed by standing screw and bolt 7 between semiconductor wafer 8 and work sample 5, by admission line 4 and outlet pipe 9 experimental gas to be passed into before experiment and in experimentation and tail gas discharges experiment container 1.
The temperature of setting condensed fluid, controlled by the temperature of controller to semiconductor wafer 8 cold junction and work sample 5, the heat that semiconductor wafer 8 hot junction produces is dispelled the heat by heat sink 6; Water vapor in experiment container 1 and and other corrosive gass work sample surface condensation formed condensed fluid, to work sample 5 cause corrosion.If the condensation process of work specimen surface need be observed, endoscope can be inserted in experiment container lid 11 upper shed and observe.
Claims (4)
1. a condensed fluid corrosion simulated experiment device, it comprises experiment container, lid, admission line and outlet pipe, described experiment container top is provided with flange, described lid is for sealing described experiment container, splendid attire corrosive liquid in described experiment container, described admission line, outlet pipe all stretches in described experiment container, described admission line stretches into below etching fluid, described outlet pipe is positioned at more than etching fluid, it is characterized in that: the middle part of described lid is provided with opening, work sample is respectively arranged with from bottom to top from described opening part, semiconductor wafer and heat sink, described work sample, screw rod is passed through between semiconductor wafer and heating radiator three, bolt coordinates fixing, described work sample is step-like, the upper surface of described work sample installs described semiconductor wafer, described semiconductor wafer is connected with controller, described semiconductor wafer is divided into thermoae district and cold polar region, described cold polar region is close at the back side of described work sample, described thermoae district is close to by described heat sink, the heat that described semiconductor wafer produces sheds from thermoae district through heat sink.
2. condensed fluid corrosion simulated experiment device according to claim 1, is characterized in that: described flange is distributed with semi-circular recesses, is filled with O-ring seal in described groove.
3. condensed fluid corrosion simulated experiment device according to claim 1, it is characterized in that: the upper and lower of described lid is respectively arranged with the geometrical clamp being greater than described lid area, described geometrical clamp two ends are provided with screw rod and the bolt that is mated, and described lid and experiment container to be connected with bolt by described screw rod and to seal.
4. condensed fluid corrosion simulated experiment device according to claim 1, is characterized in that: described work sample directly contacts with the cold polar region of semiconductor wafer.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520054113.XU CN204514771U (en) | 2015-01-27 | 2015-01-27 | A kind of condensed fluid corrosion simulated experiment device |
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| CN201520054113.XU CN204514771U (en) | 2015-01-27 | 2015-01-27 | A kind of condensed fluid corrosion simulated experiment device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104634724A (en) * | 2015-01-27 | 2015-05-20 | 中国石油化工股份有限公司 | Condensate corrosion simulation experiment device and method |
| CN114428051A (en) * | 2020-10-29 | 2022-05-03 | 中国石油化工股份有限公司 | Dew point corrosion assessment device with controllable condensation temperature |
-
2015
- 2015-01-27 CN CN201520054113.XU patent/CN204514771U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104634724A (en) * | 2015-01-27 | 2015-05-20 | 中国石油化工股份有限公司 | Condensate corrosion simulation experiment device and method |
| CN114428051A (en) * | 2020-10-29 | 2022-05-03 | 中国石油化工股份有限公司 | Dew point corrosion assessment device with controllable condensation temperature |
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