CN204505709U - A kind of injection mold of PCBA board - Google Patents
A kind of injection mold of PCBA board Download PDFInfo
- Publication number
- CN204505709U CN204505709U CN201520191081.8U CN201520191081U CN204505709U CN 204505709 U CN204505709 U CN 204505709U CN 201520191081 U CN201520191081 U CN 201520191081U CN 204505709 U CN204505709 U CN 204505709U
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- CN
- China
- Prior art keywords
- pcba
- limit part
- injection mold
- assembly
- pcb board
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- 238000002347 injection Methods 0.000 title claims abstract description 43
- 239000007924 injection Substances 0.000 title claims abstract description 43
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 title claims abstract 23
- 238000001746 injection moulding Methods 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 abstract description 22
- 239000004033 plastic Substances 0.000 abstract description 14
- 229920003023 plastic Polymers 0.000 abstract description 14
- 238000007789 sealing Methods 0.000 abstract description 13
- 238000007711 solidification Methods 0.000 abstract description 3
- 230000008023 solidification Effects 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 6
- 230000006698 induction Effects 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004017 vitrification Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The utility model discloses a kind of injection mold of PCBA board, comprise upper die and lower die, between described patrix and described counterdie, forming the die cavity for placing PCBA assembly, and between described PCBA assembly and the chamber wall of described die cavity, all there is injection moulding gap.Because whole PCBA assembly and welding assembly thereof use molded polymeric material to wrap up by the utility model once, the outer housing covering in PCBA assembly is formed after injected plastics material solidification, gap is there is not between housing and PCBA assembly, door handle antenna can be made to play the sealing effectiveness of IP9K, so improve the sealing property of PCBA board.
Description
Technical field
The utility model relates to door handle antcnnas manufacturing technology field, more particularly, relates to a kind of injection mold of PCBA board.
Background technology
Along with the progress of science and technology, PCBA (Printed Circuit Board+Assembly) plate is widely used gradually, the door handle antenna etc. of such as automobile.
PCBA board mainly comprises PCBA assembly and covers in the housing outside PCBA assembly.PCBA assembly comprises: pcb board, is all arranged at the capacitor plate on pcb board, wire harness and magnetic induction loop etc.; Wherein, housing is stretched in outside wire harness.
At present, the preparation method of PCBA board is: loaded by PCBA assembly in housing, then use casting glue embedding.But the thermal coefficient of expansion of casting glue is more difficult compared with the thermal coefficient of expansion of housing close, causes, between housing and PCBA assembly, there is gap, make the sealing property of whole PCBA board poor.
In sum, how improving the sealing property of PCBA board, is current those skilled in the art's problem demanding prompt solution.
Utility model content
In view of this, the purpose of this utility model is to provide a kind of injection mold of PCBA board, to improve the sealing property of PCBA board.
In order to achieve the above object, the utility model provides following technical scheme:
An injection mold for PCBA board, comprises upper die and lower die, forms the die cavity for placing PCBA assembly between described patrix and described counterdie, and all has injection moulding gap between described PCBA assembly and the chamber wall of described die cavity.
Preferably, the injection mold of above-mentioned PCBA board also comprises: for running through the pcb board thickness of described PCBA assembly to locate the keeper of described PCBA assembly; Wherein, along the direction perpendicular to described pcb board, described keeper is slidably disposed in described patrix and/or described counterdie.
Preferably, the injection mold of above-mentioned PCBA board also comprises: limit the upper limit part that described pcb board is upwards out of shape, and described upper limit part is slidably disposed in described patrix along the direction perpendicular to described pcb board.
Preferably, the injection mold of above-mentioned PCBA board also comprises: limit the lower limit part that described pcb board is out of shape downwards, and described lower limit part is slidably disposed in described counterdie along the direction perpendicular to described pcb board.
Preferably, described in the injection mold of above-mentioned PCBA board, upper limit part is at least two, and described lower limit part is at least two, and described keeper is at least two.
Preferably, in the injection mold of above-mentioned PCBA board, described upper limit part, described lower limit part and described keeper are thimble.
Preferably, in the injection mold of above-mentioned PCBA board, the number of described upper limit part is 10, and the number of described lower limit part is 8, and the number of described keeper is 2.
Preferably, in the injection mold of above-mentioned PCBA board, described die cavity comprises: for placing the plate placed cavity of the pcb board of described PCBA assembly, for placing the wire casing of the wire harness of described PCBA assembly; Wherein, the length of described wire casing is greater than or equal to 10mm.
Preferably, the injection mold of above-mentioned PCBA board also comprises: the first hydraulic cylinder driving described upper limit part to slide, the second hydraulic cylinder driving described lower limit part to slide, the 3rd hydraulic cylinder driving described keeper to slide.
As can be seen from above-mentioned technical scheme, the injection mold of the PCBA board that the utility model provides comprises upper die and lower die, forms the die cavity for placing PCBA assembly between upper die and lower die, and all has injection moulding gap between the chamber wall of PCBA assembly and die cavity.
The using method of the injection mold of above-mentioned PCBA board is: be put into by PCBA assembly in the die cavity between upper die and lower die, then carry out Shooting Technique, in the die cavity of mould, pour injected plastics material, after injection moulding 35s, the injection moulding gap-fill of die cavity completes, and enters packing stage.Now whole PCBA assembly (except part wire harness) is all injection molding material and wraps, and the wire harness place of exposing sticks together with wire harness closely because injection pressure and case material melt, and also can play good sealing effectiveness herein.Injected plastics material can solidify voluntarily in the mould of 170 DEG C, and then product directly ejects by die sinking, does not need extra cool time.
Because whole PCBA assembly and welding assembly thereof use molded polymeric material to wrap up by the utility model once, the outer housing covering in PCBA assembly is formed after injected plastics material solidification, gap is there is not between housing and PCBA assembly, door handle antenna can be made to play the sealing effectiveness of IP9K, so improve the sealing property of PCBA board.
Meanwhile, the housing of above-mentioned injection mo(u)lding has higher intensity, can play good protected effect to PCBA, ensures that PCBA can not sustain damage.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiment of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to the accompanying drawing provided.
Structural representation after the injection mould closing of the PCBA board that Fig. 1 provides for the utility model embodiment;
The patrix that Fig. 2 provides for the utility model embodiment is containing the structural representation of upper limit part;
The counterdie that Fig. 3 provides for the utility model embodiment is containing the structural representation of keeper and lower limit part;
The use schematic diagram of upper limit part, lower limit part and keeper in the injection mold of the PCBA board that Fig. 4 provides for the utility model embodiment;
The structural representation that the counterdie that Fig. 5 provides for the utility model embodiment coordinates with PCBA assembly;
The counterdie that Fig. 6 provides for the utility model embodiment with shaping after the structural representation that coordinates of PCBA board.
In upper Fig. 1-Fig. 6:
1 be patrix, 2 be counterdie, 3 be upper limit part, 4 be lower limit part, 5 be keeper, 6 be PCBA assembly, 61 be pcb board, 62 be wire harness, 7 for housing.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
Please refer to accompanying drawing 1-6, the injection mold of the PCBA board that the utility model embodiment provides comprises patrix 1 and counterdie 2, forms the die cavity for placing PCBA assembly 6 between patrix 1 and counterdie 2, and all has injection moulding gap between the chamber wall of PCBA assembly 6 and die cavity.
It should be noted that, PCBA assembly 6 comprises: pcb board 61, is all arranged at the capacitor plate on described pcb board 61, wire harness 62 and magnetic induction loop.Capacitor plate and wire harness 62 are all welded in pcb board 61, and magnetic induction loop is fixed on pcb board 61 by the mode of assembling with pcb board 61, and the enamel-covered wire of magnetic induction loop is welded on the pad of described pcb board 61.Use the injection mold of above-mentioned PCBA board, in order to avoid PCBA assembly 6 is distorted distortion, affect product function, require that the thickness of slab of pcb board 61 is greater than or equal to 1.6mm, the vitrification point of pcb board 61 is greater than or equal to 170 DEG C.
The using method of the injection mold of above-mentioned PCBA board is: be put into by PCBA assembly 6 in the die cavity between patrix 1 and counterdie 2, then carry out Shooting Technique, in the die cavity of mould, pour injected plastics material, after injection moulding 35s, the injection moulding gap-fill of die cavity completes, and enters packing stage.Now whole PCBA assembly 6 (except part wire harness 62) is all injection molding material and wraps, and wire harness 62 place of exposing sticks together with wire harness 62 closely because injection pressure and case material melt, and also can play good sealing effectiveness herein.Injected plastics material can solidify voluntarily in the mould of 170 DEG C, and then product directly ejects by die sinking, does not need extra cool time.
Above-mentioned injected plastics material is the macromolecular materials such as epoxy, and wherein, the ratio of silica is 80%, all the other materials mainly epoxy resin.Certainly, also can select other injected plastics materials, be not limited thereto.
Injection moulding heat time total needs 60s, certainly, also can adjust according to actual needs, be not limited thereto.
During injection moulding, in mould, temperature is 170-190 DEG C, and injection pressure is the wire harness 62 of 30MPa-50MPa, PCBA assembly 6 is high temperature resistant wire harness 62.
Because whole PCBA assembly 6 and welding assembly thereof use molded polymeric material to wrap up by the utility model once, the outer housing 7 covering in PCBA assembly 6 is formed after injected plastics material solidification, gap is there is not between housing 7 and PCBA assembly 6, door handle antenna can be made to play the sealing effectiveness of IP9K, so improve the sealing property of PCBA board.
Meanwhile, the housing 7 of above-mentioned injection mo(u)lding has higher intensity, can play good protected effect to PCBA, ensures that PCBA can not sustain damage.
In injection moulding process, PCBA assembly 6 is moved, and the injection mold of the PCBA board that above-described embodiment provides also comprises pcb board 61 thickness for running through PCBA assembly 6 to locate the keeper 5 of PCBA assembly 6; Wherein, along the direction perpendicular to pcb board 61, keeper 5 is slidably disposed in patrix 1 and/or counterdie 2.This keeper 5 in order to run through PCBA board, then needs to insert patrix 1 and/or counterdie 2.In order to easy to operate, prioritizing selection keeper 5 is slidably disposed in counterdie 2 along the direction perpendicular to PCBA board.Certainly, keeper 5 also can be selected to be slidably disposed in patrix 1, or to be slidably disposed in patrix 1 and counterdie 2, be not limited to above-mentioned situation.Above-mentioned keeper 5 is through PCBA assembly 6, spacing for PCBA assembly 6 horizontal direction.
Further, the injection mold of above-mentioned PCBA board also comprises the upper limit part 3 limiting pcb board 61 and be upwards out of shape, and upper limit part 3 is slidably disposed in patrix 1 along the direction perpendicular to pcb board 61.Carrying out spacing to the end face of pcb board 61 when this upper limit part 3 for inserting PCBA assembly 6 in die cavity, preventing PCBA to be upwards out of shape, thus reduce the impact on PCBA performance.
The injection mold of above-mentioned PCBA board also comprises the lower limit part 4 of restriction pcb board 61 distortion downwards, and lower limit part 4 is slidably disposed in counterdie 2 along the direction perpendicular to pcb board 61.Carrying out spacing to the bottom surface of pcb board 61 when this lower limit part 4 for inserting PCBA assembly 6 in die cavity, preventing PCBA to be out of shape downwards, thus reduce the impact on PCBA performance.
In above-described embodiment, for the number of keeper 5, can arrange according to actual needs, in order to ensure reliability of positioning, prioritizing selection keeper 5 is at least two.Because keeper 5 needs the pcb board 61 running through PCBA assembly 6, in order to ensure the intensity of pcb board 61, the number of keeper 5 is not easily too much.Preferably, the number of keeper 5 is 2, has both been convenient to pcb board 61 and has put in mould, can ensure that again pcb board 61 location is in the horizontal direction not enough, and when preventing injection moulding, play occurs pcb board 61.
For the number of upper limit part 3 and lower limit part 4, also actual needs is arranged, such as, according to the outer surface structure and size etc. of PCBA assembly 6.Upper limit part 3 can be identical with the number of lower limit part 4, also can be different.Preferably, the number of upper limit part 3 is 10, and the number of lower limit part 4 is 8.Certainly, also can select other numbers, as long as ensure that PCBA is not out of shape in injection moulding process, to concrete upper limit part 3 and lower limit part 4 number and size be not limited to this.
As shown in Figure 4,8 thimbles as lower limit part 4 are arranged on below pcb board 61, prevent pcb board 61 to be out of shape downwards; 10 thimbles as upper limit part 3 are arranged on above pcb board 61, prevent pcb board 61 to be upwards out of shape; 2 thimbles as keeper 5 pass from below through pcb board 61, for pcb board 61 at location, horizontal plane direction (pcb board 61 to put in process location and prevent pcb board 61 play in the horizontal direction in mould in injection moulding).Accordingly, above-mentioned pcb board 61 is provided with some locating holes.This locating hole comprises: through hole, is positioned at the first blind hole of described pcb board 61 upper surface, is positioned at the second blind hole of described pcb board 61 upper surface.The number of through hole is 2, and the number of the first blind hole is 10, and the number of the second blind hole is 8.Above-mentioned through hole is used for and keeper 5 location fit, and above-mentioned first blind hole is used for and upper limit part 3 location fit, and above-mentioned second blind hole is used for and lower limit part 4 location fit.
In the injection mold of above-mentioned PCBA board, the structure of upper limit part 3, lower limit part 4 and keeper 5 all exists multiple, can select according to actual needs.Such as, upper limit part 3, lower limit part 4 and keeper 5 can be cylinder, cuboid cone etc.The conveniently extraction of upper limit part 3, lower limit part 4 and keeper 5, prioritizing selection upper limit part 3, lower limit part 4 and keeper 5 are thimble.Like this, the cross-sectional area of upper limit part 3, lower limit part 4 and keeper 5 can be effectively reduced, be beneficial to extraction, injecting plastic forming when being also convenient to injection moulding.
The die cavity of above-mentioned thimble and mould is matched in clearance, and thimble can move up and down, but due to the gap between thimble and mold cavity little especially, be approximately 2-4 μm, injected plastics material can not enter in the gap between thimble and mold cavity.
By the own characteristic of PCBA assembly 6, wire harness 62 stretches out pcb board 61, in order to ensure injection moulding quality, require housing 7 house portions wire harness 62, concrete, in the injection mold of PCBA board, die cavity comprises: for placing the plate placed cavity of the pcb board 61 of PCBA assembly 6, for placing the wire casing of the wire harness 62 of PCBA assembly 6.Further, in order to improve the sealing property of PCBA board, the length of prioritizing selection wire casing is greater than or equal to 10mm.Certainly, also according to the environment for use of PCBA board, can suitably increase or reduce the length of wire casing.
The injection moulding process of the injection mold of the PCBA board of the present embodiment is: PCBA assembly 6 is put into counterdie 2, and wire harness 62 is put in the wire casing of die cavity, if keeper 5 is located at counterdie 2, completes location by keeper 5 and lower limit part 4; Patrix 1 and the 2-in-1 mould of counterdie, the upper limit part 3 of patrix 1 side also can position PCBA assembly 6, and now PCBA assembly 6 in any direction all can not play; Carry out Shooting Technique, injected plastics material is poured in the die cavity of mould, after injection moulding 35s, cavity filling completes, enter packing stage, extracted out by the thimble of location PCBA, now in die cavity, injected plastics material fills up, during extraction keeper 5, the position of PCBA assembly 6 can not be moved, and the space occurred when extracting keeper 5 out can be filled up by case material automatically.Now whole PCBA assembly 6 (except part wire harness 62) is all wrapped, and wire harness 62 place of exposing sticks together with wire harness 62 closely because injection pressure and case material melt, and also can play good sealing effectiveness herein.Injected plastics material can solidify voluntarily in the mould of 170 DEG C, and then product directly ejects by die sinking.Do not need extra cool time.
For the ease of extracting upper limit part 3, lower limit part 4 and keeper 5, the injection mold of above-mentioned PCBA board also comprises: drive the first hydraulic cylinder that upper limit part 3 slides, and drives the second hydraulic cylinder that lower limit part 4 slides, and drives the 3rd hydraulic cylinder that keeper 5 slides.Certainly, also can adopt motor to replace the first hydraulic cylinder, the second hydraulic cylinder and the 3rd hydraulic cylinder, be not limited thereto.
To the above-mentioned explanation of the disclosed embodiments, those skilled in the art are realized or uses the utility model.To be apparent for a person skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein when not departing from spirit or scope of the present utility model, can realize in other embodiments.Therefore, the utility model can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (9)
1. an injection mold for PCBA board, is characterized in that, comprises upper die and lower die, forms the die cavity for placing PCBA assembly between described patrix and described counterdie, and all has injection moulding gap between described PCBA assembly and the chamber wall of described die cavity.
2. the injection mold of PCBA board according to claim 1, is characterized in that, also comprises: for running through the pcb board thickness of described PCBA assembly to locate the keeper of described PCBA assembly; Wherein, along the direction perpendicular to described pcb board, described keeper is slidably disposed in described patrix and/or described counterdie.
3. the injection mold of PCBA board according to claim 2, is characterized in that, also comprises: limit the upper limit part that described pcb board is upwards out of shape, and described upper limit part is slidably disposed in described patrix along the direction perpendicular to described pcb board.
4. the injection mold of PCBA board according to claim 3, is characterized in that, also comprises: limit the lower limit part that described pcb board is out of shape downwards, and described lower limit part is slidably disposed in described counterdie along the direction perpendicular to described pcb board.
5. the injection mold of PCBA board according to claim 4, is characterized in that, described upper limit part is at least two, and described lower limit part is at least two, and described keeper is at least two.
6. the injection mold of PCBA board according to claim 4, is characterized in that, described upper limit part, described lower limit part and described keeper are thimble.
7. the injection mold of PCBA board according to claim 6, is characterized in that, the number of described upper limit part is 10, and the number of described lower limit part is 8, and the number of described keeper is 2.
8. the injection mold of PCBA board according to claim 1, is characterized in that, described die cavity comprises: for placing the plate placed cavity of the pcb board of described PCBA assembly, for placing the wire casing of the wire harness of described PCBA assembly; Wherein, the length of described wire casing is greater than or equal to 10mm.
9. the injection mold of PCBA board according to claim 4, is characterized in that, also comprises: the first hydraulic cylinder driving described upper limit part to slide, the second hydraulic cylinder driving described lower limit part to slide, the 3rd hydraulic cylinder driving described keeper to slide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520191081.8U CN204505709U (en) | 2015-03-31 | 2015-03-31 | A kind of injection mold of PCBA board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520191081.8U CN204505709U (en) | 2015-03-31 | 2015-03-31 | A kind of injection mold of PCBA board |
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| Publication Number | Publication Date |
|---|---|
| CN204505709U true CN204505709U (en) | 2015-07-29 |
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| CN201520191081.8U Active CN204505709U (en) | 2015-03-31 | 2015-03-31 | A kind of injection mold of PCBA board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107171070A (en) * | 2017-05-23 | 2017-09-15 | 无锡科锐漫电子科技有限公司 | Antenna packages method and antenna |
| CN110142919A (en) * | 2019-06-03 | 2019-08-20 | 重庆蓝岸通讯技术有限公司 | External antenna molding die |
| CN110355933A (en) * | 2019-06-28 | 2019-10-22 | 和平县华毅塑胶制品有限公司 | The forming method of pcb board package casing |
| CN115087282A (en) * | 2021-03-16 | 2022-09-20 | 武汉智行者科技有限公司 | PCBA sealing process of electronic product |
-
2015
- 2015-03-31 CN CN201520191081.8U patent/CN204505709U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107171070A (en) * | 2017-05-23 | 2017-09-15 | 无锡科锐漫电子科技有限公司 | Antenna packages method and antenna |
| CN110142919A (en) * | 2019-06-03 | 2019-08-20 | 重庆蓝岸通讯技术有限公司 | External antenna molding die |
| CN110355933A (en) * | 2019-06-28 | 2019-10-22 | 和平县华毅塑胶制品有限公司 | The forming method of pcb board package casing |
| CN115087282A (en) * | 2021-03-16 | 2022-09-20 | 武汉智行者科技有限公司 | PCBA sealing process of electronic product |
| CN115087282B (en) * | 2021-03-16 | 2024-10-11 | 武汉智行者科技有限公司 | PCBA sealing process of electronic product |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 4 / F, building 1, No.14 Jiuxianqiao Road, Chaoyang District, Beijing 100020 Patentee after: Beijing Jingwei Hirain Technologies Co.,Inc. Address before: 100101 Beijing city Chaoyang District Anxiang Lane No. 11 Beijing building B block 8 layer Patentee before: Beijing Jingwei HiRain Technologies Co.,Ltd. |