CN204504944U - A kind of abrasive machine for solder grinding - Google Patents
A kind of abrasive machine for solder grinding Download PDFInfo
- Publication number
- CN204504944U CN204504944U CN201520067560.9U CN201520067560U CN204504944U CN 204504944 U CN204504944 U CN 204504944U CN 201520067560 U CN201520067560 U CN 201520067560U CN 204504944 U CN204504944 U CN 204504944U
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- China
- Prior art keywords
- solder
- grinding
- fixed
- base plate
- movable floor
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- Expired - Fee Related
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model discloses a kind of abrasive machine for solder grinding, comprise frame, the bottom of frame has fixed base plate, fixed base plate is provided with vertical the support spring group, the movable floor that arrange, the bottom of movable floor is fixed wtih an iron core, fixed base plate is fixed wtih a solenoid, movable floor is provided with drive motors, the output shaft of drive motors is provided with emery wheel, the top of emery wheel is provided with one for clamping solder and the Chi Liao mechanism driving solder to move left and right, and this Chi Liao mechanism coordinates the first grinding realized solder with emery wheel.The speed of the utility model grinding is fast, and save a large amount of manpower and materials, operating efficiency is high, and machining accuracy also improves, and product quality is promoted.
Description
Technical field
The utility model relates to the manufacture field of welding material, particularly relates to a kind of abrasive machine for solder grinding.
Background technology
At present, in the production and processing of bullion solder, often there is some nonstandard products larger than the solder of standard in some solders produced, these nonstandard products will carry out after-treatment, just need to carry out grinding to solder, existing grinding is generally adopt manually to hold material, allow solder grinding on abrasive machine, first, adopt manual operation grinding, need to expend a large amount of energy of master workers, the grinding time is long, inefficiency, second, when grinding, adopt manually processing cannot complete unified dynamics when ensureing grinding, so just make the outer wall of solder uneven, reduce product quality.
Utility model content
The utility model, in order to solve the above-mentioned deficiency of prior art, proposes a kind of abrasive machine for solder grinding.
In order to solve the problems of the technologies described above, the utility model is by the following technical solutions: a kind of abrasive machine for solder grinding, comprise frame, the bottom of described frame has fixed base plate, described fixed base plate is provided with the vertical support spring group arranged, the upper end of described support spring group is fixed wtih a movable floor, and the bottom of described movable floor is fixed wtih an iron core, correspond on fixed base plate described in iron core and is fixed wtih a solenoid; Described movable floor is provided with a drive motors, the output shaft of described drive motors is provided with interior chuck and outer chuck, between described interior chuck and outer chuck, emery wheel is installed, the top of described emery wheel is provided with one for clamping solder and the Chi Liao mechanism driving solder to move left and right, and this Chi Liao mechanism coordinates the first grinding realized solder with emery wheel.
Described Chi Liao mechanism comprises the upper mounted plate being fixed on frame upper end, and the bottom of fixed plate is provided with a screw mandrel guide-track groove, is provided with slide block in described screw mandrel guide-track groove, and the side of described screw mandrel guide-track groove is provided with the motor being with movable slider to walk on screw mandrel; Described slide block is provided with the fixture mount of a L-type, described fixture mount is provided with and holds feed collet, and this fixture mount is also provided with drive hold the cylinder that feed collet does open and close movement.
Each spring housing of described support spring group is being fixed on the guide pillar on fixed base plate, and guide pillar is through the trepanning of described movable floor.
Compared with prior art, the utility model is provided with the structure of support spring jack-up movable floor, again in conjunction with the structure of solenoid and iron core, the emery wheel on motor can be made to be elevated fast, and solder grinding on emery wheel parallelly can be clamped by the Chi Liao mechanism above frame, and solder can be pulled to move slowly by holding feed collet, and then ensure the high-quality of grinding, eliminate a large amount of manpower and materials, increase work efficiency, improve product quality.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Detailed description of the invention
Below in conjunction with drawings and Examples, utility model is described in detail.
As shown in Figure 1, the abrasive machine for solder grinding that the utility model proposes, comprise frame 1, the bottom of frame has fixed base plate 2, fixed base plate 2 is provided with the vertical support spring group 3 arranged, the upper end of support spring group 3 is fixed wtih a movable floor 4, and each spring housing of support spring group 3 is on the guide pillar 18 be fixed on fixed base plate 2, and guide pillar 18 is through the trepanning of described movable floor 4.
The bottom of movable floor is fixed wtih an iron core 5, correspond on iron core fixed base plate 2 and is fixed wtih a solenoid 6.Movable floor is provided with a drive motors 7, the output shaft of drive motors is provided with interior chuck 8 and outer chuck 9, connected by a setting-up screw 20 between interior chuck 8 and outer chuck 9, packing ring 19 is provided with between the trepanning of outer chuck 9 and motor output shaft, be provided with emery wheel 10 between interior chuck 8 and outer chuck 9, rotation setting-up screw 20 can regulate the crack width between interior chuck 8 and outer chuck 9.The top of emery wheel is provided with one for clamping solder and the Chi Liao mechanism driving solder to move left and right, and this Chi Liao mechanism coordinates the grinding realized solder with emery wheel.
Chi Liao mechanism comprises the upper mounted plate 11 being fixed on frame upper end, the bottom of upper mounted plate 11 is provided with a screw mandrel guide-track groove 12, slide block 13 is installed in screw mandrel guide-track groove 12, slide block 13 is stuck in screw mandrel guide-track groove 12, and screw mandrel along its length runs through and is threaded and slide block 13 in screw mandrel guide-track groove 12, the side of screw mandrel guide-track groove 12 is provided with the motor 14 that band movable slider 13 is walked on screw mandrel; Slide block 13 is provided with the fixture mount 15 of a L-type, fixture mount 15 is provided with and holds feed collet 16, and this fixture mount 15 is also provided with drive hold the cylinder 17 that feed collet 16 does open and close movement.
During concrete use, solenoid 6 charging can attract the iron core 5 of top, and iron core drives pressing spring under movable floor to reduce height, and then makes the emery wheel on drive motors above also reduce height.Now control motor 14, the screw mandrel that motor 14 rotarily drives in screw mandrel guide-track groove 12 rotates, and then slide block 13 is moved, thus fixture mount 15 is moved forward, cylinder 17 promotes to hold feed collet 16 and opens dop, now only need artificial solder is put into hold feed collet in the mouth, pressing from both sides the part entered in mouth does not need grinding, and the part outside mouth carries out grinding.After clamping, solenoid 6 power-off, due to the pretightning force of support spring group, emery wheel on drive motors rises and holds out against solder, drive motors is opened, and drives emery wheel to rotate, and then starts grinding, when grinding, motor 14 also rotates backward, independent slide block 13 slowly moves afterwards, and such solder just can grinding accurately on emery wheel, according to a stable dynamics grinding, grinding accuracy is high, and the complete product quality of grinding is high.
Above-described embodiment only have expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the utility model patent and protection domain should be as the criterion with appended claims.
Claims (3)
1. the abrasive machine for solder grinding, it is characterized in that: comprise frame (1), the bottom of described frame has fixed base plate (2), described fixed base plate (2) is provided with the vertical support spring group (3) arranged, the upper end of described support spring group (3) is fixed wtih a movable floor (4), the bottom of described movable floor is fixed wtih an iron core (5), correspond on fixed base plate described in iron core (2) and is fixed wtih a solenoid (6); Described movable floor is provided with a drive motors (7), the output shaft of described drive motors is provided with interior chuck (8) and outer chuck (9), emery wheel (10) is installed between described interior chuck (8) and outer chuck (9), the top of described emery wheel is provided with one for clamping solder and the Chi Liao mechanism driving solder to move left and right, and this Chi Liao mechanism coordinates the grinding realized solder with emery wheel.
2. the abrasive machine for solder grinding according to claim 1, it is characterized in that: described Chi Liao mechanism comprises the upper mounted plate (11) being fixed on frame upper end, the bottom of fixed plate (11) is provided with a screw mandrel guide-track groove (12), be provided with slide block (13) in described screw mandrel guide-track groove (12), the side of described screw mandrel guide-track groove (12) is provided with the motor (14) being with movable slider (13) to walk on screw mandrel; Described slide block (13) is provided with the fixture mount (15) of a L-type, described fixture mount (15) is provided with and holds feed collet (16), and this fixture mount (15) is also provided with drive and holds the cylinder (17) that feed collet (16) does open and close movement.
3. the abrasive machine for solder grinding according to claim 1, it is characterized in that: each spring housing of described support spring group (3) is being fixed on the guide pillar (18) on fixed base plate (2), and guide pillar (18) is through the trepanning of described movable floor (4).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520067560.9U CN204504944U (en) | 2015-01-31 | 2015-01-31 | A kind of abrasive machine for solder grinding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520067560.9U CN204504944U (en) | 2015-01-31 | 2015-01-31 | A kind of abrasive machine for solder grinding |
Publications (1)
Publication Number | Publication Date |
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CN204504944U true CN204504944U (en) | 2015-07-29 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201520067560.9U Expired - Fee Related CN204504944U (en) | 2015-01-31 | 2015-01-31 | A kind of abrasive machine for solder grinding |
Country Status (1)
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CN (1) | CN204504944U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106312738A (en) * | 2016-09-21 | 2017-01-11 | 合肥德捷节能环保科技有限公司 | Edge removing machine for coating films of glass |
CN106625161A (en) * | 2017-02-10 | 2017-05-10 | 珠海格力智能装备有限公司 | Grinding and polishing device and grinding and polishing method |
-
2015
- 2015-01-31 CN CN201520067560.9U patent/CN204504944U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106312738A (en) * | 2016-09-21 | 2017-01-11 | 合肥德捷节能环保科技有限公司 | Edge removing machine for coating films of glass |
CN106625161A (en) * | 2017-02-10 | 2017-05-10 | 珠海格力智能装备有限公司 | Grinding and polishing device and grinding and polishing method |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150729 Termination date: 20160131 |
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EXPY | Termination of patent right or utility model |