CN204465326U - Metal-oxide-semiconductor assembly structure on frequency converter - Google Patents
Metal-oxide-semiconductor assembly structure on frequency converter Download PDFInfo
- Publication number
- CN204465326U CN204465326U CN201520031319.0U CN201520031319U CN204465326U CN 204465326 U CN204465326 U CN 204465326U CN 201520031319 U CN201520031319 U CN 201520031319U CN 204465326 U CN204465326 U CN 204465326U
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- China
- Prior art keywords
- oxide
- metal
- lead substrate
- semiconductor
- frequency converter
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses the metal-oxide-semiconductor assembly structure on a kind of frequency converter, comprise metal-oxide-semiconductor and lead substrate, described lead substrate offers fixing hole, on described lead substrate, paster has aluminium flake, and described metal-oxide-semiconductor is fitted on aluminium flake.Advantage is: structure of the present utility model is simple, and metal-oxide-semiconductor is by being fitted on the aluminium flake of lead substrate, convenient when installation like this, enhance productivity and insulate and heat-conducting effect better.
Description
Technical field
The utility model belongs to converter technology field, especially relates to the metal-oxide-semiconductor assembly structure on a kind of frequency converter.
Background technology
At present, the metal-oxide-semiconductor on frequency converter utilizes insulating barrier and screw to be fixed by radiator mostly, and this fixed form is comparatively loaded down with trivial details in installation process, has a strong impact on production efficiency; And the heat conduction of this structure and insulation effect poor, affect the result of use of product; Therefore be necessary to be improved.
Summary of the invention
The purpose of this utility model is the deficiency existed for above-mentioned prior art, provides the assembly structure of the metal-oxide-semiconductor on a kind of frequency converter, and it has, and structure is simple, heat conduction and insulation effect preferably feature.
To achieve these goals, the technical scheme that the utility model adopts is: the metal-oxide-semiconductor assembly structure on a kind of frequency converter, comprises metal-oxide-semiconductor and lead substrate, and described lead substrate offers fixing hole, on described lead substrate, paster has aluminium flake, and described metal-oxide-semiconductor is fitted on aluminium flake.
Described lead substrate is coated with dust cover.
Described dust cover has hollow receiver portion and a location division, and described lead substrate is arranged in hollow receiver portion, and the extension on lead substrate is fixed on location division.
After adopting said structure, the utility model is compared to the prior art advantageously: structure of the present utility model is simple, metal-oxide-semiconductor by being fitted on the aluminium flake of lead substrate, like this installation in convenient, enhance productivity and insulate and heat-conducting effect better; The outside of lead substrate is coated with dust cover, and dust cover can prevent extraneous dust from entering on aluminium base, makes its work more stable.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is partial structurtes schematic diagram of the present utility model.
Fig. 3 is the structural representation (reverse side upward) of the utility model dust cover.
Embodiment
The following stated is only preferred embodiment of the present utility model, does not therefore limit protection range of the present utility model, further illustrates below in conjunction with drawings and Examples to the utility model.
Embodiment, is shown in shown in Fig. 1 to Fig. 3: the metal-oxide-semiconductor assembly structure on a kind of frequency converter, comprises metal-oxide-semiconductor 10 and lead substrate 20.On lead substrate 20, paster has aluminium flake 22, and described metal-oxide-semiconductor 10 is fitted on aluminium flake 22; This spline structure not only allows to be installed more for convenience, and insulating heat-conductive effect is better.Lead substrate 20 is coated with dust cover 30, and dust cover 30 has a hollow receiver portion 31 and location division 32, and lead substrate 20 is arranged in hollow receiver portion 31; The two ends of lead substrate 20 are provided with extension 23, extension 23 offer fixing hole 21; Fixing hole 21 is spirally connected by screw with the location hole 321 on location division 32, makes extension 23 and location division 32 secure fit like this.So after fixation, dust cover 30 can prevent dust from entering on lead substrate 20, makes its work more stable.
Claims (3)
1. the metal-oxide-semiconductor assembly structure on a frequency converter, comprise metal-oxide-semiconductor (10) and lead substrate (20), described lead substrate (20) offers fixing hole (21), it is characterized in that: the upper paster of described lead substrate (20) has aluminium flake (22), and described metal-oxide-semiconductor (10) is fitted on aluminium flake (22).
2. the metal-oxide-semiconductor assembly structure on frequency converter according to claim 1, is characterized in that: described lead substrate (20) is coated with dust cover (30).
3. the metal-oxide-semiconductor assembly structure on frequency converter according to claim 2, it is characterized in that: described dust cover (30) has a hollow receiver portion (31) and location division (32), described lead substrate (20) is arranged in hollow receiver portion (31), and the extension (23) on lead substrate (20) is fixed on location division (32).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520031319.0U CN204465326U (en) | 2015-01-16 | 2015-01-16 | Metal-oxide-semiconductor assembly structure on frequency converter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520031319.0U CN204465326U (en) | 2015-01-16 | 2015-01-16 | Metal-oxide-semiconductor assembly structure on frequency converter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204465326U true CN204465326U (en) | 2015-07-08 |
Family
ID=53672149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520031319.0U Expired - Fee Related CN204465326U (en) | 2015-01-16 | 2015-01-16 | Metal-oxide-semiconductor assembly structure on frequency converter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204465326U (en) |
-
2015
- 2015-01-16 CN CN201520031319.0U patent/CN204465326U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150708 Termination date: 20190116 |