CN204462903U - A kind of memory test is heated lid - Google Patents
A kind of memory test is heated lid Download PDFInfo
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- CN204462903U CN204462903U CN201520117577.0U CN201520117577U CN204462903U CN 204462903 U CN204462903 U CN 204462903U CN 201520117577 U CN201520117577 U CN 201520117577U CN 204462903 U CN204462903 U CN 204462903U
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- 238000012360 testing method Methods 0.000 title claims abstract description 32
- 230000015654 memory Effects 0.000 title claims abstract description 31
- 238000010438 heat treatment Methods 0.000 claims abstract description 25
- 238000010792 warming Methods 0.000 claims abstract description 10
- 239000011810 insulating material Substances 0.000 claims abstract description 4
- 238000005265 energy consumption Methods 0.000 abstract description 2
- 230000003044 adaptive effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
本实用新型公开了一种内存测试加温盖,其特征在于包括有隔热材料制成的盖主体,所述盖主体为一面开口的长方体,在盖主体上设有排风风扇,盖主体内壁上设有加热电模块,还包括温度传感器和主控板,所述温度传感器设置在盖主体内,所述主控板设置在盖主体外,所述排风风扇、加热电模块和温度传感器都与主控板电连接。通过采用加温盖可独立对待测试内存进行单独加热,对服务器主板上的其它部件没有影响,并且整体使用灵活,能耗低,采用多个加温盖可满足同时不同的待测试内存进行不同的耐温测试需求,极大提高了测试效率和降低了测试成本。
The utility model discloses a memory test warming cover, which is characterized in that it includes a cover main body made of heat insulating material, the cover main body is a cuboid with one side open, an exhaust fan is arranged on the cover main body, and the inner wall of the cover main body There is a heating electric module on it, and also includes a temperature sensor and a main control board, the temperature sensor is arranged inside the cover main body, the main control board is arranged outside the cover main body, and the exhaust fan, heating electric module and temperature sensor are It is electrically connected with the main control board. The memory to be tested can be heated independently by using the heating cover, which has no effect on other components on the server motherboard, and the overall use is flexible and the energy consumption is low. The use of multiple heating covers can meet different requirements for different memory to be tested at the same time. The requirement of temperature resistance test greatly improves the test efficiency and reduces the test cost.
Description
技术领域technical field
本实用新型涉及电子设备制造领域,具体涉及内存测试设备。The utility model relates to the field of electronic equipment manufacturing, in particular to memory testing equipment.
背景技术Background technique
在内存制造领域,现有技术中制造厂对内存产品质量测试检验使用的加热方案一般都是在高温房和高温柜中进行,这样生产测试设备投放费用是巨大的,并且无法同时对不同产品采用不同的温度进行测试检验;并且这类加热设备是将测试主板整体一起长时间处于高温房和高温柜的高温环境下,这样就会导致主板或其它结构件的加速老化,很大程度上减少了整机的使用寿命。同时这类加热设备的能源损耗也是巨大的,即便是只需测试一台机器也要启动整个高温房和高温柜,存在巨大能源浪费,同时这种高温环境下也提高了测试人员的操作难度和风险。In the field of memory manufacturing, in the prior art, the heating schemes used by manufacturers to test and inspect the quality of memory products are generally carried out in high-temperature rooms and high-temperature cabinets, so that the cost of production and testing equipment is huge, and it is impossible to use it for different products at the same time. Different temperatures are tested and inspected; and this type of heating equipment is to test the whole motherboard in a high-temperature room and high-temperature cabinet for a long time, which will lead to accelerated aging of the motherboard or other structural parts, greatly reducing The service life of the whole machine. At the same time, the energy loss of this type of heating equipment is also huge. Even if only one machine is to be tested, the entire high-temperature room and high-temperature cabinet must be activated, resulting in a huge waste of energy. At the same time, this high-temperature environment also increases the operating difficulty and risk.
实用新型内容Utility model content
本实用新型要解决的技术问题是,如何提供一种可灵活实现只对主板上的待测内存进行局部加热实现单独对待测内存进行高温老化的测试设备。The technical problem to be solved by the utility model is how to provide a testing device that can flexibly realize only local heating of the memory to be tested on the main board to realize high-temperature aging of the memory to be tested independently.
为了解决上述技术问题,本实用新型设计了一种内存测试加温盖,其特征在于包括有隔热材料制成的盖主体,所述盖主体为一面开口的长方体,在盖主体上设有排风风扇,盖主体内壁上设有加热电模块,还包括温度传感器和主控板,所述温度传感器设置在盖主体内,所述主控板设置在盖主体外,所述排风风扇、加热电模块和温度传感器都与主控板电连接。In order to solve the above-mentioned technical problems, the utility model designs a memory test warming cover, which is characterized in that it includes a cover body made of heat-insulating material, the cover body is a cuboid with one side open, and the cover body is provided with row The wind fan is provided with a heating electric module on the inner wall of the cover main body, and also includes a temperature sensor and a main control board. The temperature sensor is arranged inside the cover main body, and the main control board is arranged outside the cover main body. Both the thermoelectric module and the temperature sensor are electrically connected to the main control board.
所述的内存测试加温盖,其特征在于所述温度传感器悬空设置在盖主体内的中心位置。The memory test warming cover is characterized in that the temperature sensor is suspended in the center of the main body of the cover.
所述的内存测试加温盖,其特征在于主控板上还设有蜂鸣器报警电路和温度显示面板。The memory test heating cover is characterized in that a buzzer alarm circuit and a temperature display panel are also provided on the main control board.
所述的内存测试加温盖,其特征在于还包括适配底盖,所述适配底盖为与盖主体的开口相匹配,可安装在所述开口上,所述适配底盖上还设有可将待测试的内存置入盖主体内的适配口。The memory test warming cover is characterized in that it also includes an adaptive bottom cover, which is matched with the opening of the cover main body and can be installed on the opening. An adapter port is provided to place the memory to be tested into the body of the cover.
实施本实用新型具有如下有益效果:通过采用加温盖可独立对待测试内存进行单独加热,对服务器主板上的其它部件没有影响,并且整体使用灵活,能耗低,采用多个加温盖可满足同时不同的待测试内存进行不同的耐温测试,极大提高了测试效率和降低了测试成本。Implementing the utility model has the following beneficial effects: the memory to be tested can be independently heated by using the heating cover, which has no influence on other components on the server main board, and the overall use is flexible and the energy consumption is low. The use of multiple heating covers can satisfy At the same time, different temperature resistance tests are carried out for different memories to be tested, which greatly improves the test efficiency and reduces the test cost.
附图说明Description of drawings
图1是内存测试加温盖的结构示意图;Fig. 1 is a structural schematic diagram of a memory test warming cover;
图2是增加了适配底盖的内存测试加温盖的结构示意图。Fig. 2 is a schematic structural diagram of a memory test warming cover with an adaptive bottom cover added.
具体实施方式Detailed ways
下面将结合本实用新型实施例中的附图,对本实用新型实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本实用新型一部分实施例,而不是全部的实施例。基于本实用新型中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本实用新型保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.
图1是内存测试加温盖的结构示意图,包括有隔热材料制成的盖主体5,所述盖主体5为一面开口的长方体,也可以是其它带有空腔的盒体形状,在盖主体5上设有排风风扇2,盖主体5内壁上设有加热电模块1,还包括温度传感器3和主控板4,所述温度传感器3悬空设置在盖主体5内的中心位置,所述主控板5设置在盖主体5外,所述排风风扇2、加热电模块1和温度传感器3都与主控板4电连接。内存测试加温盖盖在待测试主板7上,待测试内存6通过盖主体的开口刚好伸入到盖主体5内部。Fig. 1 is a schematic structural view of the memory test heating cover, which includes a cover main body 5 made of heat insulating material. The main body 5 is provided with an exhaust fan 2, and the inner wall of the cover main body 5 is provided with a heating electric module 1, which also includes a temperature sensor 3 and a main control board 4. The temperature sensor 3 is suspended in the center of the cover main body 5, so that The main control board 5 is arranged outside the cover main body 5 , and the exhaust fan 2 , the electric heating module 1 and the temperature sensor 3 are all electrically connected to the main control board 4 . The memory test heating cover is covered on the main board 7 to be tested, and the memory 6 to be tested just extends into the cover main body 5 through the opening of the cover main body.
图2是增加了适配底盖的内存测试加温盖的结构示意图,为了进一步提高内存测试加温盖对不同主板上安装有不同数量,不同规格的内存的测试需求,增加设置了适配底盖8,根据不同的主板类型可设置多种不同适配口9的适配底盖8。Figure 2 is a schematic diagram of the structure of the memory test heating cover with the addition of an adaptive bottom cover. In order to further improve the test requirements of memory test heating covers with different numbers and specifications installed on different motherboards, an adaptive bottom is added. The cover 8 can be provided with a variety of adapter bottom covers 8 with different adapter ports 9 according to different motherboard types.
具体工作时,选择合适的内存测试加温盖,内存测试加温盖将待测试的内存盖在盖主体内,通过主控板的面板设置好当前测试所需要的温度;通过温度传感器探测当前的测试温度,如果判定到当前温度低于所设定的温度,则控制加热电模块加热操作,当检测到当前温度达到设定的温度,则控制加热电模块停止加热操作;当检测到当前温度超过设定的温度,则控制排风风扇,进行排风降温操作,当检测到当前温度低于设定的温度,则控制排风风扇停止排风操作。During the specific work, select the appropriate memory test warming cover, the memory test heating cover will cover the memory to be tested in the main body of the cover, set the temperature required for the current test through the panel of the main control board; detect the current temperature through the temperature sensor Test the temperature, if it is determined that the current temperature is lower than the set temperature, then control the heating operation of the heating electric module, when it is detected that the current temperature reaches the set temperature, then control the heating electric module to stop the heating operation; when it is detected that the current temperature exceeds If the set temperature is set, the exhaust fan is controlled to perform the exhaust cooling operation. When the current temperature is detected to be lower than the set temperature, the exhaust fan is controlled to stop the exhaust operation.
以上所揭露的仅为本实用新型一种实施例而已,当然不能以此来限定本实用新型之权利范围,本领域普通技术人员可以理解实现上述实施例的全部或部分流程,并依本实用新型权利要求所作的等同变化,仍属于实用新型所涵盖的范围。What is disclosed above is only one embodiment of the present utility model, which certainly cannot limit the scope of rights of the present utility model. Those of ordinary skill in the art can understand all or part of the process of realizing the above-mentioned embodiments, and according to the utility model The equivalent changes made by the claims still belong to the scope covered by the utility model.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520117577.0U CN204462903U (en) | 2015-02-27 | 2015-02-27 | A kind of memory test is heated lid |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201520117577.0U CN204462903U (en) | 2015-02-27 | 2015-02-27 | A kind of memory test is heated lid |
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| CN204462903U true CN204462903U (en) | 2015-07-08 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108459633A (en) * | 2017-02-20 | 2018-08-28 | 中兴通讯股份有限公司 | A kind of temperature control frame and the method for realizing hot environment test |
| CN109885441A (en) * | 2019-03-20 | 2019-06-14 | 苏州浪潮智能科技有限公司 | A kind of memory bar heating device |
| CN111315047A (en) * | 2020-03-25 | 2020-06-19 | 中航锂电(洛阳)有限公司 | Heating cover and heating device with same |
| CN114420193A (en) * | 2021-12-23 | 2022-04-29 | 苏州浪潮智能科技有限公司 | Integrated memory aging test device |
-
2015
- 2015-02-27 CN CN201520117577.0U patent/CN204462903U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108459633A (en) * | 2017-02-20 | 2018-08-28 | 中兴通讯股份有限公司 | A kind of temperature control frame and the method for realizing hot environment test |
| CN108459633B (en) * | 2017-02-20 | 2021-11-23 | 中兴通讯股份有限公司 | Temperature control frame and method for realizing high-temperature environment test |
| CN109885441A (en) * | 2019-03-20 | 2019-06-14 | 苏州浪潮智能科技有限公司 | A kind of memory bar heating device |
| CN111315047A (en) * | 2020-03-25 | 2020-06-19 | 中航锂电(洛阳)有限公司 | Heating cover and heating device with same |
| CN111315047B (en) * | 2020-03-25 | 2022-06-17 | 中航锂电(洛阳)有限公司 | Heating cover and heating device with same |
| CN114420193A (en) * | 2021-12-23 | 2022-04-29 | 苏州浪潮智能科技有限公司 | Integrated memory aging test device |
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Granted publication date: 20150708 |
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