CN204462193U - Smd表面贴系列封装功率器件测试连接装置 - Google Patents
Smd表面贴系列封装功率器件测试连接装置 Download PDFInfo
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105391603A (zh) * | 2015-12-17 | 2016-03-09 | 迈普通信技术股份有限公司 | 一种测试万兆电信号的系统及方法 |
CN107656185A (zh) * | 2017-10-25 | 2018-02-02 | 北京国联万众半导体科技有限公司 | 一种用于宽禁带半导体功率器件的测试装置 |
CN110988642A (zh) * | 2019-12-11 | 2020-04-10 | 上海华碧检测技术有限公司 | Igbt功率器件的雪崩耐量的测试方法及其测试装置 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105391603A (zh) * | 2015-12-17 | 2016-03-09 | 迈普通信技术股份有限公司 | 一种测试万兆电信号的系统及方法 |
CN105391603B (zh) * | 2015-12-17 | 2019-06-21 | 迈普通信技术股份有限公司 | 一种测试万兆电信号的系统及方法 |
CN107656185A (zh) * | 2017-10-25 | 2018-02-02 | 北京国联万众半导体科技有限公司 | 一种用于宽禁带半导体功率器件的测试装置 |
CN110988642A (zh) * | 2019-12-11 | 2020-04-10 | 上海华碧检测技术有限公司 | Igbt功率器件的雪崩耐量的测试方法及其测试装置 |
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Effective date of registration: 20210421 Address after: 243000 101-401, building 38, digital Silicon Valley Industrial Park, No. 999, Yinhuang East Road, economic and Technological Development Zone, Ma'anshan City, Anhui Province Patentee after: ANHUI DONGKE SEMICONDUCTOR Co.,Ltd. Address before: 100029 Beijing city Chaoyang District Beitucheng West Road No. 3 Patentee before: Institute of Microelectronics, Chinese Academy of Sciences |
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Address after: Room 101-401, building 38, digital Silicon Valley Industrial Park, No. 999, Yinhuang East Road, Maanshan economic and Technological Development Zone, 243000, Anhui Province Patentee after: Dongke semiconductor (Anhui) Co.,Ltd. Address before: Room 101-401, building 38, digital Silicon Valley Industrial Park, No. 999, Yinhuang East Road, Maanshan economic and Technological Development Zone, 243000, Anhui Province Patentee before: ANHUI DONGKE SEMICONDUCTOR Co.,Ltd. |
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