CN204423294U

CN204423294U - Cpu heat

Info

Publication number: CN204423294U
Application number: CN201520121432.8U
Authority: CN
Inventors: 潘阿海
Original assignee: Individual
Current assignee: Individual
Priority date: 2015-03-02
Filing date: 2015-03-02
Publication date: 2015-06-24
Anticipated expiration: 2025-03-02

Abstract

The utility model relates to a kind of cpu heat, and this cpu heat includes heat-sink unit, and each heat-sink unit includes heat transfer seat, heat radiation tile and the fixed rotating shaft made by ferrimagnet; The circle central axis of described arc surface is provided with fixed rotating shaft; On described fixed rotating shaft, turning set is provided with rotating cylinder, and on the perisporium of described rotating cylinder, circumference is evenly equipped with electromagnet brushing piece; The magnetic line of force direction of each described electromagnet brushing piece is along the radial direction of described rotating cylinder; Described heat radiation tile is installed with in the outer end of each described electromagnet brushing piece; Each described heat radiation tile has the arcuate surface of the end face being right against described heat transfer seat; Each described heat radiation tile is also fixed with temperature control chip, and each described temperature control chip is electrically connected with the electromagnet brushing piece with its clockwise adjacent and controls the break-make of this electromagnet brushing piece electric current; This heating radiator volume is flat, energy consumption is low, noiselessness; Can with the temperature automatic adjustment radiating rate of CPU.

Description

Cpu heat

Technical field

The present invention relates to a kind of desktop computer accessory, especially, is a kind of heating radiator.

Background technology

Along with the development of science and technology, from strength to strength, the electric current that chip runs is also increasing for the function of computer chip; Under the operation of big current, chip heating problem is more and more serious; Traditional heat abstractor uses fan cooling after mostly being metal heat transfer, and the heat abstractor acting of this form is simple and crude, and radiating effect is undesirable simultaneously; In the no matter summer in winter, as long as start host computer, radiator fan just can be started working, and consumes too much energy; In addition, in use, radiator fan produces larger noise.

Summary of the invention

For the problems referred to above, the invention provides a kind of cpu heat, this heating radiator volume is flat, energy consumption is low, noiselessness; Can with the temperature automatic adjustment radiating rate of CPU.

For solving the problem, the technical solution adopted in the present invention is: this cpu heat includes the heat-sink unit of more than three, and each heat-sink unit includes heat transfer seat, heat radiation tile and the fixed rotating shaft made by ferrimagnet; The bottom surface of described heat transfer seat is plane, and end face is the arc surface caved inward; The circle central axis of described arc surface is provided with fixed rotating shaft; On described fixed rotating shaft, turning set is provided with rotating cylinder, and on the perisporium of described rotating cylinder, circumference is evenly equipped with electromagnet brushing piece; The magnetic line of force direction of each described electromagnet brushing piece is along the radial direction of described rotating cylinder; Described heat radiation tile is installed with in the outer end of each described electromagnet brushing piece; Each described heat radiation tile has the arcuate surface of the end face being right against described heat transfer seat; In the process that each described heat radiation tile rotates with rotating cylinder, the arcuate surface of each described heat radiation tile is plunderred from the arc surface of described heat transfer seat and is swept; Each described heat radiation tile is also fixed with temperature control chip, and each described temperature control chip is electrically connected with the electromagnet brushing piece with its clockwise adjacent and controls the break-make of this electromagnet brushing piece electric current.

The invention has the beneficial effects as follows: when mounted by the fastening surface being attached to cpu chip, heat transfer seat bottom surface of each heat-sink unit; When computer work, the temperature of CPU rises gradually, and the temperature of heat transfer seat rises thereupon, and after the heat radiation tile of seat arc surface of pressing close to conduct heat is heated, temperature rises; When temperature arrives the critical value of the temperature control chip on this heat radiation tile, temperature control chip is by the circuit turn-on with the electromagnet brushing piece corresponding to the heat radiation tile of this heat radiation tile clockwise adjacent; Electromagnet brushing piece now switched on turns to heat transfer seat by Magnetic force tracting, and the heat radiation tile reaching temperature control chip critical value then pushed away from heat transfer seat and external radiating and cooling; After a little while, the temperature pushed away from the heat radiation tile of heat transfer seat is down to below temperature control chip critical value, and the temperature of pressing close to conduct heat on the heat radiation tile of seat reaches temperature control chip critical value, thus another push-jump each heat radiation tile, high temperature heat radiation tile is removed from heat transfer seating face, and low temperature radiation tile is then close to heat transfer seating face; Circulation like this, makes each heat radiation tile in the process sequentially turning over heat transfer seating face, completes the cyclical heat exchange of heat absorption, heat release.

Above-mentioned cpu heat, when computer work, when cpu temperature is higher, heat radiation tile is heated comparatively fast, temperature control chip control cycle is shorter, therefore the speed of rotating cylinder intermittent rotary, when cpu temperature is lower, heat radiation tile is heated slower, temperature control chip control cycle is longer, therefore rotating cylinder intermittent rotary speed is comparatively slow, visible, this structure can regulate radiating rate automatically; In addition rotating mechanism is without the need to driven by motor, therefore there will not be noise in the course of the work; When room temperature itself is lower, CPU is without the need to heat radiation, and the temperature of the tile that now dispels the heat is not enough to make temperature control chip turning circuit, and now heating radiator does not work, and therefore this heating radiator is more scientific, energy-conservation.

As preferably, each rotating cylinder is fixed with 3-5 electromagnet brushing piece; This quantity can meet radiating requirements, simultaneously convenient for production.

As preferably, each described heat radiation tile offers louvre; So that accelerate heat radiation, endothermic effect.

Accompanying drawing explanation

Fig. 1 is the end section schematic diagram of this cpu heat embodiment one.

Embodiment

In the embodiment shown in fig. 1, this cpu heat includes four heat-sink units 1, and each heat-sink unit 1 includes heat transfer seat 2, heat radiation tile 5 and the fixed rotating shaft 3 made by ferrimagnet; The bottom surface of described heat transfer seat 2 is plane, and end face is the arc surface caved inward; The circle central axis of described arc surface is provided with fixed rotating shaft 3; On described fixed rotating shaft 3, turning set is provided with rotating cylinder 4, and on the perisporium of described rotating cylinder 4, circumference is evenly equipped with 3 electromagnet brushing pieces 6; The magnetic line of force direction of each described electromagnet brushing piece 6 is along the radial direction of described rotating cylinder 4; Described heat radiation tile 5 is installed with in the outer end of each described electromagnet brushing piece 6; Each described heat radiation tile 5 has the arcuate surface of the end face being right against described heat transfer seat 2, and each described heat radiation tile 5 offers louvre, not shown; In the process that each described heat radiation tile 5 rotates with rotating cylinder 4, the arcuate surface of each described heat radiation tile 5 is plunderred from the arc surface of described heat transfer seat 2 and is swept; Each described heat radiation tile 5 is also fixed with temperature control chip 51, and each described temperature control chip 51 is electrically connected with the electromagnet brushing piece 6 with its clockwise adjacent and controls the break-make of this electromagnet brushing piece 6 electric current.

When mounted by the fastening surface being attached to cpu chip, heat transfer seat 2 bottom surface of each heat-sink unit 1; When computer work, the temperature of CPU rises gradually, and the temperature of heat transfer seat 2 rises thereupon, and after the heat radiation tile 5 of seat 2 arc surface of pressing close to conduct heat is heated, temperature rises; When temperature arrives the critical value of the temperature control chip 51 on this heat radiation tile 5, temperature control chip 51 is by the circuit turn-on with the electromagnet brushing piece 6 corresponding to the heat radiation tile 5 of this heat radiation tile 5 clockwise adjacent; Electromagnet brushing piece 6 now switched on turns to heat transfer seat 2 by Magnetic force tracting, and 5, the heat radiation tile reaching temperature control chip 51 critical value pushed away from heat transfer seat 2 and external radiating and cooling, and the louvre be opened on heat radiation tile can accelerate heat radiation, endothermic effect; After a little while, the temperature pushed away from the heat radiation tile 5 of heat transfer seat 2 is down to below temperature control chip 51 critical value, and the temperature of pressing close to conduct heat on the heat radiation tile 5 of seat 2 reaches temperature control chip 51 critical value, thus another push-jump each heat radiation tile 5, high temperature heat radiation tile 5 is removed from heat transfer seat 2 surface, and low temperature radiation tile 5 is then close to heat transfer seat 2 surface; Circulation like this, makes each heat radiation tile 5 in the process sequentially turning over heat transfer seat 2 surface, completes the cyclical heat exchange of heat absorption, heat release.

Above-mentioned cpu heat, when computer work, when cpu temperature is higher, heat radiation tile 5 is heated comparatively fast, temperature control chip 51 control cycle is shorter, therefore the speed of rotating cylinder intermittent rotary, when cpu temperature is lower, heat radiation tile 5 is heated slower, temperature control chip 51 control cycle is longer, therefore rotating cylinder intermittent rotary speed is comparatively slow, visible, this structure can regulate radiating rate automatically; In addition rotating mechanism is without the need to driven by motor, therefore there will not be noise in the course of the work; When room temperature itself is lower, CPU is without the need to heat radiation, and the temperature of the tile 5 that now dispels the heat is not enough to make temperature control chip 51 turning circuit, and now heating radiator does not work, and therefore this heating radiator is more scientific, energy-conservation.

Compact structure of the present invention, flat, do not take too much space when mounted; In use, rotating cylinder 4 rotates for intermittent periods it, silver-colored high-speed rotation can not produce noise, drive simultaneously without the need to motor; In addition, the present invention can according to cpu temperature speed governing voluntarily, such that electricity consumption is more scientific, energy consumption is lower, more meets modern environmental protection, energy-conservation standard.

The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.

Claims

1. a cpu heat, this cpu heat includes the heat-sink unit (1) of more than three, it is characterized in that: each heat-sink unit (1) include made by ferrimagnet heat transfer seat (2), heat radiation tile (5) and fixed rotating shaft (3); The bottom surface of described heat transfer seat (2) is plane, and end face is the arc surface caved inward; The circle central axis of described arc surface is provided with fixed rotating shaft (3); Be provided with rotating cylinder (4) at the upper turning set of described fixed rotating shaft (3), on the perisporium of described rotating cylinder (4), circumference is evenly equipped with electromagnet brushing piece (6); The magnetic line of force direction of each described electromagnet brushing piece (6) is along the radial direction of described rotating cylinder (4); Described heat radiation tile (5) is installed with in the outer end of each described electromagnet brushing piece; Each described heat radiation tile (5) has the arcuate surface of the end face being right against described heat transfer seat; In the process that each described heat radiation tile (5) is rotated with rotating cylinder, the arcuate surface of each described heat radiation tile (5) is plunderred from the arc surface of described heat transfer seat (2) and is swept; Each described heat radiation tile (5) is also fixed with temperature control chip (51), and each described temperature control chip (51) is electrically connected with the electromagnet brushing piece (6) with its clockwise adjacent and controls the break-make of this electromagnet brushing piece (6) electric current.

2. cpu heat according to claim 1, is characterized in that: each rotating cylinder (4) is fixed with 3-5 electromagnet brushing piece (6).

3. cpu heat according to claim 1 and 2, is characterized in that: on each described heat radiation tile (5), offer louvre.