CN204422715U - Circuit radar installations - Google Patents
Circuit radar installations Download PDFInfo
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- CN204422715U CN204422715U CN201520033157.4U CN201520033157U CN204422715U CN 204422715 U CN204422715 U CN 204422715U CN 201520033157 U CN201520033157 U CN 201520033157U CN 204422715 U CN204422715 U CN 204422715U
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- probe
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- Locating Faults (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
The utility model discloses a kind of circuit radar installations, it can the accurate position of fault element (resistance, electric capacity or inductance) on locating circuit board, and it comprises power module, signal generating module, Signal reception and pretreatment module, test cable and probe, high-speed sampling analysis module, touches input and display module.Test periodic pulse signal is produced by signal generating module, this periodic pulse signal is input on microstrip line to be measured, the simultaneously signal of receiving transducer point on collection signal transmitting terminal and microstrip line, and calculate reflection coefficient thus, judge each impedance discontinuity point position, thus can the position of localizing faults element, the utility model achieves can locate all fault element positions on microstrip line to be measured by one-shot measurement on road.
Description
Technical field
The utility model relates to circuit board fault testing field, is specifically related to measure printed circuit board (PCB) by Time Domain Reflectometry (TDR) method and walks line impedence, computational reflect coefficient, judge the circuit radar installations of short dot position on road.
Background technology
In the debug process of circuit board, commissioning staff often can encounter the fault caused by element, as open circuit, short circuit, component value do not meet.When meeting these faults, often can only by removing all elements with malfunctioning node phasor one by one, often remove an element and just carry out primary fault test, until after removing certain element, failure vanishes, commissioning staff just can judge concrete fault element, and process of fixing a breakdown is very loaded down with trivial details, and when encounter have multiple fault element time process more complicated.
If the everywhere roughly reflection coefficient of certain cabling once can be measured, calculate impedance, then disposablely can judge the position of fault element, and this method is also suitable for multiple faults point circuit.
According to transmission line theory, when signal transmits on the transmission line, if it is discontinuous to run into characteristic impedance, can reflect, reflection coefficient
in formula, ρ represents reflection coefficient, Z
1represent near source micro-strip line impedance, Z
2represent that being connected on impedance is Z
1microstrip line after second segment micro-strip line impedance, the implication of this formula is signal is Z by impedance
1microstrip line to pass to impedance be Z
2microstrip line time reflection coefficient be ρ.When opening a way, ρ=1; When short circuit, ρ=-1.
Be used for measuring the method that printed circuit board (PCB) (PCB) walks line impedence and mainly contain TDR Test method and Distributed-parameter method.Tradition TDR Test method is only in transmitting terminal sampling step signal, the curve of " reflection coefficient-time " is drawn after high-speed sampling is carried out to signal transition edge, the speed transmitted in PCB cabling according to signal again calculates the position of impedance discontinuity point (impedance mismatching point), due to electric signal transmission speed quickly, appliance time error causes position to locate out of true, can not accurate fault point, also just can not accurate localizing faults element.
The instrument being used for measuring away line impedence mainly contains domain reflectometer and network analyzer, but these proprietary instruments all cost intensive, easily hundreds of thousands, up to a million, and this is difficult to accept for ordinary designer often.
When encountering short trouble, the method with secant got rid of one by one by the element that the method that most of commissioning staff gets rid of mainly adopts dismounting to be connected, and cannot judge short dot in drive test amount.In high-frequency circuit, secant can cause impedance discontinuity, havoc signal integrity, even causes design system cannot normally work completely.
Summary of the invention
The purpose of this utility model lacks circuit board assistant adjustment instrument to overcome on market, the difficulty of quick position fault element is difficult to and a kind of circuit radar installations provided when encountering fault, this device has measures PCB cabling any point place roughly reflection coefficient, so on road the function of accurate failure judgement point position.
The purpose of this utility model is achieved in that
On the basis of traditional TDR theory, on sample transmitting terminal signal and microstrip line, every bit signal is analyzed simultaneously, then accurately can locate impedance discontinuity point.
A kind of circuit radar installations of the present utility model, can fault element position on locating circuit board, and this device comprises:
Power module, for signal generating module, Signal reception and pretreatment module, high-speed sampling analysis module, touch input provide required voltage with display module;
Signal generating module, produces periodic pulse signal;
Transmitting probe, connection signal generation module and microstrip line one end to be measured, be transported on microstrip line to be measured by the periodic pulse signal that signal generating module produces;
Receiving transducer, connects microstrip line to be measured and Signal reception and pretreatment module, the signal at any point place on microstrip line is transported to Signal reception and pretreatment module;
Signal reception and pretreatment module, receive the signal from receiving transducer, and deliver to high-speed sampling analysis module after processing to the received signal;
High-speed sampling analysis module, carries out high-speed sampling and analysis to input signal;
Touch input and display module, be connected with high-speed sampling analysis module with signal generating module, constrained input interface is provided.
Described power module comprises external input power, voltage conversion circuit, and voltage conversion circuit is made up of voltage conversion chip, resistance, electric capacity and inductance, and the voltage transitions that described input power provides by voltage conversion circuit is other each module required voltages.
Described signal generating module is made up of pulse signal generating circuit, shaping circuit and SMA-K seat, pulse signal generating circuit, shaping circuit and SMA-K seat connect successively, wherein pulse signal generating circuit produces the periodic pulse signal needed, the amplitude of the periodic pulse signal that shaping circuit adjustment produces, rise time and output impedance (50 ohm), to reach testing requirement, and exported by SMA-K seat.
Described transmitting probe comprises SMA-J joint, 50 Omega cable, signal probe and grounded probe, 50 Omega cable one end connect SMA-J joint, one end connection signal probe and grounded probe, during test, SMA-J joint is connected with the SMA-K seat of signal generating module, grounded probe is welded on the ground node of microstrip line to be measured, and signal probe is welded on microstrip line to be measured.
Described receiving transducer comprises SMA-J joint, 50 Omega cable, signal probe and grounded probe, 50 Omega cable one end connect SMA-J joint, one end connection signal probe and grounded probe, during test, SMA-J joint is connected with the SMA-K seat of Signal reception and pretreatment module, grounded probe is welded on the ground node of microstrip line to be measured, and signal probe detects the signal on microstrip line to be measured.
Described Signal reception and pretreatment module comprise SMA-K seat and amplitude translation circuit, SMA-K seat is connected with receiving transducer, signal is by this SMA-K seat input range translation circuit, and amplitude translation circuit carries out amplitude control to signal, makes it the sampling of applicable high-speed sampling analysis module.
Described high-speed sampling analysis module is made up of high speed analog-to-digital conversion chip, storage buffer chip, flush bonding processor, high speed analog-to-digital conversion chip connects stored in storage buffer chip, flush bonding processor connects storage buffer chip, wherein the amplitude of input signal is converted to digital parameters stored in storage buffer chip by high speed analog-to-digital conversion chip, flush bonding processor reads parameter from storage buffer chip and analyzes, and analysis result is delivered to and touched input and display module.
Described touch input is made up of controller, touch-screen, loudspeaker with display module, touch-screen and loudspeaker are all connected on the controller, from the reflection coefficients bounds of the amplitude of touch-screen input stimulus pulse signal, cycle and alarm, amplitude, cycle information are sent to signal generating module after receiving by controller, and controller receives the data of high-speed sampling analysis module simultaneously.
The utility model solves the problem that in circuit debugging process, localizing faults element is difficult and position fixing process is loaded down with trivial details, achieves and can locate all fault element positions on microstrip line to be measured on road by one-shot measurement.
Accompanying drawing explanation
Fig. 1 is the utility model outside drawing.
Fig. 2 is the utility model transmitting probe and receiving transducer structural representation;
Fig. 3 is the utility model structured flowchart;
Fig. 4 is the utility model signal generating module structural frames;
Fig. 5 is the utility model embodiment schematic diagram;
Fig. 6 is impedance schematic diagram embodiment illustrated in fig. 5;
Fig. 7 is utility model works process flow diagram.
Embodiment
Consult Fig. 1, Fig. 2 and Fig. 3, the utility model is by power module, signal generating module, transmitting probe, receiving transducer, Signal reception and pretreatment module, high-speed sampling analysis module, touch input to form with display module and shell, circuit main board 1 is installed in the enclosure, power module, signal generating module, Signal reception and pretreatment module and high-speed sampling analysis module, loudspeaker is all fixed on circuit main board 1, touch-screen 2 is inclined and mounted on upper surface of outer cover, human-computer interaction interface is provided, the pulse signal that signal generating module produces is exported by SMA-K seat 3, signal input SMA-K seat 4, the signal received is carried out subsequent treatment by input herein, direct current 12V power input interface 8, the direct supply of 12V/2A is provided by outside.
Consult Fig. 2, transmitting probe of the present utility model comprises SMA-J joint 9,50 Omega cable 10, signal probe 11 and grounded probe 12,50 Omega cable 10 one end connect SMA-J joint 9, one end connection signal probe 11 and grounded probe 12, during test, SMA-J joint 9 is connected with the SMA-K seat 3 of signal generating module, and grounded probe 12 is welded on the ground node of microstrip line to be measured, and signal probe 11 is welded on microstrip line to be measured.
Consult Fig. 2, the utility model receiving transducer comprises SMA-J joint 13,50 Omega cable 14, signal probe 15 and grounded probe 17,50 Omega cable 14 one end connect SMA-J joint 13, one end connection signal probe 15 and grounded probe 16, during test, SMA-J joint 13 is connected with the SMA-K seat 4 of Signal reception and pretreatment module, and grounded probe 16 is welded on the ground node of microstrip line to be measured, and signal probe 15 detects the signal on microstrip line.
Consult Fig. 1-4, power module of the present utility model: adopt LM267, LM2743 two kinds of DC/DC conversion chips and EUP3010LDO chip, to be converted to required for other modules ± 5V, 3.3V, 2.5V, 1.8V and 1.2V voltage by the 12V direct supply that adapter inputs.
Signal generating module: be made up of pulse-generating circuit, pulse shaping circuit, wherein pulse-generating circuit produces periodic pulse signal, and the pulse width of periodic pulse signal and cycle are by the maximum traffic delay (TD of surveyed cabling
mAX) determine, inputted by touch-screen, require that the high level time of pulse and low level time enough allow and balance is reached to the reflected signal at edge.Pulse shaping circuit adjusts the amplitude of the pulse signal that pulse-generating circuit exports and shortens its rise time.
Transmitting probe: the signal that signal generating module produces outputs to the SMA-J joint 9 of transmitting probe, is then passed on emitting probe 11 by 50 Omega cable 10.
Receiving transducer: the signal on microstrip line to be measured inputs on 50 Omega cable 14 by receiving probe 15, then connects SMA-K seat 4 by SMA-J joint 13, the signal received is input to Signal reception and pretreatment module.
Signal reception and pretreatment module: receive the signal from receiving transducer, then carry out amplitude conversion to this signal, makes it the sampling of applicable high-speed sampling analysis module.
High-speed sampling analysis module: the high speed analog-to-digital conversion chip (ADC) being reached 1GSPS by 4 sampling rates carries out time-division sampling with the signal of transmitting terminal to the received signal simultaneously, the result of sampling passes to flush bonding processor analysis again stored in after FIFO storage buffer chip.
Touch input and display module: be made up of controller 5,9.7 cun of electric resistance touch screens 2, loudspeakers 7.By the reflection coefficients bounds of the amplitude of 9.7 cun of electric resistance touch screen 2 input stimulus pulse signals, cycle and alarm.The analysis result of controller 5 pairs of sampled signals judges, as then timely by loudspeaker alarm in alarm scope in run into reflection coefficient, can in the enterprising row labels of microstrip line at the receiving transducer place of correspondence after hearing alarm, other abnormal conditions need tester according to side circuit, judge in conjunction with display waveform and reflection coefficient.
Shell: provide protection to circuit board, fixes each signaling interface and touch-screen, handled easily simultaneously.
Embodiment
To test the transmission line of one section of " capacitance short-circuit " fault.
Consult Fig. 5, microstrip line starting point to be detected is M, and terminal is N, O, P, Q are point between MN, has welded an electric capacity O, P, Q 3 place is each, has been followed successively by C
1, C
2, C
3, the impedance of three electric capacity is followed successively by Z
1, Z
2, Z
3.In testing, suppose that micro-strip line impedance is 50 ohm, there occurs short trouble (test front and do not know).
Consult Fig. 1-7, the utility model accesses outside 12V/2A power supply to 8, press shift knob 6, device power initialization.
The signal probe 11 of transmitting probe is welded on microstrip line M one end, and the ground grounded probe 16 of transmitting probe grounded probe 12 and receiving transducer being welded to microstrip line place to be measured circuit board applies on copper.
Tester estimates maximum delay
in formula, x is the length of microstrip line, and unit is m; ε
rfor the specific inductive capacity of microstrip line place PCB; C is the light velocity 3 × 10
8m/s.From low level, the high level time of touch-screen 2 input stimulus pulse-period signal, ensure that two times are all much larger than TD
mAX, also need to arrange the amplitude of pulse signal in addition, alarm reflection coefficient is interval, when supposing that three electric capacity are normal in the present embodiment, reflection coefficient all can not exceed [-0.6,0.6], thus arrange alarm interval for≤-0.8,>=0.8.After controller receives the data of input, control wave produces circuit and produces respective pulses, and shaping circuit carries out adjustment to this periodic pulse signal to be made it to export corresponding driving pulse.
Receive probe 15 mobile from M point to N point.Impedance Z
0=50 ohm, output impedance of the present utility model, receive probe 15 when MO section (not containing O point) is above mobile, the signal that receiving transducer receives enters high-speed sampling analysis module after Signal reception and pretreatment module, high-speed ADC to after sample of signal by data stored in storage buffer chip, flush bonding processor read parameter analyze.(not containing O point) impedance is all coupling because MO section, thus from this segment signal that signal sending end and receiving transducer are sampled to reflected signal without exception.
When receiving probe 15 and crossing over O point, same, the signal that receiving transducer receives enters high-speed sampling analysis module sample analysis after Signal reception and pretreatment module, because O point has connect electric capacity to ground, impedance mismatch, instrument can analyze reflection, but the reflection coefficient calculated is not in alarm scope, device not alarm.
Receive probe 15 to continue to move to N end points, when OP section moves to P place, analyze to obtain this some place reflection coefficient close-1, in alarm scope, alarm while display waveform, tester marks to P point.It is to be noted that instrument only sends alarm to the point of reflection coefficient within the scope of alarm, other situations need tester to judge according to the reflection coefficient of display and impedance.
Remove C
2, receive probe 15 and continue to move to Q from P, then to N, can find that reflection coefficient is all in normal range.So comprehensive descision goes out on this microstrip line only have C
2there occurs fault, and the fault occurred is short circuit.
Can at the accurate location of drive test amount microstrip line line fault element by above-mentioned steps, can carry out failture evacuation fast, if there is multiple fault element, the step of eliminating is similar.
Claims (8)
1. a circuit radar installations, is characterized in that this device comprises:
Power module, for signal generating module, Signal reception and pretreatment module, high-speed sampling analysis module, touch input provide required voltage with display module;
Signal generating module, produces periodic pulse signal;
Transmitting probe, connection signal generation module and microstrip line one end to be measured, be transported on microstrip line to be measured by the periodic pulse signal that signal generating module produces;
Receiving transducer, connects microstrip line to be measured and Signal reception and pretreatment module, the signal at any point place on microstrip line is transported to Signal reception and pretreatment module;
Signal reception and pretreatment module, receive the signal from receiving transducer, and deliver to high-speed sampling analysis module after processing to the received signal;
High-speed sampling analysis module, carries out high-speed sampling and analysis to input signal;
Touch input and display module, be connected with high-speed sampling analysis module with signal generating module, constrained input interface is provided.
2. circuit radar installations according to claim 1, it is characterized in that: described power module comprises external input power, voltage conversion circuit, voltage conversion circuit is made up of voltage conversion chip, resistance, electric capacity and inductance, and the voltage transitions that described input power provides by voltage conversion circuit is other each module required voltages.
3. circuit radar installations according to claim 1, is characterized in that: described signal generating module is made up of pulse signal generating circuit, shaping circuit and SMA-K seat, and pulse signal generating circuit, shaping circuit and SMA-K seat connect successively.
4. circuit radar installations according to claim 1, it is characterized in that: described transmitting probe comprises SMA-J joint, 50 Omega cable, signal probe and grounded probe, 50 Omega cable one end connect SMA-J joint, one end connection signal probe and grounded probe, during test, SMA-J joint is connected with the SMA-K seat of signal generating module, and grounded probe is welded on the ground node of microstrip line to be measured, and signal probe is welded on microstrip line to be measured.
5. circuit radar installations according to claim 1, it is characterized in that: described receiving transducer comprises SMA-J joint, 50 Omega cable, signal probe and grounded probe, 50 Omega cable one end connect SMA-J joint, one end connection signal probe and grounded probe, during test, SMA-J joint is connected with the SMA-K seat of Signal reception and pretreatment module, and grounded probe is welded on the ground node of microstrip line to be measured, and signal probe detects signal on microstrip line to be measured.
6. circuit radar installations according to claim 1, it is characterized in that: described Signal reception and pretreatment module comprise SMA-K seat and amplitude translation circuit, SMA-K seat is connected with receiving transducer, signal is by this SMA-K seat input range translation circuit, and amplitude translation circuit carries out amplitude control to signal.
7. circuit radar installations according to claim 1, it is characterized in that: described high-speed sampling analysis module is made up of high speed analog-to-digital conversion chip, storage buffer chip, flush bonding processor, high speed analog-to-digital conversion chip connects stored in storage buffer chip, and flush bonding processor connects storage buffer chip.
8. circuit radar installations according to claim 1, is characterized in that: described touch input is made up of controller, touch-screen, loudspeaker with display module, and touch-screen and loudspeaker are all connected on the controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520033157.4U CN204422715U (en) | 2015-01-16 | 2015-01-16 | Circuit radar installations |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520033157.4U CN204422715U (en) | 2015-01-16 | 2015-01-16 | Circuit radar installations |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204422715U true CN204422715U (en) | 2015-06-24 |
Family
ID=53473071
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520033157.4U Expired - Fee Related CN204422715U (en) | 2015-01-16 | 2015-01-16 | Circuit radar installations |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204422715U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104614661A (en) * | 2015-01-16 | 2015-05-13 | 华东师范大学 | Circuit radar device |
-
2015
- 2015-01-16 CN CN201520033157.4U patent/CN204422715U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104614661A (en) * | 2015-01-16 | 2015-05-13 | 华东师范大学 | Circuit radar device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150624 Termination date: 20160116 |
|
| EXPY | Termination of patent right or utility model |