CN204407305U - A kind of wafer-separate device - Google Patents
A kind of wafer-separate device Download PDFInfo
- Publication number
- CN204407305U CN204407305U CN201520137372.9U CN201520137372U CN204407305U CN 204407305 U CN204407305 U CN 204407305U CN 201520137372 U CN201520137372 U CN 201520137372U CN 204407305 U CN204407305 U CN 204407305U
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- CN
- China
- Prior art keywords
- wafer
- separate device
- dividing plate
- magazine
- baffle plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005259 measurement Methods 0.000 claims description 7
- 238000011160 research Methods 0.000 claims description 7
- 238000012360 testing method Methods 0.000 claims description 7
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 238000012546 transfer Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 4
- 239000004614 Process Aid Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 83
- 238000010586 diagram Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Abstract
The utility model belongs to wafer process aid technical field, provide a kind of wafer-separate device, in one embodiment, wafer-separate device comprises dividing plate, lays respectively at baffle plate above and below described dividing plate, described baffle plate is connected with described dividing plate side, for fixing the first wafer magazine and the second wafer magazine.By arranging cavernous structure on described baffle plate, and the scale at cavernous structure edge, measurable institute transferring plates number.This wafer-separate device can effective fast transfer wafer, and effectively reduces wafer contaminated risk in transfer process.
Description
Technical field
The utility model relates to wafer process aid technical field, particularly relates to a kind of wafer-separate device.
Background technology
At present in LED processing procedure, the raw material of used crystal chip are generally silicon chip or sapphire etc., its shape have square, circular, class is square, usually in the LED wafer course of processing, multiple wafer parallel need be positioned in wafer magazine and preserve, and in order to increase the utilance of wafer magazine, the gap between usual wafer and wafer is less.Therefore in follow-up production technology, in order to from taking out the wafer of requirement in the first wafer magazine in the second wafer magazine, be generally after operator counts the number of required substrate, take out piecewise from the first wafer magazine with suction pen or tweezers again, which is easy scratch or pollution wafer not only, and workload is large, operating efficiency is low.
summary of the invention:
For the problems referred to above, the utility model proposes a kind of wafer-separate device, for by wafer fast transfer to the second wafer magazine in the first wafer magazine, and effectively reduce the risk that wafer is polluted.
In one embodiment, the technical solution of the utility model is: the dividing plate that wafer-separate device comprises placement second wafer magazine and the baffle plate be positioned at below described dividing plate, described baffle plate is connected with described dividing plate side, for fixing the first wafer magazine.
In its another embodiment, the technical solution of the utility model is: wafer-separate device comprises dividing plate, lay respectively at baffle plate above and below described dividing plate, and described baffle plate is connected with described dividing plate side, for fixing the first wafer magazine and the second wafer magazine.
Preferably, described baffle plate is equipped with multiple cavernous structure, described multiple cavernous structure edge has scale, in order to First Astronautic Research Institute for Measurement and Test's transferring plates number.
Preferably, a side of described dividing plate is equipped with hatch frame, and described hatch frame edge has scale, in order to First Astronautic Research Institute for Measurement and Test's transferring plates number.
Preferably, the dual-side of described dividing plate is all equipped with hatch frame, and described hatch frame edge has scale, in order to First Astronautic Research Institute for Measurement and Test's transferring plates number.
Preferably, described wafer-separate device is stainless steel or polytetrafluoroethylplastic plastic.
Preferably, described dividing plate is consistent with the width of both the first wafer magazines.
Preferably, described dividing plate, the first wafer magazine are all consistent with the width of the second wafer magazine three.
The utility model at least comprises following beneficial effect:
(1) due to wafer sort device having scale, can quantitative transferring plates effectively fast and accurately;
(2) inhale pen or tweezers owing to saving, effectively reduce wafer contaminated risk in transfer process.
Accompanying drawing explanation
Accompanying drawing is used to provide further understanding of the present utility model, and forms a part for specification, is used from explanation the utility model, does not form restriction of the present utility model with embodiment one of the present utility model.In addition, accompanying drawing data describe summary, is not draw in proportion.
Fig. 1 is the structural representation of the wafer-separate device of the embodiment 1 of the utility model.
Fig. 2 is the plan structure schematic diagram that the wafer-separate device of the embodiment 1 of the utility model is combined with the first wafer magazine.
Fig. 3 is the cross section structure schematic diagram sectional view of A-A direction (in the Fig. 2) that the wafer-separate device of the embodiment 1 of the utility model is combined with first, second wafer magazine.
Fig. 4 is the structural representation of the wafer-separate device of the embodiment 2 of the utility model.
Fig. 5 is the cross section structure schematic diagram that the wafer-separate device of the embodiment 2 of the utility model is combined with first, second wafer magazine.
Accompanying drawing marks: 1: dividing plate; 11: hatch frame; 2,3: baffle plate; 21: cavernous structure; 12,22: scale; 4: the first wafer magazines; 41: fixed leg; 42: circular hole; 5: the second wafer magazines.
Embodiment
Below in conjunction with drawings and Examples, embodiment of the present utility model is described in detail.
embodiment 1
Referring to accompanying drawing 1, a kind of wafer-separate device that the present embodiment provides, comprise dividing plate 1 and baffle plate 2, baffle plate 2 is positioned at the below of dividing plate 1 and is connected with it, is positioned over the top of dividing plate 1 for fixing the first wafer magazine 4, second wafer magazine 5.Dividing plate 1 width is consistent with the width of the first wafer magazine 4, and the first wafer magazine 4 is consistent with the second wafer magazine 5 width.The present embodiment dual-side below dividing plate all connects baffle plate 2, fixes the first wafer magazine 4 in order to stable.The one or both sides of dividing plate 1 are provided with strip hatch frame 11, have scale 12 in its edge, in order to measure transferring plates number.Conveniently observe scale 12, the present embodiment preferably all arranges hatch frame 11 and scale 12 in the both sides of dividing plate 1.Wafer-separate device is stainless steel or polytetrafluoroethylplastic plastic, and the resilient characteristic of wafer-separate utensil, fix wafer magazine by clamping wafer magazine placed within.The surface at the first wafer magazine 4 and the second wafer magazine 5 one sidewall two ends is provided with fixed leg 41, and the surface at another sidewall two ends is provided with circular hole 42, and fixed leg 41 can insert in circular hole 42.
When utilizing above-mentioned wafer-separate device separating wafer, referring to accompanying drawing 2, be positioned in the baffle plate 2 below dividing plate 1 by the first wafer magazine 4 filling wafer from baffle plate 2 side openings, the fixed leg 41 of the first wafer magazine 4 is through hatch frame 11; Then move wafer-separate device, fixed leg 41 slides in hatch frame 41, exposes wafer to be separated, and by the hatch frame 11 on dividing plate 1 and scale 12 thereof, measures wafer to be separated.Referring to accompanying drawing 3, second wafer magazine 5 of sky is positioned over above dividing plate 1, make the first wafer magazine 4 relative with the opening of the second wafer magazine 5, and make the fixed leg 41 of the first wafer magazine 4 insert in the circular hole 42 of the second wafer magazine 5, the fixed leg 41 of the second wafer magazine 5 inserts in the circular hole 42 of the first wafer magazine 4 simultaneously, aims to make two plates magazine; Then while, manual overturning wafer-separate device, the first wafer magazine 4 and the second wafer magazine 5, can be transferred to the second wafer magazine 5 by wafer to be separated from the first wafer magazine 4; Finally the first wafer magazine 4 is separated rear taking-up with the second wafer magazine 5.
Number of wafers to be transferred is measured owing to utilizing the scale 12 on dividing plate 1, avoid and manually utilize tweezers or inhale the operation that pen picks and places wafer, this wafer-separate device can quantitative transferring plates effectively fast and accurately, effectively reduces wafer contaminated risk in transfer process simultaneously.
embodiment 2
Referring to accompanying drawing 4, the difference of the present embodiment and embodiment 1 is: a kind of wafer-separate device that the present embodiment provides, and arranges the baffle plate 3 be connected with dividing plate 1 side, in order to fix the second wafer magazine 5 above dividing plate 1; Baffle plate 2 is provided with multiple cavernous structure 21, its edge has scale 22, in order to First Astronautic Research Institute for Measurement and Test's transferring plates number.Baffle plate 3 is all fixedly connected with the both sides of dividing plate 1, and described dividing plate 1, first wafer magazine 4 is all consistent with the width of the second wafer magazine 5 three.
Referring to accompanying drawing 5, when utilizing above-mentioned wafer-separate device separating wafer, be positioned in baffle plate 2 by the first wafer magazine 4 filling wafer from baffle plate 2 sidewall opening, moveable partition board 1, measures wafer to be separated; Then the second wafer magazine 5 of sky is positioned in baffle plate 3 from the upper side opening of baffle plate 3, and makes the opening of the second wafer magazine 5 relative with the first wafer magazine 4; Then, overturn wafer-separate device, the first wafer magazine 4 and the second wafer magazine 5 simultaneously, wafer to be separated is transferred in the second wafer magazine 5 from the first wafer magazine 4.Be equipped with baffle plate 3 and baffle plate 2 in dividing plate 1 upper and lower both sides, the second wafer magazine 5 and the first wafer magazine 4 can be fixed better, so get final product efficient quick, accurate transferring plates, and reduce the contaminated risk of wafer.
The wafer-separate device that the utility model proposes, can for the wafer placing different size, such as 2 cun, 4 cun, 6 cun etc., different according to the width of wafer magazine, and the width of flexible dividing plate, increases the scope of application of wafer-separate device, realize it and use flexibly.
Should be understood that, above-mentioned specific embodiments is preferred embodiment of the present utility model, and scope of the present utility model is not limited to this embodiment, and all any changes done according to the utility model, all belong within protection range of the present utility model.
Claims (8)
1. a wafer-separate device, for the wafer in the first wafer magazine is quantitatively transferred in the second wafer magazine, it is characterized in that: the dividing plate that described wafer-separate device comprises placement second wafer magazine and the baffle plate be positioned at below described dividing plate, described baffle plate is connected with described dividing plate side, for fixing the first wafer magazine.
2. a kind of wafer-separate device according to claim 1, it is characterized in that: described wafer-separate device also comprises the baffle plate be positioned at above described dividing plate, described baffle plate is connected with described dividing plate side, for fixing the second wafer magazine.
3. a kind of wafer-separate device according to claim 1 and 2, is characterized in that: described baffle plate is equipped with multiple cavernous structure, and described multiple cavernous structure edge has scale, in order to First Astronautic Research Institute for Measurement and Test's transferring plates number.
4. a kind of wafer-separate device according to claim 1 and 2, it is characterized in that: a side of described dividing plate is equipped with hatch frame, described hatch frame edge has scale, in order to First Astronautic Research Institute for Measurement and Test's transferring plates number.
5. a kind of wafer-separate device according to claim 1 and 2, is characterized in that: the dual-side of described dividing plate is all equipped with hatch frame, and described hatch frame edge has scale, in order to First Astronautic Research Institute for Measurement and Test's transferring plates number.
6. a kind of wafer-separate device according to claim 1 and 2, is characterized in that: described wafer-separate device is stainless steel or polytetrafluoroethylplastic plastic.
7. a kind of wafer-separate device according to claim 1, is characterized in that: described dividing plate is consistent with the width of both the first wafer magazines.
8. a kind of wafer-separate device according to claim 2, is characterized in that: described dividing plate, the first wafer magazine are all consistent with the width of the second wafer magazine three.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520137372.9U CN204407305U (en) | 2015-03-11 | 2015-03-11 | A kind of wafer-separate device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520137372.9U CN204407305U (en) | 2015-03-11 | 2015-03-11 | A kind of wafer-separate device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204407305U true CN204407305U (en) | 2015-06-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520137372.9U Active CN204407305U (en) | 2015-03-11 | 2015-03-11 | A kind of wafer-separate device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204407305U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107993968A (en) * | 2018-01-08 | 2018-05-04 | 中国电子科技集团公司第四十六研究所 | A kind of bogey for special-shaped chip |
-
2015
- 2015-03-11 CN CN201520137372.9U patent/CN204407305U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107993968A (en) * | 2018-01-08 | 2018-05-04 | 中国电子科技集团公司第四十六研究所 | A kind of bogey for special-shaped chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |