CN204396884U - Molten drop sprays prepares soldered ball device - Google Patents
Molten drop sprays prepares soldered ball device Download PDFInfo
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- CN204396884U CN204396884U CN201420760466.7U CN201420760466U CN204396884U CN 204396884 U CN204396884 U CN 204396884U CN 201420760466 U CN201420760466 U CN 201420760466U CN 204396884 U CN204396884 U CN 204396884U
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Abstract
The utility model relates to the injection of a kind of molten drop and prepares soldered ball device.The utility model is characterized in that comprising heating system, soldered ball produces system, gas supply system, soldered ball gathering system, stable gas pressure system, described heating system produces system by soldered ball and is connected with soldered ball gathering system, and described stable gas pressure system is connected with heating system, described gas supply system is connected with stable gas pressure system and soldered ball gathering system respectively by vavuum pump, arranges cooling fluid in described soldered ball gathering system.The utility model is specially adapted to the preparation that diameter is greater than 1mm soldered ball, and structure is simple, easy to operate, reduces production cost, ensure that the stability of production, and be suitable for the soldering tin material of different melting points, meet the technical requirement of Electronic Assemblies industry.
Description
Technical field
The utility model belongs to technical field prepared by used in electronic industry solder ball, particularly a kind of device and method utilizing molten drop ejector principle to prepare soldered ball.
Background technology
Along with electronic device welds diversified trend, solder ball is as the critical material in hyundai electronics assembling field, and the market demand is increasing.The method preparing soldered ball is both at home and abroad more, and the technology generally used mainly contains atomization, chopping or punching remelting process etc., and wherein to prepare the decentralization of spherical particle wider for atomization, and process of setting complexity is uncontrollable, organizes various irregular.Chopping or punching remelting process complex procedures, efficiency are low, are restricted in actual applications, especially cannot process containing Bi alloy for fragility.
In order to solve a difficult problem for ball processed, at present the homogeneous drop method of forming (UDS) is mainly concentrated on to the research of spherical particle technology of preparing, utilize the principle of jet breakup, the longitudinally even vibration produced by piezoelectric vibration exciter makes metal jet be fractured into uniform drop and rapid solidification, realizes the complete and homogeneous of particle in size, shape and thermodynamic condition etc.According to the difference applying disturbance, symmetrical liquid drop method can be divided into again mechanical vibration method, piezoelectric vibration method, electric field atomization.But these methods all exist equipment bulky complex, high in cost of production shortcoming, simultaneously due to forcing frequency restriction, even solder ball diameter prepared by UDS is minimum is 50um, is 1000um to the maximum, is difficult to meet the preparation requirement that diameter is greater than 1mm soldered ball.
Utility model content
The defect that the utility model exists for prior art, a kind of device utilizing molten drop ejector principle to prepare soldered ball is provided, reduce the cost of used in electronic industry solder ball injection apparatus, simplify overall structure, and be applicable to preparation large scale soldered ball (diameter is greater than 1mm).
The utility model takes following technical scheme for this reason: molten drop sprays prepares soldered ball device, it is characterized in that comprising heating system, soldered ball produces system, gas supply system, soldered ball gathering system, stable gas pressure system, described heating system produces system by soldered ball and is connected with soldered ball gathering system, described stable gas pressure system is connected with heating system, described gas supply system is connected with stable gas pressure system and soldered ball gathering system respectively by vavuum pump, arranges cooling fluid in described soldered ball gathering system.
Utilize above-mentioned device to prepare soldered ball; first in heating system, pass into inert gas protection; add hot solder to molten condition; diameter according to preparation solder ball selects suitable nozzle bore; under uniform temperature and pressure reduction; fusion welding is penetrated by the aperture of nozzle 10, drops to cooling fluid 14 coagulation system and form soldered ball, take out cleaning-drying and preserve.By the jet velocity regulating the pressure reduction between soldered ball gathering system and stable gas pressure system to control soldered ball.Control liquid solder evenly to spray from nozzle orifice, fall into the container cooled and solidified that cooling fluid is housed and form soldered ball.This device can be used for the preparation of low melting point (being less than 400 DEG C) metal and the even solder ball of alloy.
The research of the people such as University of California Orme shows to there is a small intrinsic disturbance without jet under external disturbance, and metal jet can be caused to rupture.This device is the disturbance device eliminating molten drop generation on the basis optimizing nozzle, and utilize the surface tension of small molten drop, the fluid column of injection forms circular little molten drop at nozzle orifice place.The material and design of nozzle is the key factor that solder ball is formed, if moistening by liquid solder around nozzle orifice, under capillary effect, the molten drop of injection will rupture slower; If nozzle orifice infiltrates asymmetric, spraying molten drop will deflect.
When the liquid solder flowing through undergauge place is forced to undergauge, according to laplace's theorem, the place that undergauge place radius of curvature is less, the additonal pressure produced by surface tension is larger, just exacerbates the separation of molten drop, more easily forms the filler droplet of size uniform.Newton's law of cooling can estimate diameter is in addition that the filler droplet of 1.5mm solidifies completely in atmosphere and needs the height of container to reach tens of rice, therefore must cool molten drop by cooling fluid, due to silicone oil there is high-low temperature resistant, the advantage such as heat conduction is fast, anti-oxidant, flash-point is high, volatility is little, good insulating, surface tension are little, corrosion-free to metal, nontoxic, and viscosity can reduce greatly the speed that molten drop falls, and selects silicone oil as fluid dielectric coolant here.
The utility model is specially adapted to the preparation that diameter is greater than 1mm soldered ball, and structure is simple, easy to operate, reduce production cost, ensure that the stability of production, and be suitable for the soldering tin material of different melting points (being less than 400 DEG C), meet the technical requirement of Electronic Assemblies industry.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model
The structural representation of nozzle in Fig. 2 soldered ball generation system
Fig. 3 is that the molten drop of nozzle bottom forms schematic diagram.
In figure: 1-heating system, 2-soldered ball produces system, 3-gas supply system, 4-soldered ball gathering system, 5-stable gas pressure system, 6-vavuum pump, 7-crucible, 8-heating wire, 9-top cover, 10-nozzle, 11-thermocouple, 12-Pressure gauge 1,13-observation window, 14-cooling fluid, 15-lifting platform, 16 stop valves, 17-Pressure gauge 2,18-illuminating lamp.
Detailed description of the invention
Present embodiment is illustrated below in conjunction with accompanying drawing.
As Figure 1-3, molten drop injection is prepared soldered ball device and is comprised heating system 1, and soldered ball produces system 2, gas supply system 3, soldered ball gathering system 4, stable gas pressure system 5.
Heating system is made up of crucible 7, heating wire 8, top cover 9, nozzle 10 and thermocouple 11.Be fixed with 1000W heater strip 8 outside crucible and arrange heat-preservation cotton, crucible 7 side is provided with air flow inlet, crucible bottom and soldered ball gathering system 4 top fastening and seal, crucible centre bottom arranges nozzle 10, and nozzle 10 is fixed on crucible 7 by screw thread.Top cover 9 is fixed on crucible 7 top by trip bolt.Thermocouple 11 is arranged on above solder molten bath bottom nozzle 10.
Soldered ball produces system 2 and comprises nozzle,
Soldered ball gathering system comprises Pressure gauge 12, and observation window 13, illuminating lamp 18 and cooling fluid 14, cooling fluid 14 is preferably silicone oil.The bottom of cooling fluid also arranges lifting platform, the height of lifting cooling fluid.
Stable gas pressure system 5 is connected with solder heating system 1, controls the stability of crucible 7 molten bath air pressure.Gas supply system comprises vavuum pump 6 and gas cylinder 3, the air pressure of vavuum pump adjustable pressure systems stabilisation 5 and soldered ball gathering system 4.Stop valve 16 is provided with outside stable gas pressure system 5 and soldered ball gathering system 4.Stable gas pressure system 5 also installs air gauge 17.
Preparation process of the present utility model comprises following four steps: set-up procedure, vacuumizes and heating process, the production process of symmetrical liquid drop, the collection of alloying pellet, cleaning process.
To prepare the Sn3.0Ag0.5Cu solder ball (fusing point is 217 DEG C) of 1.50mm, be specially and take 1kg Sn3.0Ag0.5Cu solid solder and put into crucible 7, fastening and top pressure closure 9; Droplet-generating systems is accessed crucible 7 centre bottom and fastening, the diameter wherein choosing nozzle 10 is 0.5mm; Hand stop valve 16 and vavuum pump 6 is closed when whole air-channel system being evacuated to 10Pa; Then being filled with inert nitrogen gas to Pressure gauge is 1.05 atmospheric pressure, is again evacuated to 10Pa, and repeatedly pumping, gas replenishment process make for 2-3 time chamber nitrogen gas concn close to the level of technical grade nitrogen used in experiment; Open heating system 1, automatic temperature-control heating to 360 DEG C also stablizes 30 minutes, expulsion pressure difference is for 10kPa to regulate Pressure gauge 12 and 17 to determine, regulate lifting platform 15 to make nozzle 10 be 10cm with the distance of cooling fluid 14, monitored the generation of molten drop by observation window 13 in real time, control to spray soldered ball speed at 100-200/min, collect in silicone oil cooling fluid 14 after injection completes, taking-up soldered ball cleans, dry, preserves.Note crucible 7 to keep negative pressure in heating process in order to avoid solder is conducted oneself with dignity and in crucible, gas causes motlten metal to be forced out in advance owing to adding thermal expansion.
The utility model is without under external disturbance, designed by Optimizing Spray Nozzle Structure, utilize the surface tension of molten drop, spray the solder ball of preparation major diameter (being greater than 1mm), pressure reduction systems stabilisation ensure that the stability of production, and be suitable for the soldering tin material of different melting points (being less than 400 DEG C), meet the technical requirement of Electronic Assemblies industry.
Claims (5)
1. molten drop sprays and prepares soldered ball device, it is characterized in that comprising heating system (1), soldered ball produces system (2), gas supply system, soldered ball gathering system (4), stable gas pressure system (5), described heating system (1) produces system (2) by soldered ball and is connected with soldered ball gathering system (4), described stable gas pressure system (5) is connected with heating system (1), described gas supply system is connected with stable gas pressure system (5) and soldered ball gathering system (4) respectively by vavuum pump (6), in described soldered ball gathering system (4), cooling fluid (14) is set.
2. molten drop according to claim 1 sprays and prepares soldered ball device, it is characterized in that described heating system is made up of crucible (7), heating wire (8), top cover (9), thermocouple (11), be fixed with heater strip (8) outside described crucible and heat-preservation cotton is set, crucible centre bottom arranges nozzle (10), and described thermocouple (11) is arranged on top, solder molten bath bottom nozzle (10).
3. molten drop according to claim 2 sprays and prepares soldered ball device, it is characterized in that described soldered ball gathering system comprises Pressure gauge (12), observation window (13), illuminating lamp (18), described cooling fluid (14) is silicone oil.
4. molten drop according to claim 3 sprays and prepares soldered ball device, it is characterized in that also arranging lifting platform (15) in described soldered ball gathering system, the height of lifting cooling fluid.
5. molten drop according to claim 4 sprays and prepares soldered ball device, it is characterized in that being provided with stop valve (16) outside described stable gas pressure system (5) and soldered ball gathering system (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420760466.7U CN204396884U (en) | 2014-12-05 | 2014-12-05 | Molten drop sprays prepares soldered ball device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420760466.7U CN204396884U (en) | 2014-12-05 | 2014-12-05 | Molten drop sprays prepares soldered ball device |
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| CN204396884U true CN204396884U (en) | 2015-06-17 |
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| CN201420760466.7U Active CN204396884U (en) | 2014-12-05 | 2014-12-05 | Molten drop sprays prepares soldered ball device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104525958A (en) * | 2014-12-05 | 2015-04-22 | 浙江亚通焊材有限公司 | Device and method for using molten droplet spraying to prepare solder ball |
| CN105397096A (en) * | 2015-11-30 | 2016-03-16 | 苏州瑞而美光电科技有限公司 | Preparation device for standard-diameter BGA (ball grid array) packaging metal welding ball |
| CN109604621A (en) * | 2019-01-16 | 2019-04-12 | 合肥百思新材料研究院有限公司 | It is a kind of can be freely lifted from gravity metal fritting glowing furnace |
-
2014
- 2014-12-05 CN CN201420760466.7U patent/CN204396884U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104525958A (en) * | 2014-12-05 | 2015-04-22 | 浙江亚通焊材有限公司 | Device and method for using molten droplet spraying to prepare solder ball |
| CN105397096A (en) * | 2015-11-30 | 2016-03-16 | 苏州瑞而美光电科技有限公司 | Preparation device for standard-diameter BGA (ball grid array) packaging metal welding ball |
| CN109604621A (en) * | 2019-01-16 | 2019-04-12 | 合肥百思新材料研究院有限公司 | It is a kind of can be freely lifted from gravity metal fritting glowing furnace |
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| C14 | Grant of patent or utility model | ||
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Address after: No. 372, Jinpeng Street, Sandun Town, Xihu District, Hangzhou, Zhejiang 310030 Patentee after: Zhejiang Yatong New Materials Co.,Ltd. Address before: 310030 Sandun Industrial Zone, Xihu District, Hangzhou, Zhejiang Patentee before: ZHEJIANG ASIA GENERAL SOLDERING & BRAZING MATERIAL Co.,Ltd. |