CN204392411U - A kind of image collection processing system of Overview of Novel Infrared Imaging Technologies - Google Patents

Abstract

The utility model discloses a kind of image collection processing system of Overview of Novel Infrared Imaging Technologies, this system is made up of image capture module, image processing module, image network transport module, a few part of software-driven modules; Image capture module, using image collection chip as infrared image sensor, carries out real-time infrared image collection; Image processing module is processed the picture signal collected by the video port that TMS320DM642 dsp chip provides, and image network transport module utilizes EMAC controller integrated on TMS320DM642 dsp chip and PHY chip LXT971A to complete the real-time network transmission of image; This system can complete IMAQ, process and netinit and utilize task, the features such as this system has high sensitivity simultaneously, processing speed is fast, high reliability, volume are little, low cost.

Description

A kind of image collection processing system of Overview of Novel Infrared Imaging Technologies

Technical field

The utility model belongs to the embody rule of infrared imagery technique, particularly relates to a kind of image collection processing system of Overview of Novel Infrared Imaging Technologies.

Background technology

Infrared thermoviewer is researched and developed in order to military purposes the earliest, and through so years development, thermal infrared imager is widely used in commercial market.In military domain, thermal infrared imager is widely used in sea, road, the empty army, and such as target identification, precise guidance, night reconnaissance monitor etc.At civil area, along with the reduction of the production cost of thermal infrared imager, all play an important role in medical treatment, electric power, industry, fire-fighting etc., such as board failure detection, fault investigation etc., it can find some defect that cannot find by conventional method and mistakes, thus can reduce costs, increase the qualification rate of product, very large impetus is played to the daily productive life of people.

The development prospect of thermal infrared imager is boundless, application widely, but domestic market always monopolize by west foreign corporation, only provide mid and low-end products to China, high-end product belongs to embargo, and expensive.Along with the development of MEMS technology, a kind of non refrigerating infrared imaging technology based on photodynamics effect is born in China, and compared with traditional refrigeration mode infrared imagery technique, it has the advantage of low-power consumption, miniaturization, high-resolution, low cost and non-brake method.Relatively late based on the light reading non refrigerating infrared imaging technology starting of MEMS in China, but country has dropped into a large amount of manpower and materials, and make some progress.Nineteen ninety-five, Changchun Optical and Precise Machinery Inst., Chinese Academy of Science's utilized micromachining technology to succeed in developing alignment 32 yuan, 128 yuan of silicon Microbolometer Array, NETD is 300Mk, and memory time is 1ms.2003, Chinese University of Science and Technology cooperated with Microelectronics Institute of the Chinese Academy of Sciences, utilized the method for knife edge filtering to obtain the infrared thermal imagery of 200 DEG C of objects, and its temperature resolution is 7K.2006, they can obtain the infrared thermal imagery of object under room temperature.And obtained the moving image of 60m human body with 2007.Based on above-mentioned background, this utility model provide a kind of there is high sensitivity, the image acquisition and processing module for non refrigerating infrared imaging of the feature such as processing speed is fast, high reliability, volume are little, low cost, product is finally become for domestic thermal infrared imager acp chip and moves towards market, have quite significantly progradation.

Utility model content

Slow actual conditions are managed for domestic thermal infrared imager IMAQ and treatment system sensitivity lower, the purpose of this utility model is, provide a kind of for non refrigerating infrared imaging there is high sensitivity, the image collection processing system of the feature such as processing speed is fast, high reliability, volume are little, low cost.

In order to realize above-mentioned task, the utility model adopts following technical solution:

An image collection processing system for Overview of Novel Infrared Imaging Technologies, is characterized in that: comprise image capture module, image processing module, image network transport module, software-driven modules; Described image capture module, using image collection chip as infrared image sensor, carries out real-time infrared image collection; Described image processing module is processed the picture signal collected by the video port that TMS320DM642 dsp chip provides, and described image network transport module utilizes the PHY chip LXT971A of EMAC controller integrated on TMS320DM642 chip and Inter company to complete the real-time network transmission of image; Described software-driven modules is based on the DSP/BIOS real-time multi-task operating system of TI, complete IMAQ, image procossing and netinit task, simultaneously in netinit task, Dynamic Establishing network sends task again, in order to send video data, completes the reception of host computer.

Concrete, when the infrared image of imaging object is radiated on the CMOS of image capture module, the infrared picture data collected is transferred to image processing module by CMOS, through the VP mouth FIFO of TMS320DM642 dsp chip, be stored in SDRAM chip by EDMA, then TMS320DM642 dsp chip processes the image be stored in SDRAM chip, through EMAC interface after having processed, image network transport module is utilized to send to host computer, then host computer completes display and the storage of image, video acquisition module gathers new frame of video more simultaneously, carry out the process of next round, meanwhile, said process all completes under the control of software-driven modules.

In this image collection processing system, described image capture module is using the MT9P031 cmos image acquisition chip of Micron company as infrared image sensor; Described image collection chip carries ADC, output is 12 RAW video modes, under RAW pattern, MT9P031 provides the synchronous LINE_VALID signal that arranges to be connected with the VPxCTL0 of TMS320DM642 by internal register, there is provided line synchronizing signal to TMS320DM642, control its working method.

In this image collection processing system, described image processing module comprises power unit, reset circuit, TMS320DM642 dsp chip, SDRAM chip, FLASH memory, two pieces of Switching Power Supply MAX1951 and piece linear power supply LT1963A selected by described power unit, 3.3V and 1.4V (DM642 kernel) voltage is produced by Switching Power Supply, 1.8V voltage is produced with LT1963A, power to MT9P031 cmos image collection plate, for whole system provides power consumption endlessly, ensure that on integrated circuit, each IC can correctly work reliably; Described reset circuit access TMS320DM642 dsp chip, reset threshold is 3.08V, namely when the voltage of VCC is less than 3.08V, will, in reseting pin output low level, when VCC voltage is greater than 3.08V, continue to keep low level 200ms; Described TMS320DM642 dsp chip is integrated with the VP mouth that 3 are used as video image acquisition specially, the video acquisition of the maximum support of each VP mouth 20, and each VP mouth is divided into A, B two passages, these two passages can independently use, be configured to video acquisition mouth or video output, each video port has again the FIFO of 5120KB, so that the buffer memory of video data uses; Simultaneously, described TMS320DM642 dsp chip is integrated with Ethernet foreign medium access controller (EMAC) and meets IEEE 802.3 specification, support the half-or full-duplex pattern of 10Mbps/100Mbps, there is independent media's interface (MII), can directly be connected with PHY device, realize view data and Internet Transmission; Further, described TMS320DM642 dsp chip is integrated with external memory interface (EMIFA), and EMIFA interface is 64 bit wides, can expand the memory space of 1G, can realize seamless link that is synchronous with the overwhelming majority or asynchronous memory; Further, described TMS320DM642 dsp chip is also integrated with multi-channel audio serial line interface (McASP), multichannel buffer memory serial ports (McBSP), I2C bus module, general GPIO interface, and HPI, pci interface, for the image processing equipment developing transmission Network Based is further provided convenience; The MT48LC4M32B2 of described SDRAM chip selection Micron company, operating voltage 3.3V, directly be connected with TMS320DM642 dsp chip by EMIFA interface, system uses two panels MT48LC4M32B2 to be expanded into 4Mx64b, operating frequency 133MHz, to meet the demand of system to memory space and speed.

the beneficial effects of the utility model are:

The utility model is made up of image capture module, image processing module, image network transport module, a few part of software-driven modules; Described image capture module, using image collection chip as infrared image sensor, carries out real-time infrared image collection; Described image processing module is processed the picture signal collected by the video port that TMS320DM642 dsp chip provides, and described image network transport module utilizes the PHY chip LXT971A of EMAC controller integrated on TMS320DM642 chip and Inter company to complete the real-time network transmission of image; Described software-driven modules is based on the DSP/BIOS real-time multi-task operating system of TI, complete IMAQ, image procossing and netinit task, simultaneously in netinit task, Dynamic Establishing network sends task again, in order to send video data, completes the reception of host computer.By modularized design, respectively to the realization that the image capture module in system, image processing module, image network transport module, software-driven modules carry out one by one, achieve each module specific function in systems in which.

This system is based on DSP platform, the infrared image of target object can be obtained, CMOS chip AD conversion precision is 12, can improve the contrast of image, based on the NDK bag that TI provides, achieve the Internet Transmission of image, transmission speed reaches 100Mbps, the DSP/BIOS ease of Use system adopting TI to provide, and completes IMAQ, process and netinit respectively and utilizes task, be conducive to the modularization of program, improve programming efficiency.The features such as this system has high sensitivity simultaneously, processing speed is fast, high reliability, volume are little, low cost.

Accompanying drawing explanation

Below in conjunction with the drawings and specific embodiments the utility model is further explained explanation.

Fig. 1 is infrared imaging image collection processing system block diagram;

Fig. 2 is hardware system block diagram;

Fig. 3 is that image capture module circuit connects block diagram;

Fig. 4 is reset circuit figure;

Fig. 5 is image network transport module structured flowchart;

Fig. 6 is the connection diagram of image network transport module.

Embodiment

Specific implementation process of the present utility model is: when the infrared image of imaging object is radiated on the CMOS of image capture module, the infrared picture data collected is transferred to image processing module by CMOS, through the VP mouth FIFO of TMS320DM642 dsp chip, be stored in SDRAM chip by EDMA, then TMS320DM642 dsp chip processes the image be stored in SDRAM chip, through EMAC interface after having processed, image network transport module is utilized to send to host computer, then host computer completes display and the storage of image, video acquisition module gathers new frame of video more simultaneously, carry out the process of next round, meanwhile, said process all completes under the control of software-driven modules.

Fig. 1 is infrared imaging image collection processing system block diagram, Fig. 2 is hardware system block diagram, and composition graphs 1 is divided into image capture module, image processing module, image network transport module, a few part of software-driven modules with a kind of image collection processing system of Overview of Novel Infrared Imaging Technologies described in Fig. 2; The output of image capture module is connected to the input port of image processing module by video interface, the output of image processing module is connected with the input of image network transport module, image network transport module utilizes EMAC interface to connect with host computer, and software-driven modules is then connected with between image capture module, image processing module and image network transport module by network interface.

Fig. 3 is that image capture module circuit connects block diagram, described CMOS chip be arranged through I2C bus to carry out, containing register inside it, arranged by I2C bus, these settings comprise resolution, output clock speed, color gain etc., and the maximum operating frequency of I2C bus is 400Kbps, in use using TMS320DM642 as main equipment, MT9P031, as from equipment, completes the setting to MT9P031 by TMS320DM642.

Fig. 4 is reset circuit figure, and described reset circuit selects MAX706T watchdog chip to produce reset pulse, and the supervision voltage of MAX706T is 3.08V, when starting to power, when the output voltage of MAX1951 is lower than 3.08V, the reseting pin output low level always of MAX706T, produces and resets; When the output voltage of MAX1951 is higher than 3.08V, MAX706T also will continue the reset level maintaining 200ms, and reseting pin exports and draws as high level by MAX706T afterwards.

Fig. 5 is image network transport module structured flowchart, described image network transport module comprises EMAC control module, EMAC interface module and MDIO module, described EMAC control module is TMS320DM642 dsp chip kernel and EMAC module, interface between MDIO module, described EMAC interface module meets IEEE802.3 agreement, support MII interface, there are 8 independently send and receive path, support single duplex and the full-duplex data transmission of 10Mb/100Mb, be mainly used in being connected with network devices, utilization extends out physical chip (PHY), to realize and the exchange of packet of TMS320DM642, described MDIO module adopts 802.3 specifications, utilizes dual bus, carries out monitoring and controlling to PHY (physical chip), and host software, by MDIO interface configuration physical layer parameter, monitors its working method and arranges.

Fig. 6 is the connection diagram of image network transport module, the LXT971A of system PHY (physical layer) chip selection Inter company, as ethernet transceiver, the MII interface of LXT971A is directly directly connected with the MII interface of DM642, the MII interface of DM642 does not support TXER, therefore the TXER pin of LXT971A is directly connected with ground by pull down resistor, the MII interface TD+ of LXT971A, TD-, RD+ and RD-signal is transformed into TX+ through network isolation transformer, TX-, RX+, RX-signal, receive on RJ45 connector again, network isolation transformer is mainly used in eliminating the noise jamming on outside netting twine, and carry out level conversion, ensure the accurate and reliable of transfer of data.The transmission speed of this network is 100Mbps.

The utility model person of an ordinary skill in the technical field also can understand in addition to the foregoing, can change combination further in this explanation and illustrated specific embodiment.Although the utility model gives diagram explanation with regard to its preferred embodiment, but person skilled in the art is understood that, in spirit and scope of the present utility model limited in the attached claims, also can make multiple change and variation to the utility model.

Claims (3)

1. an image collection processing system for Overview of Novel Infrared Imaging Technologies, is characterized in that comprising: image capture module, image processing module, image network transport module, software-driven modules; The output of image capture module is connected to the input port of image processing module by video interface, the output of image processing module is connected with the input of image network transport module, image network transport module utilizes EMAC interface to connect with host computer, and software-driven modules is then connected with between image capture module, image processing module and image network transport module by network interface.

2. image collection processing system as claimed in claim 1, is characterized in that, described image capture module using the MT9P031 cmos image acquisition chip of Micron company as infrared image sensor, for real-time infrared image collection; Described image collection chip carries ADC, output is 12 RAW video modes, under RAW pattern, MT9P031 provides the synchronous LINE_VALID signal that arranges to be connected with the VPxCTL0 of TMS320DM642DSP chip by internal register, there is provided line synchronizing signal to TMS320DM642DSP chip, control its working method.

3. image collection processing system as claimed in claim 1, it is characterized in that, described image processing module is used for processing the picture signal collected, and comprises power unit, reset circuit, TMS320DM642 dsp chip, SDRAM chip, FLASH memory;

Described power unit is connected with the power interface of TMS320DM642 dsp chip, for whole system provides power consumption endlessly, guarantees that on integrated circuit, each IC correctly works reliably;

Described reset circuit access TMS320DM642 dsp chip, reset threshold is 3.08V;

Described TMS320DM642 dsp chip is integrated with Ethernet foreign medium access controller and has independent media's interface, is directly connected with PHY device, realizes the Internet Transmission of view data;

Described TMS320DM642 dsp chip is also integrated with external memory interface, can realize seamless link with synchronous or asynchronous memory;

Described SDRAM chip is connected on TMS320DM642 dsp chip by EMIFA interface, for meeting the demand of system to memory space and speed.