CN204377258U - A kind of device preventing PCB inner plating contraposition layer inclined - Google Patents

A kind of device preventing PCB inner plating contraposition layer inclined Download PDF

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Publication number
CN204377258U
CN204377258U CN201520116027.7U CN201520116027U CN204377258U CN 204377258 U CN204377258 U CN 204377258U CN 201520116027 U CN201520116027 U CN 201520116027U CN 204377258 U CN204377258 U CN 204377258U
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CN
China
Prior art keywords
position alignment
contraposition
inner layer
film
layer plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520116027.7U
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Chinese (zh)
Inventor
杨建成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qingyuan City Fu Ying Electronics Co Ltd
Original Assignee
Qingyuan City Fu Ying Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qingyuan City Fu Ying Electronics Co Ltd filed Critical Qingyuan City Fu Ying Electronics Co Ltd
Priority to CN201520116027.7U priority Critical patent/CN204377258U/en
Application granted granted Critical
Publication of CN204377258U publication Critical patent/CN204377258U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of device preventing PCB inner plating contraposition layer inclined, it relates to a kind of position alignment of inner layer plates device.It comprises inner plating, position alignment of inner layer plates exposure film, PIN nail and contraposition PIN and follows closely, inner plating is arranged between upper and lower two position alignment of inner layer plates exposure film, the corner of position alignment of inner layer plates exposure film is symmetrically distributed with multiple PIN nail, and position alignment of inner layer plates exposure film is followed closely with contraposition PIN by PIN nail and coordinated.The utility model ensures the stable of internal layer film aligning, makes film Absorbable organic halogens in production control in scope, reaches lifting quality, the object reduced costs.

Description

A kind of device preventing PCB inner plating contraposition layer inclined
Technical field
The utility model relates to a kind of position alignment of inner layer plates device, be specifically related to a kind of device preventing PCB inner plating contraposition layer inclined.
Background technology
Existing position alignment of inner layer plates method, first adjacent two luxuriant and rich with fragrance water of exposure are carried out contraposition by the butterfly PAD on the film limit when it mainly comprises the steps: that internal layer is produced, fixing, and then by sandwich mode, two films are fixed, plank is placed in the middle of two films, produce with leaf type again, ill-exposed in order to prevent, exposure process needs by catching up with gas to ensure bubble-free existence between the film and plank, but catch up with gas process can cause the displacement of the film, form the interlayer off normal of internal layer, the internal layer film is caused to be shifted, based on this, design a kind of device of preventing PCB inner plating contraposition layer inclined or necessary.
Summary of the invention
For the deficiency that prior art exists, the utility model object is to provide a kind of device preventing PCB inner plating contraposition layer inclined, structure is simple, reasonable in design, ensure the stable of internal layer film aligning, make film Absorbable organic halogens in production control in scope, reach lifting quality, the object reduced costs.
To achieve these goals, the utility model realizes by the following technical solutions: a kind of device preventing PCB inner plating contraposition layer inclined, comprise inner plating, position alignment of inner layer plates exposure film, PIN nail and contraposition PIN to follow closely, inner plating is arranged between upper and lower two position alignment of inner layer plates exposure film, the corner of position alignment of inner layer plates exposure film is symmetrically distributed with multiple PIN nail, and position alignment of inner layer plates exposure film is followed closely with contraposition PIN by PIN nail and coordinated.
The beneficial effects of the utility model: partially reaching the object promoting production quality, reduce production cost, reasonable in design by controlling position alignment of inner layer plates layer, ensureing the stable of internal layer film aligning.
Accompanying drawing explanation
The utility model is described in detail below in conjunction with the drawings and specific embodiments;
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the structural representation that the utility model contraposition PIN follows closely.
Embodiment
The technological means realized for making the utility model, creation characteristic, reaching object and effect is easy to understand, below in conjunction with embodiment, setting forth the utility model further.
With reference to Fig. 1-2, this embodiment is by the following technical solutions: a kind of device preventing PCB inner plating contraposition layer inclined, comprise inner plating 1, position alignment of inner layer plates exposure film 2, PIN nail 3 and contraposition PIN nail 4, inner plating 1 is arranged between upper and lower two position alignment of inner layer plates exposure film 2, the corner of position alignment of inner layer plates exposure film 2 is provided with multiple PIN nail 3, and position alignment of inner layer plates exposure film 2 is followed closely 4 by PIN nail 3 with contraposition PIN and coordinated.
It should be noted that described PIN nail 3 is symmetrically distributed in the corner of position alignment of inner layer plates exposure film 2, each angle is provided with two PIN nail 3, ensure that the stable of contraposition.
This embodiment improves the device of multi-layer sheet position alignment of inner layer plates interlayer off normal in PCB production process, by improving the design of the internal layer film, increase film aligning fixed structure, solve catch up with gas process cause the film to be shifted problem, inner plating 1 is placed between upper and lower two position alignment of inner layer plates exposure film 2 when making by internal layer, to prevent in production process dislocation between upper and lower two position alignment of inner layer plates exposure film 2 and to form layer inclined, design PIN nail 3 in the corner of two position alignment of inner layer plates exposure film 2, follow closely with contraposition PIN the position that 4 fix two contraposition exposure film.
This embodiment is not subject to external factor impact, and the internal layer film can not be caused to be shifted, and effectively can ensure the stable of internal layer film aligning, film Absorbable organic halogens in production is made to control in scope, reach lifting quality, the object reduced costs, there is wide market application foreground.
More than show and describe general principle of the present utility model and principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; what describe in above-described embodiment and specification just illustrates principle of the present utility model; under the prerequisite not departing from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.

Claims (2)

1. the device preventing PCB inner plating contraposition layer inclined, it is characterized in that, comprise inner plating (1), position alignment of inner layer plates exposure film (2), PIN nail (3) and contraposition PIN nail (4), inner plating (1) is arranged between upper and lower two position alignment of inner layer plates exposure film (2), the corner of position alignment of inner layer plates exposure film (2) is provided with multiple PIN nail (3), and position alignment of inner layer plates exposure film (2) is followed closely (4) by PIN nail (3) with contraposition PIN and coordinated.
2. a kind of device preventing PCB inner plating contraposition layer inclined according to claim 1, it is characterized in that, described PIN nail (3) is symmetrically distributed in the corner of position alignment of inner layer plates exposure film (2), and each angle is provided with two PIN nail (3).
CN201520116027.7U 2015-02-26 2015-02-26 A kind of device preventing PCB inner plating contraposition layer inclined Expired - Fee Related CN204377258U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520116027.7U CN204377258U (en) 2015-02-26 2015-02-26 A kind of device preventing PCB inner plating contraposition layer inclined

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520116027.7U CN204377258U (en) 2015-02-26 2015-02-26 A kind of device preventing PCB inner plating contraposition layer inclined

Publications (1)

Publication Number Publication Date
CN204377258U true CN204377258U (en) 2015-06-03

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520116027.7U Expired - Fee Related CN204377258U (en) 2015-02-26 2015-02-26 A kind of device preventing PCB inner plating contraposition layer inclined

Country Status (1)

Country Link
CN (1) CN204377258U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106231805A (en) * 2016-08-15 2016-12-14 建业科技电子(惠州)有限公司 A kind of semi-automatic exposure machine does the processing technology of inner plating
CN106231808A (en) * 2016-08-15 2016-12-14 建业科技电子(惠州)有限公司 A kind of processing technology of pcb board welding resistance para-position exposure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106231805A (en) * 2016-08-15 2016-12-14 建业科技电子(惠州)有限公司 A kind of semi-automatic exposure machine does the processing technology of inner plating
CN106231808A (en) * 2016-08-15 2016-12-14 建业科技电子(惠州)有限公司 A kind of processing technology of pcb board welding resistance para-position exposure
WO2018032634A1 (en) * 2016-08-15 2018-02-22 建业科技电子(惠州)有限公司 Fabrication process using semi-automated exposure machine to fabricate inner layer panel
CN106231805B (en) * 2016-08-15 2019-01-22 建业科技电子(惠州)有限公司 A kind of semi-automatic exposure machine does the manufacture craft of inner plating

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150603

Termination date: 20210226