CN204350435U - Mobile phone PCB - Google Patents
Mobile phone PCB Download PDFInfo
- Publication number
- CN204350435U CN204350435U CN201420865769.5U CN201420865769U CN204350435U CN 204350435 U CN204350435 U CN 204350435U CN 201420865769 U CN201420865769 U CN 201420865769U CN 204350435 U CN204350435 U CN 204350435U
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- pad
- fixing hole
- layer
- described pad
- mobile phone
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Abstract
The utility model provides a kind of Mobile phone PCB, it includes: a green oil layer, one pad layer, one pad fixed bed, some pads, described pad layer is arranged on described pad fixed bed, the bottom of described pad is connected with the soldering pad connection line of described pad layer, the edge of described pad offers some fixing holes, described pad layer offers the first fixing hole matched with described fixing hole, mutually chimeric between described fixing hole with described first fixing hole, described pad fixed bed and described pad layer interfix, described green oil layer is arranged at the surface of described pad layer.The advantage that the utility model has enhancing Mobile phone PCB intensity, minimizing pad comes off from Mobile phone PCB.
Description
Technical field
The utility model relates to a kind of pcb board, particularly a kind of Mobile phone PCB.
Background technology
Device on current mobile phone is welded on Mobile phone PCB according to device description book.But in actual applications, modify according to size of devices for the pad needs realizing being connected between device with pcb board, this just likely causes between pad and Mobile phone PCB fixing not tight, and pad is easily from the problem that pcb board comes off.
Utility model content
The technical problems to be solved in the utility model is to overcome in existing pad modification process, and between pad and Mobile phone PCB, fixing loosely defect, provides a kind of Mobile phone PCB.
The utility model solves above-mentioned technical problem by following technical proposals:
A kind of Mobile phone PCB, it includes: a green oil layer, one pad layer, one pad fixed bed, some pads, described pad layer is arranged on described pad fixed bed, its feature is, the bottom of described pad is connected with the soldering pad connection line of described pad layer, the edge of described pad offers some fixing holes, described pad layer offers the first fixing hole matched with described fixing hole, mutually chimeric between described fixing hole with described first fixing hole, described pad fixed bed and described pad layer interfix, described green oil layer is arranged at the surface of described pad layer.
Preferably, described pad layer offers some pad fixing holes, and described pad fixed bed offers the second fixing hole mated with described pad fixing hole, mutually chimeric between described pad fixing hole with described second fixing hole.
Preferably, a tack coat is provided with between described pad and described pad layer.
Preferably, a tack coat is provided with between described pad fixed bed and described pad layer.
Preferably, described first fixing hole and described second fixing hole match, and described fixing hole, described first fixing hole, described second fixing hole are fitted together to mutually.
Preferably, the area of described pad layer is greater than the area of described green oil layer.
Preferably, the distance between described pad is 0.4 millimeter.
Positive progressive effect of the present utility model is: enhance the intensity of Mobile phone PCB and the firmness between pad and Mobile phone PCB, reduces the flimsy problem of pcb board caused because of pad amendment.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model one embodiment.
Description of reference numerals:
Pad: 1
Fixing hole: 11,12,13,14
Fixing hole: 101,102,103
Pad layer: 2
Pad fixing hole: 21,22,23,24
Pad fixed bed: 3
Embodiment
Lift preferred embodiment below, and come by reference to the accompanying drawings clearlyer intactly the utility model to be described.
Embodiment
Understood incorporated by reference to Fig. 1, a kind of Mobile phone PCB, it includes: green oil layer, pad layer 2, pad fixed bed 3, some pads.Pad layer 2 is arranged on pad fixed bed 3.The bottom of those pads is connected with the soldering pad connection line on pad layer 2, like this, when device is assembled on those pads time, just can realize the Signal transmissions between device and soldering pad connection line.
Understood incorporated by reference to Fig. 1, in order to be fixed on pad layer 2 by pad 1, the edge of pad 1 offers some fixing holes 11,12,13,14, pad layer 2 offers some first fixing holes matched with those fixing holes.Certainly, also fixing hole can be offered in other parts of pad 1, such as, fixing hole 101,102,103 etc.During making sheet, fixing hole 11,12,13,14 is mated to relevant first fixing hole, realize mutually being fitted and fixed with between pad 1 and pad layer 2.In order to obtain better fixed effect, between pad 1 and pad layer 2, be also provided with a tack coat.
Understood incorporated by reference to Fig. 1, in order to realize fixing between pad layer 2 and pad fixed bed 3, some pad fixing holes 21,22,23,24 can be offered on pad layer 2, offer the second fixing hole mated with pad fixing hole at pad fixed bed 3.During making sheet, pad fixing hole 21,22,23,24 can be mated with the second fixing hole, and then realize being mutually fitted and fixed with between pad layer 2 and pad fixed bed 3.In order to obtain better fixed effect, a tack coat can be provided with between pad fixed bed 3 and pad layer 2.
In order to reduce the complexity of technique, fixing hole, the first fixing hole can be opened in the position of mutually mating with the second fixing hole.In fact, the first fixing hole now on the fixing hole of pad, pad layer, the second fixing hole on pad fixed bed overlap each other, are mutually fitted together to, first fixing hole serves the effect simultaneously connecting pad and pad fixed bed, not be used in the pad fixing hole of the first fixing hole and connection pad fixed bed pad layer offered respectively for connecting pad.During making sheet, only need fixing hole, the first fixing hole (pad fixing hole), the second fixing hole overlapped chimeric, just can realize being fitted and fixed with between pad, pad layer, pad fixed bed.Green oil layer is arranged at pad layer surface, but does not cover pad, otherwise, affect the connection between pad and device.The area of pad layer is greater than the area of green oil layer, and the spacing between pad is 0.4 millimeter.
Although the foregoing describe embodiment of the present utility model, it will be understood by those of skill in the art that these only illustrate, protection range of the present utility model is defined by the appended claims.Those skilled in the art, under the prerequisite not deviating from principle of the present utility model and essence, can make various changes or modifications to these execution modes, but these change and amendment all falls into protection range of the present utility model.
Claims (7)
1. a Mobile phone PCB, it includes: a green oil layer, one pad layer, one pad fixed bed, some pads, described pad layer is arranged on described pad fixed bed, it is characterized in that, the bottom of described pad is connected with the soldering pad connection line of described pad layer, the edge of described pad offers some fixing holes, described pad layer offers the first fixing hole matched with described fixing hole, mutually chimeric between described fixing hole with described first fixing hole, described pad fixed bed and described pad layer interfix, described green oil layer is arranged at the surface of described pad layer.
2. Mobile phone PCB as claimed in claim 1, it is characterized in that, described pad layer offers some pad fixing holes, and described pad fixed bed offers the second fixing hole mated with described pad fixing hole, mutually chimeric between described pad fixing hole with described second fixing hole.
3. Mobile phone PCB as claimed in claim 1, is characterized in that, be provided with a tack coat between described pad and described pad layer.
4. Mobile phone PCB as claimed in claim 1, is characterized in that, be provided with a tack coat between described pad fixed bed and described pad layer.
5. Mobile phone PCB as claimed in claim 2, it is characterized in that, described first fixing hole and described second fixing hole match, and described fixing hole, described first fixing hole, described second fixing hole are fitted together to mutually.
6. Mobile phone PCB as claimed in claim 5, it is characterized in that, the area of described pad layer is greater than the area of described green oil layer.
7. Mobile phone PCB as claimed in claim 1, it is characterized in that, the distance between described pad is 0.4 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420865769.5U CN204350435U (en) | 2014-12-31 | 2014-12-31 | Mobile phone PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420865769.5U CN204350435U (en) | 2014-12-31 | 2014-12-31 | Mobile phone PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204350435U true CN204350435U (en) | 2015-05-20 |
Family
ID=53233672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420865769.5U Active CN204350435U (en) | 2014-12-31 | 2014-12-31 | Mobile phone PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204350435U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110471219A (en) * | 2019-07-31 | 2019-11-19 | 厦门天马微电子有限公司 | LED substrate and display device |
-
2014
- 2014-12-31 CN CN201420865769.5U patent/CN204350435U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110471219A (en) * | 2019-07-31 | 2019-11-19 | 厦门天马微电子有限公司 | LED substrate and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |