CN204342877U - A kind of device for electroless plating - Google Patents
A kind of device for electroless plating Download PDFInfo
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- CN204342877U CN204342877U CN201420732952.8U CN201420732952U CN204342877U CN 204342877 U CN204342877 U CN 204342877U CN 201420732952 U CN201420732952 U CN 201420732952U CN 204342877 U CN204342877 U CN 204342877U
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- heating tank
- coating bath
- communicated
- pump
- upflow tube
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Abstract
The utility model discloses a kind of device for electroless plating, comprise coating bath, the below of coating bath is provided with heating tank, in heating tank, is provided with well heater, in the bottom of heating tank, the below of well heater is provided with water cooler, and the side of heating tank is provided with pump.The inlet pipeline of pump is communicated with the bottom of heating tank, the inlet communication of pump outlet pipeline and strainer, and the outlet conduit of strainer is communicated with the top of heating tank with the bottom of coating bath respectively.One end of upflow tube is communicated with the top of coating bath 1, and the other end of upflow tube flows into heating tank.The below of described coating bath is provided with upflow tube, and one end of upflow tube is communicated with the top of coating bath 1, and the other end flows into heating tank.The utility model structure is simple, easy to operate, and plating solution heating separates with plating to be carried out, and in coating bath, bath temperature is easy to regulate and uniformity of temperature profile, improves the quality of coating.
Description
Technical field
The utility model belongs to a kind of chemical plating device, is specifically related to a kind of device for electroless plating.
Background technology
The specially shaped copper tube part used in some production field, its profile is falciform, and shank is straight section pipe, and interlude is the varying cross-section duct formed along outer contour circular arc, and head is tapered cut, thin-walled straight tube, the round and smooth connection in internal passages.This workpiece shapes is special, and during electroless plating, requirement on machining accuracy is strict, and the well heater of prior art chemical plating appts is in coating bath, without cooling system, use the layer metal deposition of later stage bottom land to get more and more, the particle suspended in solution also gets more and more, and easily causes workpiece head to produce dross.The metal level of cell wall deposition and the rear solution of work can not be lowered the temperature in time and all can be caused the consumption of solution starting materials, therefore cannot realize making full use of of solution.In addition, because well heater is in coating bath, makes the temperature of plating solution in coating bath inconsistent, cause uneven coating even.
Summary of the invention
The utility model proposes for solving prior art Problems existing, its objective is and provides a kind of device for electroless plating.
The technical solution of the utility model is: a kind of device for electroless plating, comprise coating bath, the below of described coating bath is provided with heating tank, in heating tank, is provided with well heater, in the bottom of heating tank, the below of well heater is provided with water cooler, and the side of heating tank is provided with pump.The inlet pipeline of pump is communicated with the bottom of heating tank, the inlet communication of pump outlet pipeline and strainer, and the outlet conduit of strainer is communicated with the top of heating tank with the bottom of coating bath respectively.One end of upflow tube is communicated with the top of coating bath 1, and the other end of upflow tube flows into heating tank.
The below of described coating bath is provided with upflow tube, and one end of upflow tube is communicated with the top of coating bath, and the other end flows into heating tank.
Described well heater and water cooler are the heat exchanger of tubulation or serpentine tube form.
The utility model structure is simple, easy to operate, and plating solution heating separates with plating to be carried out, and in coating bath, bath temperature is easy to regulate and uniformity of temperature profile, improves the quality of coating.
Accompanying drawing explanation
Fig. 1 is the stereographic map of the utility model chemical plating appts.
Wherein:
1 coating bath 2 heating tank
3 well heater 4 water coolers
5 pump 6 strainers
7 upflow tube 8 pipelines
9 valves.
Embodiment
Below, with accompanying drawing, a kind of device for electroless plating of the utility model is described in detail in conjunction with the embodiments:
As shown in Figure 1, a kind of device for electroless plating, comprises coating bath 1, and the below of coating bath 1 is provided with heating tank 2, is provided with well heater 3 in heating tank 2, and in the bottom of heating tank 2, the below of well heater 3 is provided with water cooler 4.
The side of heating tank 2 is provided with pump 5, and the inlet pipeline 8 of pump 5 is communicated with the bottom of heating tank 2, the outlet conduit 8 of pump 5 and the inlet communication of strainer 6, and the outlet conduit 8 of strainer 6 is communicated with the top of heating tank 2 with the bottom of coating bath 1 respectively.One end of upflow tube 7 is communicated with the top of coating bath 1, and the other end of upflow tube 7 flows into heating tank 2.
One end of pipeline 8 is communicated with the bottom of coating bath 1, and the other end of pipeline 8 is communicated with upflow tube 7.(pump discharge)
Well heater 3 and water cooler 4 are the heat exchanger of tubulation or serpentine tube form.
The effect of well heater 3 is heating plating solutions, makes the plating solution be fed in coating bath 1 reach the temperature being suitable for plating technic.The effect of water cooler 4 is that the bath temperature after making work reduces rapidly, improves the utilization ratio of plating solution.
The utility model structure is simple, easy to operate, and plating solution heating separates with plating to be carried out, and in coating bath, bath temperature is easy to regulate and uniformity of temperature profile, improves the quality of coating.
Claims (3)
1. the device for electroless plating, comprise coating bath (1), it is characterized in that: the below of described coating bath (1) is provided with heating tank (2), well heater (3) is provided with in heating tank (2), in the bottom of heating tank (2), the below of well heater (3) is provided with water cooler (4), the side of heating tank (2) is provided with pump (5), the inlet pipeline (8) of pump (5) is communicated with the bottom of heating tank (2), the outlet conduit (8) of pump (5) and the inlet communication of strainer (6), the outlet conduit (8) of strainer (6) is communicated with the top of heating tank (2) with the bottom of coating bath (1) respectively.
2. a kind of device for electroless plating according to claim 1, is characterized in that: the top of described coating bath (1) is provided with upflow tube (7), and one end of upflow tube (7) is communicated with the top of coating bath (1), and the other end flows into heating tank (2).
3. a kind of device for electroless plating according to claim 1, is characterized in that: the heat exchanger that described well heater (3) and water cooler (4) are tubulation or serpentine tube form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420732952.8U CN204342877U (en) | 2014-12-01 | 2014-12-01 | A kind of device for electroless plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420732952.8U CN204342877U (en) | 2014-12-01 | 2014-12-01 | A kind of device for electroless plating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204342877U true CN204342877U (en) | 2015-05-20 |
Family
ID=53226161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420732952.8U Active CN204342877U (en) | 2014-12-01 | 2014-12-01 | A kind of device for electroless plating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204342877U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104357811A (en) * | 2014-12-01 | 2015-02-18 | 中核(天津)科技发展有限公司 | Device for chemical plating |
-
2014
- 2014-12-01 CN CN201420732952.8U patent/CN204342877U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104357811A (en) * | 2014-12-01 | 2015-02-18 | 中核(天津)科技发展有限公司 | Device for chemical plating |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |