CN204340294U - A kind of three layers of compound thermal shrink-down material pipe with fin shape - Google Patents
A kind of three layers of compound thermal shrink-down material pipe with fin shape Download PDFInfo
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- CN204340294U CN204340294U CN201420798247.8U CN201420798247U CN204340294U CN 204340294 U CN204340294 U CN 204340294U CN 201420798247 U CN201420798247 U CN 201420798247U CN 204340294 U CN204340294 U CN 204340294U
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- material pipe
- striped
- layers
- fin shape
- compound thermal
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Abstract
The utility model discloses a kind of three layers of compound thermal shrink-down material pipe with fin shape, comprise outer field semiconductive layer, the insulating barrier in intermediate layer, the rubber insulation of nexine, described semiconductive layer is provided with the striped of outwardly convex.Feature of the present utility model is: by arranging fin striped at heat-shrinkage material pipe, can restore significant effective can demonstrate roasting position and not roasting position by the disappearance of fin striped in bake process, and effectively control shrinkage degree, baking is made to have more Objective, and heat-shrinkage material pipe cooling velocity is fast, sizing is stable, production efficiency is high, the bright and clean good hand touch of tube-surface.
Description
Technical field
The utility model relates to a kind of three layers of compound thermal shrink-down material pipe with fin shape.
Background technology
Three layers of compound thermal shrink-down material pipe are the applied thickness restrictions solving existing double-layer composite pipe, be applied to midium voltage cable to connect, usually in using at the scene, substantially be rely on personal experience to determine baking time and range estimation shrinkage degree, because operant level differs, have a strong impact on material contracting with heat uniformity in use, material contracting with heat can be caused to shrink and not exclusively namely toast not in place or overbaking, cause the damage of material contracting with heat.
Utility model content
The purpose of this utility model is to overcome above-mentioned not enough problem, provides a kind of three layers of compound thermal shrink-down material pipe with fin shape.
The technical scheme that the utility model is adopted for achieving the above object is a kind of three layers of compound thermal shrink-down material pipe with fin shape, comprise outer field semiconductive layer, the insulating barrier in intermediate layer, the rubber insulation of nexine, described semiconductive layer is provided with the striped of outwardly convex.
Described semiconductive layer is provided with the striped of the fin shape of outwardly convex vertically.
Described width of fringe is at 9-16mm.
Described striped height of projection is at 0.4-0.5mm.
Described semiconductive layer even circumferential is distributed with striped described in 6-8 bar.
Described semiconductive layer, insulating barrier, rubber insulation three coextrusion mold.
Feature of the present utility model is: by arranging fin striped at heat-shrinkage material pipe, can restore significant effective can demonstrate roasting position and not roasting position by the disappearance of fin striped in bake process, and effectively control shrinkage degree, baking is made to have more Objective, and heat-shrinkage material pipe cooling velocity is fast, sizing is stable, production efficiency is high, the bright and clean good hand touch of tube-surface.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is cross sectional view of the present utility model.
Wherein: 1, semiconductive layer 2, insulating barrier 3, rubber insulation 4, striped.
Detailed description of the invention
As shown in Figure 1, the utility model comprises outer field semiconductive layer 1, the insulating barrier 2 in intermediate layer, the rubber insulation 3 of nexine, three-layer co-extruded shaping, in expansion type-approval process, rely on the special shape of dilatation mold, obtain three layers of compound thermal shrink-down material pipe that there is fin shape striped on surface, namely form the striped 4 of the fin shape of outwardly convex at described semiconductive layer 1 vertically.
According to three layers of compound thermal shrink-down material tube-surface circumference convex-concave length ratio, preferred described semiconductive layer 1 even circumferential is distributed with striped 4 described in 6-8 bar, described striped 4 width is at 9-16mm, and according to test of many times, described striped 4 height of projection at 0.4-0.5mm, preferred 0.4mm and 0.5 two kind of specification.
The above; be only the utility model preferably detailed description of the invention; but protection domain of the present utility model is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the present invention discloses; be equal to according to the technical solution of the utility model and inventive concept thereof and replace or change, all should be encompassed within protection domain of the present utility model.
Claims (6)
1. with three layers of compound thermal shrink-down material pipe of fin shape, it is characterized in that: comprise outer field semiconductive layer (1), the insulating barrier (2) in intermediate layer, the rubber insulation (3) of nexine, described semiconductive layer (1) is provided with the striped (4) of outwardly convex.
2., as claimed in claim 1 with three layers of compound thermal shrink-down material pipe of fin shape, it is characterized in that: described semiconductive layer (1) is provided with the striped (4) of the fin shape of outwardly convex vertically.
3., as claimed in claim 2 with three layers of compound thermal shrink-down material pipe of fin shape, it is characterized in that: described striped (4) width is at 9-16mm.
4., as claimed in claim 2 with three layers of compound thermal shrink-down material pipe of fin shape, it is characterized in that: described striped (4) height of projection is at 0.4-0.5mm.
5., as claimed in claim 2 with three layers of compound thermal shrink-down material pipe of fin shape, it is characterized in that: described semiconductive layer (1) even circumferential is distributed with striped (4) described in 6-8 bar.
6. the three layers of compound thermal shrink-down material pipe with fin shape as described in claim as arbitrary in claim 1-5, is characterized in that: described semiconductive layer (1), insulating barrier (2), rubber insulation (3) three's coextrusion mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420798247.8U CN204340294U (en) | 2014-12-17 | 2014-12-17 | A kind of three layers of compound thermal shrink-down material pipe with fin shape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420798247.8U CN204340294U (en) | 2014-12-17 | 2014-12-17 | A kind of three layers of compound thermal shrink-down material pipe with fin shape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204340294U true CN204340294U (en) | 2015-05-20 |
Family
ID=53223591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420798247.8U Active CN204340294U (en) | 2014-12-17 | 2014-12-17 | A kind of three layers of compound thermal shrink-down material pipe with fin shape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204340294U (en) |
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2014
- 2014-12-17 CN CN201420798247.8U patent/CN204340294U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |