CN204321471U - A kind of PIN-FET photodetector is produced and is used gold wire bonding fixture - Google Patents
A kind of PIN-FET photodetector is produced and is used gold wire bonding fixture Download PDFInfo
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- CN204321471U CN204321471U CN201420713197.9U CN201420713197U CN204321471U CN 204321471 U CN204321471 U CN 204321471U CN 201420713197 U CN201420713197 U CN 201420713197U CN 204321471 U CN204321471 U CN 204321471U
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Abstract
The utility model relates to a kind of PIN-FET photodetector production gold wire bonding fixture, comprise a base, base offers the matching slot placing PIN-FET photodetector semi-finished product module, one end of this matching slot is open notch, the other end is closed notch, be connected with slide block at open notch place, slide block coordinates with closed notch and clamps PIN-FET photodetector semi-finished product module.Matching slot offers hold that signal in PIN-FET photodetector semi-finished product module draws pin draw pin through hole.Compared with prior art, the utility model structure is simple, easy to use, can PIN-FET photodetector semi-finished product module be loaded on this fixture, prevent from producing displacement in bonding process, and adopt metal material, facilitate platform temperature to conduct, be convenient to bonding operation, and the PIN-FET photodetector semi-finished product module adopting the mode of slider grip can adapt to Multiple Type carries out bonding operation.
Description
Technical field
The utility model relates to PIN-FET field of photodetectors, especially relates to a kind of PIN-FET photodetector production gold wire bonding fixture.
Background technology
In PIN-FET field of photodetectors, the producer of current domestic production only has a few family, technology relative closure, and each producer of production technology is all not quite similar.In PIN-FET photodetector production process, connect the AU999 spun gold that all have employed φ 25 μm between each device of thick film circuit board and carry out bonder ball bonding crimping, but ball bonding crimping all needs to be fixed on the heating platform of bonder by PIN-FET photodetector by fixture.
Utility model content
The purpose of this utility model be exactly in order to overcome above-mentioned prior art exist defect and a kind of PIN-FET photodetector production gold wire bonding fixture is provided.
The purpose of this utility model can be achieved through the following technical solutions:
A kind of PIN-FET photodetector is produced and is used gold wire bonding fixture, comprise a base, base offers the matching slot placing PIN-FET photodetector semi-finished product module, one end of this matching slot is open notch, the other end is closed notch, be connected with slide block at open notch place, slide block coordinates with closed notch and clamps PIN-FET photodetector semi-finished product module.
Described open notch place offers track type screw through-hole, and described slide block is connected on base by screw, and described screw stretches in screw through-hole.
Distance between described slide block and closed notch is regulated by the position of adjusting slider on matching slot, so just can the identical but PIN-FET photodetector semi-finished product module of the Multiple Type that length is different of loading width.
Described matching slot offers hold that signal in PIN-FET photodetector semi-finished product module draws pin draw pin through hole.The signal that this structure can be avoided in PIN-FET photodetector semi-finished product module draws pin, makes being installed in matching slot of the PIN-FET photodetector semi-finished product seamless coupling of module.
The described pin through hole that draws is provided with two altogether, be arranged in parallel along matching slot length direction.
The described pin through hole that draws is up/down perforation structure, and its cross section is track type.
The degree of depth of described matching slot is 2/5 ~ 3/5 of PIN-FET photodetector semi-finished product module height, taking-up module after shortest key closing operation completes.The shape of described matching slot and PIN-FET photodetector semi-finished product module form fit.
Described base is made up of metal material, is convenient to heat transfer.
When fixture of the present utility model uses, be placed on gold wire bonding machine platform, effect is the PIN-FET photodetector semi-finished product module of fixing different model size, and platform heating-up temperature is conducted to PIN-FET photodetector semi-finished product module, to carry out subsequent job by base.On matching slot, open notch is arranged in one end simultaneously, is regulated fixing by slide block, convenient PIN-FET photodetector semi-finished product module of installing fixing different model size.
Compared with prior art, the utility model structure is simple, easy to use, can PIN-FET photodetector semi-finished product module be loaded on this fixture, prevent from producing displacement in bonding process, and adopt metal material, facilitate platform temperature to conduct, be convenient to bonding operation, and the PIN-FET photodetector semi-finished product module adopting the mode of slider grip can adapt to Multiple Type carries out bonding operation.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Main TV structure schematic diagram when Fig. 2 is the utility model clamping PIN-FET photodetector semi-finished product module;
Fig. 3 be the utility model clamping PIN-FET photodetector semi-finished product module time look up structural representation.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail.
Embodiment
A kind of PIN-FET photodetector is produced and is used gold wire bonding fixture, and as shown in FIG. 1 to 3, comprise a base 1, base 1 is made up of metal material, is convenient to heat transfer.Base 1 offers the matching slot 2 placing PIN-FET photodetector semi-finished product module 6, the degree of depth of matching slot 2 is 2/5 ~ 3/5 (in the present embodiment, the degree of depth of selected matching slot 2 is the half of PIN-FET photodetector semi-finished product module 6 height) of PIN-FET photodetector semi-finished product module 6 height, taking-up module after shortest key closing operation completes.The shape of matching slot 2 and PIN-FET photodetector semi-finished product module 6 form fit.One end of this matching slot 2 is open notch, and the other end is closed notch, and open notch place offers track type screw through-hole 4, and slide block 3 is connected on base 1 by screw 5, and screw 5 stretches in screw through-hole 4.Slide block 3 coordinates with closed notch and clamps PIN-FET photodetector semi-finished product module 6.Distance between slide block 3 and closed notch is regulated by the position of adjusting slider 3 on matching slot 2, so just can the identical but PIN-FET photodetector semi-finished product module 6 of the Multiple Type that length is different of loading width.Matching slot 2 offers hold that signal in PIN-FET photodetector semi-finished product module 6 draws pin 7 draw pin through hole 8.The signal that this structure can be avoided in PIN-FET photodetector semi-finished product module 6 draws pin 7, makes being installed in matching slot 2 of the PIN-FET photodetector semi-finished product seamless coupling of module 6.Draw pin through hole 8 and be provided with two altogether, be arranged in parallel along matching slot 2 length direction.Draw pin through hole 8 for up/down perforation structure, and its cross section is track type.
When fixture uses, be placed on gold wire bonding machine platform, effect is the PIN-FET photodetector semi-finished product module of fixing different model size, and platform heating-up temperature is conducted to PIN-FET photodetector semi-finished product module, to carry out subsequent job by base 1.On matching slot, open notch is arranged in one end simultaneously, is regulated fixing by slide block, convenient PIN-FET photodetector semi-finished product module of installing fixing different model size.
Above-mentioned is can understand for ease of those skilled in the art and use utility model to the description of embodiment.Person skilled in the art obviously easily can make various amendment to these embodiments, and General Principle described herein is applied in other embodiments and need not through performing creative labour.Therefore, the utility model is not limited to above-described embodiment, and those skilled in the art, according to announcement of the present utility model, do not depart from improvement that the utility model category makes and amendment all should within protection domain of the present utility model.
Claims (8)
1. a PIN-FET photodetector is produced and is used gold wire bonding fixture, it is characterized in that, comprise a base (1), base (1) offers the matching slot (2) placing PIN-FET photodetector semi-finished product module (6), one end of this matching slot (2) is open notch, the other end is closed notch, be connected with slide block (3) at open notch place, slide block (3) coordinates with closed notch and clamps PIN-FET photodetector semi-finished product module (6).
2. a kind of PIN-FET photodetector production gold wire bonding fixture according to claim 1, it is characterized in that, described open notch place offers track type screw through-hole (4), described slide block (3) is connected on base (I) by screw (5), and described screw (5) stretches in screw through-hole (4).
3. a kind of PIN-FET photodetector production gold wire bonding fixture according to claim 2, it is characterized in that, the distance between described slide block (3) and closed notch is regulated by the position of adjusting slider (3) on matching slot (2).
4. a kind of PIN-FET photodetector production gold wire bonding fixture according to claim 1, it is characterized in that, described matching slot (2) offers hold that the upper signal of PIN-FET photodetector semi-finished product module (6) draws pin (7) draw pin through hole (8).
5. a kind of PIN-FET photodetector production gold wire bonding fixture according to claim 4, it is characterized in that, the described pin through hole (8) that draws is provided with two altogether, be arranged in parallel along matching slot (2) length direction.
6. a kind of PIN-FET photodetector production gold wire bonding fixture according to claim 4, it is characterized in that, described draws pin through hole (8) for up/down perforation structure, and its cross section is track type.
7. a kind of PIN-FET photodetector production gold wire bonding fixture according to claim 1, is characterized in that, the degree of depth of described matching slot (2) is 2/5 ~ 3/5 of PIN-FET photodetector semi-finished product module (6) height.
8. a kind of PIN-FET photodetector production gold wire bonding fixture according to claim 1, it is characterized in that, described base (1) is made up of metal material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201420713197.9U CN204321471U (en) | 2014-11-24 | 2014-11-24 | A kind of PIN-FET photodetector is produced and is used gold wire bonding fixture |
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CN201420713197.9U CN204321471U (en) | 2014-11-24 | 2014-11-24 | A kind of PIN-FET photodetector is produced and is used gold wire bonding fixture |
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CN204321471U true CN204321471U (en) | 2015-05-13 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111015054A (en) * | 2019-12-23 | 2020-04-17 | 中国电子科技集团公司第四十四研究所 | Anti-tilting device for gold wire pressure welding fixing clamp in micro-assembly process |
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2014
- 2014-11-24 CN CN201420713197.9U patent/CN204321471U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111015054A (en) * | 2019-12-23 | 2020-04-17 | 中国电子科技集团公司第四十四研究所 | Anti-tilting device for gold wire pressure welding fixing clamp in micro-assembly process |
CN111015054B (en) * | 2019-12-23 | 2021-07-06 | 中国电子科技集团公司第四十四研究所 | Anti-tilting device for gold wire pressure welding fixing clamp in micro-assembly process |
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Address after: 200436 No. 555 West Road, Zhabei District, Shanghai Patentee after: Shanghai Aoshi Control Technology Co., Ltd Address before: 200436 No. 555 West Road, Zhabei District, Shanghai Patentee before: SHANGHAI HENGTONG PHOTOELECTRIC TECHNOLOGY Co.,Ltd. |