CN204314501U - A kind of planar optical waveguide splitter chip and system of processing - Google Patents
A kind of planar optical waveguide splitter chip and system of processing Download PDFInfo
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- CN204314501U CN204314501U CN201420652145.5U CN201420652145U CN204314501U CN 204314501 U CN204314501 U CN 204314501U CN 201420652145 U CN201420652145 U CN 201420652145U CN 204314501 U CN204314501 U CN 204314501U
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Abstract
The utility model discloses a kind of planar optical waveguide splitter chip, comprise a sandwich layer, described sandwich layer is rearranged by several optical waveguides; One top covering, described top covering is arranged on sandwich layer upper surface; One under-clad layer, described under-clad layer is arranged on sandwich layer lower surface; This chip also comprises the glass cover-plate be bonded together with under-clad layer; For a system of processing for processing plane optical waveguide splitter chip, this system of processing comprises pastes solidification equipment, cutter sweep, lapping device, cleaning device and proving installation.The utility model return loss is high, signal transmission efficiency is high, light splitting is even, system of processing is simple, process consuming time short, production efficiency is high.
Description
Technical field
The utility model relates to optical branching device technical field, is related specifically to a kind of about PLC optical branching-device chip and system of processing.
Background technology
Due to large-scale FTTH network design, and China's Conventional wide band mainly to adopt with ADSL be the copper cash broadband technology of representative, be difficult to meet the wideband requirements that user increases day by day.PLC optical branching-device chip is because its Channel depletion is even, size is little, be easy to integrated, be convenient to the advantages such as batch production, simultaneously by the continuous upgrading of FTTH core technology PON, PLC optical branching-device chip can easily provide 1G, 2.5G even to count the bandwidth of 10G on the node of optical access network, the access rate also corresponding quick raising of each user, is best suited for for jumbo PON Primary Component.
The demand of current PLC optical branching-device chip is large, but along with increasing of processing quantity, and machining precision worse and worse, and its return loss is low, signal transmission efficiency is low, the shortcomings such as light splitting is uneven, also there is shortcomings at processing plane optical waveguide splitter chip in another, such as, system of processing is comparatively complicated, it is consuming time longer to process, and then causes production efficiency to reduce, thus delays the cycle of launch products.
But for the deficiencies in the prior art, developer is necessary to develop that a kind of return loss is high, signal transmission efficiency is high, the uniform planar optical waveguide splitter chip of light splitting and a kind of system of processing simple, process short, the system of processing for planar optical waveguide splitter chip that production efficiency is high consuming time.
Utility model content
For solving prior art Problems existing, the utility model object provides that a kind of return loss is high, signal transmission efficiency is high, the uniform planar optical waveguide splitter chip of light splitting and a kind of system of processing simple, process short, the system of processing for planar optical waveguide splitter chip that production efficiency is high consuming time.
For solving above technical matters, the utility model comes to be realize by the following technical solutions: a kind of planar optical waveguide splitter chip, comprises
One sandwich layer, described sandwich layer is rearranged by several optical waveguides;
One top covering, described top covering is arranged on sandwich layer upper surface;
One under-clad layer, described under-clad layer is arranged on sandwich layer lower surface;
It is characterized in that, this chip also comprises the glass cover-plate be bonded together with under-clad layer.
In a preferred embodiment of the present utility model, described sandwich layer is by the larger pure SiO of refractive index
2material is formed.
In a preferred embodiment of the present utility model, described glass cover-plate and under-clad layer use that UV is gluing to be connected together.
For a system of processing for processing plane optical waveguide splitter chip, comprise cutter sweep, lapping device, cleaning device, proving installation and stickup solidification equipment;
This system of processing is once processed chip according to the processing sequence of pasting solidification equipment, cutter sweep, lapping device, cleaning device and proving installation;
Described stickup solidification equipment comprises bottom fixed head, support, upper strata stripper plate and micrometer caliper;
Described upper strata stripper plate is arranged on above bottom fixed head, support column is provided with between described upper strata stripper plate and bottom fixed head, described support column is evenly arranged on bottom fixed head along bottom fixed head circumferencial direction, described support is evenly provided with on bottom fixed head along bottom fixed head circumferencial direction, and through upper strata stripper plate, described support and support column arranged in a crossed manner on bottom fixed head;
Described micrometer caliper is arranged on the stripper plate of upper strata, and corresponding with the support column be arranged between upper strata stripper plate and bottom fixed head;
Wafer cover plate pickup groove is offered in described bottom fixed head upper surface center.
In a preferred embodiment of the present utility model, described cleaning device comprises cleaning clamping apparatus disk and cleaning fixture shadoof;
Described cleaning clamping apparatus disk comprises a disc, and the upper surface of described disc arranges some chip placing grooves, and described disc center is provided with center round platform, and the center of this center round platform is equipped with endoporus;
Described cleaning fixture shadoof comprises a body of rod and arranges the limited block of body of rod one end, and the endoporus that the described body of rod wears with the upper heart position of center round platform matches.
In a preferred embodiment of the present utility model, described proving installation comprises base plate and is arranged on the three-dimensional reflective mirror coalignment of base plate both sides and four-dimensional LED light source adjusting gear;
Described three-dimensional reflective mirror coalignment upper end is provided with article carrying platform, is provided with LED light source, and is provided with guide rail slideway in this device side, be provided with giant-screen data form in described guide rail slideway one end in described four-dimensional LED light source adjusting gear upper end.
The beneficial effects of the utility model are; Compared with prior art, the utility model chip comprises by the larger pure SiO of refractive index
2the sandwich layer that material is formed, be provided with top covering at the upper surface of sandwich layer, lower surface is provided with under-clad layer, and top covering and under-clad layer are by SiO
2, P, N, As by the refractive index that vapour deposition process is formed be slightly less than core refractive rate potpourri form, and on under-clad layer, there is a glass cover-plate with UV glue bond, glass cover-plate can increase coupling area and whole device be played to the effect of protection, and select UV glue to be bonded on under-clad layer, the stability of glass cover-plate on under-clad layer can be improved further, the one-piece construction of chip improves return loss and signal transmission efficiency, makes light splitting comparatively even;
Another is for the system of processing of processing plane optical waveguide splitter chip, comprise stickup solidification equipment, cutter sweep, lapping device, cleaning device and proving installation, the integration of stickup solidification equipment, UV solidification can be carried out to the wafer after bonding simultaneously, high-temperature baking and TC circulation, thus avoid chip manufacture system the larger shortcoming that takes up space, thus also enable operator more simply operate, thus reduce the labour intensity of operator, another is also provided with micrometer caliper on the apparatus, and then when the instillation of UV glue is more, micrometer caliper can be utilized to regulate, thus unnecessary UV glue is extruded under the extruding of bottom fixed head and upper strata stripper plate, thus improve chip production complete after quality, also improve the production efficiency of whole system of processing simultaneously, thus shorten the cycle of launch products.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of optical waveguide splitter chip.
Fig. 2 is the left view of Fig. 1.
Fig. 3 is optical waveguide splitter chip system of processing schematic diagram.
Fig. 4 is for pasting solidification equipment schematic diagram.
Fig. 5 is the structural representation of cleaning device cleaning clamping apparatus disk;
Fig. 6 is the structural representation of cleaning device cleaning fixture shadoof.
Fig. 7 is proving installation schematic diagram.
Numeral and the corresponding component title represented by letter in figure:
1. top covering 2. sandwich layer 3. under-clad layer 4. glass cover-plate 5. glistening light of waves is led 6. bottom fixed head 7. support column 8. wafer cover plate pickup groove 9. support 10. upper strata stripper plates 11. and is rotated mircrometer gauge 12. and clean clamping apparatus disk 13. and clean fixture shadoof 14. base plate 15. giant-screen data form 16. guide rail slideway 17. four-dimensional LED light source adjusting gear 18.LED light source 19. article carrying platform 20. three-dimensional reflective mirror coalignment 21. regulating platform 121. disc 122. chip placing groove 125. endoporus 126. center round platform 131. body of rod 132. limited block
Embodiment
The technological means realized to make the utility model, creation characteristic, reaching object and effect is easy to understand, below in conjunction with concrete diagram, setting forth the utility model further.
Shown in Fig. 1-Fig. 2, the utility model is a kind of planar optical waveguide splitter chip, comprises
One sandwich layer 2, sandwich layer 2 is rearranged by several optical waveguides 5, but sandwich layer 2 is by the larger pure SiO of refractive index
2material is formed.
Be provided with top covering 1 at the upper surface 1 of sandwich layer 2, lower surface is provided with under-clad layer 3, and top covering 1 and under-clad layer 3 are by SiO
2, P, N, As by the refractive index that vapour deposition process is formed be slightly less than sandwich layer 2 refractive index potpourri form, top covering 1 and under-clad layer 3 can ensure the total reflection of light in sandwich layer 2, and then fully ensure that the low Polarization Dependent Loss that light transmits in sandwich layer 2.
But this chip also comprises the gluing glass cover-plate 4 be connected on under-clad layer 3 of use UV, glass cover-plate 4 can increase coupling area and whole device be played to the effect of protection.
With reference to shown in Fig. 3, a kind of system of processing for processing plane optical waveguide splitter chip, comprises cutter sweep, lapping device, cleaning device, proving installation and stickup solidification equipment;
This system of processing is once processed chip according to the processing sequence of pasting solidification equipment, cutter sweep, lapping device, cleaning device and proving installation;
With reference to shown in Fig. 4, paste solidification equipment in the present embodiment and comprise bottom fixed head 6, support 9, upper strata stripper plate 10 and micrometer caliper 11;
The present embodiment at the middle and upper levels stripper plate 10 is arranged on above bottom fixed head 6, support column 7 is provided with between upper strata stripper plate 10 and bottom fixed head 6, support column 7 is evenly arranged on bottom fixed head 6 along bottom fixed head 6 circumferencial direction, support 9 is evenly provided with on bottom fixed head 6 along bottom fixed head 6 circumferencial direction, and through upper strata stripper plate 10, support 9 can be used as upper strata stripper plate 10 when mobile to guide pillar.
And support 9 is arranged in a crossed manner on bottom fixed head 6 with support column 7, and be provided with screw thread at support 9 outside surface, thus avoid upper strata stripper plate 10 to shake when micrometer caliper 11 regulates, thus improve the stability pasting stationary installation entirety;
In the present embodiment, micrometer caliper 11 is arranged on upper strata stripper plate 10, and then can the infusion volume of effective control UV glue, thus further increase the quality that chip machining, and corresponding with the support column 7 be arranged between upper strata stripper plate 10 and bottom fixed head 6;
Wafer cover plate pickup groove 8 is offered in bottom fixed head 6 upper surface center.
With reference to shown in Fig. 5, cleaning clamping apparatus disk 12 comprises a disc 121, and this disc 121 is the chip that the main body of whole fixture is cleaned for settling band, and its large I is determined according to the actual requirements.
In order to can disposable loading a greater number chip and the cleaning of different model PLC optical branching-device chip can be met, the upper surface of this disc 121 is arranged some chip placing grooves 122, this chip placing groove 122 is specially square groove, and its width can meet different model PLC optical branching-device chip.Simultaneously the center of disc 121 is provided with center round platform 126, the center of this center round platform 126 wears endoporus 125, like this by center round platform 126 with clean fixture shadoof 13 and coordinated cleaning operation to chip.
With reference to shown in Fig. 6, cleaning fixture shadoof 13 mainly comprises a body of rod 131 and arranges the limited block 132 of body of rod one end, and this body of rod 131 matches with the endoporus 125 on center round platform 126 on cleaning clamping apparatus disk 12; Limited block 132 also coordinates with this endoporus 125 simultaneously, and cleaning fixture shadoof 13 can be operated cleaning clamping apparatus disk 12.This limited block 132 is specially its size round table-like and matches with the center round platform 126 on cleaning clamping apparatus disk 12, and thickness is determined according to the actual requirements.
But cleaning device concrete in the present embodiment is identical with the device that Authorization Notice No. is stated for CN203196968U.
With reference to shown in Fig. 7, proving installation comprises base plate 14 and is arranged on the three-dimensional reflective mirror coalignment 20 of base plate 14 both sides and four-dimensional LED light source adjusting gear 17;
Three-dimensional reflective mirror coalignment 21 upper end is provided with article carrying platform 19, LED light source 18 is provided with in four-dimensional LED light source adjusting gear 17 upper end, and be provided with guide rail slideway 16 in this device side, be provided with giant-screen data form 15 in guide rail slideway one end, be provided with regulating platform 21 in three-dimensional reflective mirror coalignment 20 side.
The device that pick-up unit concrete in the present embodiment is stated for CN103105282A for Authorization Notice No. is identical.
The process of chip is:
First wafer is prepared, then by wafer at stickup stationary installation enterprising oozy glass cover plate bonding and curing operation, enter cutter sweep subsequently, it be first cut into strip, be cut into granular again, then put in lapping device grind cutting into granular semi-manufacture, make the chip incidence end angular range after grinding in 8 ° ± 0.3 °, after completing grinding, put into cleaning device to clean, thus the chip cleaned up is detected, and then monitor qualified after, packaging and warehousing.
The utility model chip comprises by the larger pure SiO of refractive index in sum
2the sandwich layer that material is formed, be provided with top covering at the upper surface of sandwich layer, lower surface is provided with under-clad layer, and top covering and under-clad layer are by SiO
2, P, N, As by the refractive index that vapour deposition process is formed be slightly less than core refractive rate potpourri form, and on under-clad layer, there is a glass cover-plate with UV glue bond, glass cover-plate can increase coupling area and whole device be played to the effect of protection, and select UV glue to be bonded on under-clad layer, the stability of glass cover-plate on under-clad layer can be improved further, the one-piece construction of chip improves return loss and signal transmission efficiency, makes light splitting comparatively even;
Another is for the system of processing of processing plane optical waveguide splitter chip, comprise stickup solidification equipment, cutter sweep, lapping device, cleaning device and proving installation, the integration of stickup solidification equipment, UV solidification can be carried out to the wafer after bonding simultaneously, high-temperature baking and TC circulation, thus avoid chip manufacture system the larger shortcoming that takes up space, thus also enable operator more simply operate, thus reduce the labour intensity of operator, another is also provided with micrometer caliper on the apparatus, and then when the instillation of UV glue is more, micrometer caliper can be utilized to regulate, thus unnecessary UV glue is extruded under the extruding of bottom fixed head and upper strata stripper plate, thus improve chip production complete after quality, also improve the production efficiency of whole system of processing simultaneously, thus shorten the cycle of launch products.
More than show and describe ultimate principle of the present utility model, principal character and advantage of the present utility model.The technician of the industry should understand; the utility model is not restricted to the described embodiments; what describe in above-described embodiment and instructions just illustrates principle of the present utility model; under the prerequisite not departing from the utility model spirit and scope, the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (6)
1. a planar optical waveguide splitter chip, comprises
One sandwich layer, described sandwich layer is rearranged by several optical waveguides;
One top covering, described top covering is arranged on sandwich layer upper surface;
One under-clad layer, described under-clad layer is arranged on sandwich layer lower surface;
It is characterized in that, this chip also comprises the glass cover-plate be bonded together with under-clad layer.
2. a kind of planar optical waveguide splitter chip according to claim 1, is characterized in that: described sandwich layer is by the larger pure SiO of refractive index
2material is formed.
3. a kind of planar optical waveguide splitter chip according to claim 1, is characterized in that: described glass cover-plate and under-clad layer use that UV is gluing to be connected together.
4., for processing a system of processing for the described chip of one of claim 1-3, comprise cutter sweep, lapping device, cleaning device, proving installation and stickup solidification equipment;
This system of processing is once processed chip according to the processing sequence of pasting solidification equipment, cutter sweep, lapping device, cleaning device and proving installation;
It is characterized in that, described stickup solidification equipment comprises bottom fixed head, support, upper strata stripper plate and micrometer caliper;
Described upper strata stripper plate is arranged on above bottom fixed head, support column is provided with between described upper strata stripper plate and bottom fixed head, described support column is evenly arranged on bottom fixed head along bottom fixed head circumferencial direction, described support is evenly provided with on bottom fixed head along bottom fixed head circumferencial direction, and through upper strata stripper plate, described support and support column arranged in a crossed manner on bottom fixed head;
Described micrometer caliper is arranged on the stripper plate of upper strata, and corresponding with the support column be arranged between upper strata stripper plate and bottom fixed head;
Wafer cover plate pickup groove is offered in described bottom fixed head upper surface center.
5. a kind of system of processing for processing plane optical waveguide splitter chip according to claim 4, is characterized in that: described cleaning device comprises cleaning clamping apparatus disk and cleaning fixture shadoof;
Described cleaning clamping apparatus disk comprises a disc, and the upper surface of described disc arranges some chip placing grooves, and described disc center is provided with center round platform, and the center of this center round platform is equipped with endoporus;
Described cleaning fixture shadoof comprises a body of rod and arranges the limited block of body of rod one end, and the endoporus that the described body of rod wears with the upper heart position of center round platform matches.
6. a kind of system of processing for processing plane optical waveguide splitter chip according to claim 4, is characterized in that: described proving installation comprises base plate and is arranged on the three-dimensional reflective mirror coalignment of base plate both sides and four-dimensional LED light source adjusting gear;
Described three-dimensional reflective mirror coalignment upper end is provided with article carrying platform, is provided with LED light source, and is provided with guide rail slideway in this device side, be provided with giant-screen data form in described guide rail slideway one end in described four-dimensional LED light source adjusting gear upper end.
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| CN201420652145.5U CN204314501U (en) | 2014-11-04 | 2014-11-04 | A kind of planar optical waveguide splitter chip and system of processing |
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| CN201420652145.5U CN204314501U (en) | 2014-11-04 | 2014-11-04 | A kind of planar optical waveguide splitter chip and system of processing |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108535808A (en) * | 2018-04-03 | 2018-09-14 | 义博通信设备集团股份有限公司 | A kind of manufacturing method of optical branching device |
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- 2014-11-04 CN CN201420652145.5U patent/CN204314501U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108535808A (en) * | 2018-04-03 | 2018-09-14 | 义博通信设备集团股份有限公司 | A kind of manufacturing method of optical branching device |
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Effective date of registration: 20220906 Address after: 215000 88 Hengtong Road, seven Du Town, Wujiang District, Suzhou, Jiangsu Patentee after: HENGTONG OPTIC-ELECTRIC Co.,Ltd. Address before: 215200 No. 168 Jiaotong North Road, Wujiang Economic and Technological Development Zone, Suzhou City, Jiangsu Province Patentee before: JIANGSU HENGTONG OPTICAL NETWORK TECHNOLOGY Co.,Ltd. Patentee before: HENGTONG OPTIC-ELECTRIC Co.,Ltd. |