CN204311600U - A kind of high strength light thermal board - Google Patents
A kind of high strength light thermal board Download PDFInfo
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- CN204311600U CN204311600U CN201420705740.0U CN201420705740U CN204311600U CN 204311600 U CN204311600 U CN 204311600U CN 201420705740 U CN201420705740 U CN 201420705740U CN 204311600 U CN204311600 U CN 204311600U
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- clay layer
- clay
- high strength
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Abstract
The utility model provides a kind of high strength light thermal board, comprise plate body, described plate body is made up of sintering clay layer, insulation layer and interfacial adhesion layer, described sintering clay layer comprises clay layer and lower clay layer, the soffit of described upper clay layer is connected with the upper surface of insulation layer by interfacial adhesion layer, and the soffit of described insulation layer is connected by the upper surface of interfacial adhesion layer with lower clay layer.The advantage that the utility model has and good effect are: the bending property and the intensity that add plate body greatly, thus add the application life of plate body; Be provided with inorganic vacuum thermal insulation plate in plate body inside simultaneously, eliminate disaster hidden-trouble and add soundproof effect simultaneously.Energy-conserving and environment-protective, and workmanship is improve while building costs reduces, make the building safety coefficient of stability higher.
Description
Technical field
The invention relates to a kind of high-intensity building materials, especially relates to a kind of high strength light thermal board.
Background technology
At present, the plate of building a house sold on the market mostly is the common plate that clay is fired or cement, sand, mine tailing etc. are suppressed, insufficient strength and not being incubated, need be incubated again outward at body of wall, but many heat insulating materials mostly are some combustible material such as polyphenyl foamed ball or sawdust, do not prevent fires, be contained in outside body of wall and have disaster hidden-trouble, and the general soundproof effect of heat insulating material is not good enough yet.
Summary of the invention
The object of the invention is to provide simple, the safe and reliable high strength light thermal board of a kind of structure.。
The technical scheme of the invention is: a kind of high strength light thermal board, comprise plate body, described plate body is made up of sintering clay layer, insulation layer and interfacial adhesion layer, described sintering clay layer comprises clay layer and lower clay layer, the soffit of described upper clay layer is connected with the upper surface of insulation layer by interfacial adhesion layer, and the soffit of described insulation layer is connected by the upper surface of interfacial adhesion layer with lower clay layer.
Preferably, in described sintering clay layer, uniform spreading is provided with some steel wire meshes, described steel wire mesh and clay common sintering integrated shaping.
Preferred, described steel wire mesh is the steel wire mesh of prestress wire composition.
Preferred, described insulation layer is inorganic vacuum thermal insulation plate.
The advantage that the invention has and good effect are:
Owing to adopting technique scheme, be mixed into prestress steel twist gauze in the clay layer of plate body outside, add bending property and the intensity of plate body greatly, thus add the application life of plate body; Be provided with inorganic vacuum thermal insulation plate in plate body inside simultaneously, eliminate disaster hidden-trouble and add soundproof effect simultaneously.Energy-conserving and environment-protective, and workmanship is improve while building costs reduces, make the building safety coefficient of stability higher.
Accompanying drawing explanation
Fig. 1 is the structural representation of the invention;
Fig. 2 is the schematic diagram in A-A cross section in the invention Fig. 1.
Detailed description of the invention
Below in conjunction with the drawings and the specific embodiments, the invention is described further.
As depicted in figs. 1 and 2, the invention comprises plate body 1, plate body 1 is made up of sintering clay layer, insulation layer 3 and interfacial adhesion layer 2, sintering clay layer comprises clay layer 11 and lower clay layer 12, the soffit of upper clay layer 11 is connected by the upper surface of interfacial adhesion layer 2 with insulation layer 3, and the soffit of insulation layer 3 is connected by the upper surface of interfacial adhesion layer 2 with lower clay layer 12.
Wherein sinter uniform spreading in clay layer and be provided with some steel wire meshes 4, steel wire mesh 4 is common sintering integrated shaping with clay.The steel wire mesh that steel wire mesh 4 forms for prestress wire, insulation layer 3 is inorganic vacuum thermal insulation plate.
Above embodiment has been described in detail the invention, but described content is only the preferred embodiment of the invention, can not be considered to the practical range for limiting the invention.All equalization changes done according to the invention application range with improve, within the patent covering scope that still all should belong to the invention.
Claims (4)
1. a high strength light thermal board, comprise plate body (1), it is characterized in that: described plate body (1) is made up of sintering clay layer, insulation layer (3) and interfacial adhesion layer (2), described sintering clay layer comprises clay layer (11) and lower clay layer (12), the soffit of described upper clay layer (11) is connected by the upper surface of interfacial adhesion layer (2) with insulation layer (3), and the soffit of described insulation layer (3) is connected by the upper surface of interfacial adhesion layer (2) with lower clay layer (12).
2. high strength light thermal board according to claim 1, is characterized in that: in described sintering clay layer, uniform spreading is provided with some steel wire meshes (4), and described steel wire mesh (4) is common sintering integrated shaping with clay.
3. high strength light thermal board according to claim 2, is characterized in that: the steel wire mesh that described steel wire mesh (4) forms for prestress wire.
4. high strength light thermal board according to claim 1, is characterized in that: described insulation layer (3) is inorganic vacuum thermal insulation plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420705740.0U CN204311600U (en) | 2014-11-21 | 2014-11-21 | A kind of high strength light thermal board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420705740.0U CN204311600U (en) | 2014-11-21 | 2014-11-21 | A kind of high strength light thermal board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204311600U true CN204311600U (en) | 2015-05-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420705740.0U Active CN204311600U (en) | 2014-11-21 | 2014-11-21 | A kind of high strength light thermal board |
Country Status (1)
| Country | Link |
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| CN (1) | CN204311600U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105604202A (en) * | 2014-11-21 | 2016-05-25 | 北鹏首豪（天津）新型建材有限公司 | High-strength light-weight insulation board |
-
2014
- 2014-11-21 CN CN201420705740.0U patent/CN204311600U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105604202A (en) * | 2014-11-21 | 2016-05-25 | 北鹏首豪（天津）新型建材有限公司 | High-strength light-weight insulation board |
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