CN204304949U - A kind of device of SMD glass-encapsulated sintering - Google Patents
A kind of device of SMD glass-encapsulated sintering Download PDFInfo
- Publication number
- CN204304949U CN204304949U CN201520039086.9U CN201520039086U CN204304949U CN 204304949 U CN204304949 U CN 204304949U CN 201520039086 U CN201520039086 U CN 201520039086U CN 204304949 U CN204304949 U CN 204304949U
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- CN
- China
- Prior art keywords
- plate
- location
- upper cover
- glass
- locating hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Ceramic Products (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The utility model discloses the device of a kind of SMD glass-encapsulated sintering, it is characterized in that: comprise location-plate and upper cover location-plate, location-plate adopts graphite material to make, described location-plate is provided with the locating hole putting crystal oscillator pedestal, the limit end of locating hole is processed with many places first chamfering, upper cover location-plate is the upper cover location-plate of glass material, described upper cover location-plate is provided with frame, this frame is provided with U-type groove, the limit end of above-mentioned location-plate is provided with alignment pin, corresponding upper cover location-plate is provided with locating hole, and alignment pin is placed in above-mentioned locating hole.The device of a kind of SMD glass-encapsulated sintering that the utility model obtains, have employed graphite material, not easily flexural deformation during high temperature, chamfering is machined at location-plate and upper cover location-plate many places, being bonded on fixture after avoiding glass to overflow, for ensureing that upper and lower plates contraposition is accurate, devising alignment pin.
Description
Technical field
The utility model relates to the device of a kind of SMD glass-encapsulated sintering.
Background technology
At present, the base construction of SMD quartz-crystal resonator has two kinds, one is Metal Packaging structure: on stack of ceramic plates, sintering can cut down material metal ring, then parallel soldering and sealing cover plate, shortcoming is that price is high, and the sintering temperature of this glass of its SMD reaches 400 °, common metal material is easy flexural deformation when high temperature, in process, easily occur that location is inaccurate, efficiency comparison is low, and cost is high simultaneously.
Utility model content
The purpose of this utility model is the device providing a kind of a kind of SMD glass-encapsulated easy to use, that can make raising crystal oscillator pedestal precision to sinter to solve above-mentioned the deficiencies in the prior art.
To achieve these goals, the device of a kind of SMD glass-encapsulated sintering designed by the utility model, it is characterized in that: comprise location-plate and upper cover location-plate, location-plate adopts graphite material to make, described location-plate is provided with the locating hole putting crystal oscillator pedestal, the end many places, limit of locating hole are processed with the first chamfering, upper cover location-plate is the upper cover location-plate of glass material, described upper cover location-plate is provided with frame, this frame is provided with U-type groove, the limit end of above-mentioned location-plate is provided with alignment pin, corresponding upper cover location-plate is provided with mating holes, alignment pin is placed in above-mentioned mating holes.
Preferably, described mating holes is provided with opening.
The device of a kind of SMD glass-encapsulated sintering that the utility model obtains, have employed graphite material, not easily flexural deformation during high temperature, chamfering is machined at location-plate and upper cover location-plate many places, being bonded on fixture after avoiding glass to overflow, for ensureing that upper and lower plates contraposition is accurate, devising alignment pin.
Accompanying drawing explanation
Fig. 1 is the structural representation of location-plate.
Fig. 2 is the structural representation of upper cover location-plate.
Fig. 3 is the sectional view at A-A place in Fig. 1.
Fig. 4 is the sectional view at B-B place in Fig. 2.
Fig. 5 is the structural representation of locating hole in Fig. 1.
Fig. 6 is the structural representation of frame.
In figure: location-plate 1, upper cover location-plate 2, alignment pin 3, mating holes 4, locating hole 11, first chamfering 12, frame 21, U-type groove 22, second chamfering 23, opening 41.
Detailed description of the invention
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Embodiment:
As shown in Figures 1 to 6, the device of a kind of SMD glass-encapsulated sintering that the utility model provides, comprise location-plate 1 and upper cover location-plate 2, location-plate 1 adopts graphite material to make, described location-plate 1 is provided with the locating hole 11 putting crystal oscillator pedestal, the limit end of locating hole 11 is processed with many places first chamfering 12, upper cover location-plate 2 is the upper cover location-plate of glass material, described upper cover location-plate is provided with frame 21, this frame 21 is provided with U-type groove 22, this frame 21 limit end is processed with many places second chamfering 23, the limit end of above-mentioned location-plate is provided with alignment pin 3, corresponding upper cover location-plate is provided with mating holes, alignment pin is placed in above-mentioned mating holes.
Preferably, described mating holes is provided with opening 41, is convenient to the dismounting of location-plate 1 and upper cover location-plate 2.
The device of a kind of SMD glass-encapsulated sintering that the utility model obtains, have employed graphite material, not easily flexural deformation during high temperature, crystal oscillator pedestal is placed in locating hole 11, then covers upper cover location-plate 2, be put in continuous tunnel furnace and toast, complete encapsulation, machined chamfering 12,23 at location-plate and upper cover location-plate many places, be bonded on fixture after avoiding glass to overflow, for ensureing that upper and lower plates contraposition is accurate, devise alignment pin 3.
For utility model person of an ordinary skill in the technical field; under the prerequisite not departing from utility model design; its framework form can be flexible and changeable; just make some simple deduction or replace, all should be considered as belonging to the scope of patent protection that claims of being submitted to by utility model are determined.
Claims (2)
1. the device of a SMD glass-encapsulated sintering, it is characterized in that: comprise location-plate and upper cover location-plate, location-plate adopts graphite material to make, described location-plate is provided with the locating hole putting crystal oscillator pedestal, the end many places, limit of locating hole are processed with the first chamfering, upper cover location-plate is the upper cover location-plate of glass material, described upper cover location-plate is provided with frame, this frame is provided with U-type groove, the limit end of above-mentioned location-plate is provided with alignment pin, corresponding upper cover location-plate is provided with mating holes, and alignment pin is placed in above-mentioned mating holes.
2. the device of a kind of SMD glass-encapsulated sintering according to claim 1, is characterized in that: described mating holes is provided with opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520039086.9U CN204304949U (en) | 2015-01-20 | 2015-01-20 | A kind of device of SMD glass-encapsulated sintering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520039086.9U CN204304949U (en) | 2015-01-20 | 2015-01-20 | A kind of device of SMD glass-encapsulated sintering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204304949U true CN204304949U (en) | 2015-04-29 |
Family
ID=53110453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520039086.9U Expired - Fee Related CN204304949U (en) | 2015-01-20 | 2015-01-20 | A kind of device of SMD glass-encapsulated sintering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204304949U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104986946A (en) * | 2015-06-17 | 2015-10-21 | 贵州天义电器有限责任公司 | Base plate component glass sintering composite mold |
| CN106229788A (en) * | 2016-08-31 | 2016-12-14 | 山东云特信息科技有限公司 | The assembly method of metallic pin adapter |
| CN106229789B (en) * | 2016-08-31 | 2018-03-27 | 山东云特信息科技有限公司 | A kind of metallic pin connector working plate |
-
2015
- 2015-01-20 CN CN201520039086.9U patent/CN204304949U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104986946A (en) * | 2015-06-17 | 2015-10-21 | 贵州天义电器有限责任公司 | Base plate component glass sintering composite mold |
| CN106229788A (en) * | 2016-08-31 | 2016-12-14 | 山东云特信息科技有限公司 | The assembly method of metallic pin adapter |
| CN106229789B (en) * | 2016-08-31 | 2018-03-27 | 山东云特信息科技有限公司 | A kind of metallic pin connector working plate |
| CN106229788B (en) * | 2016-08-31 | 2018-07-27 | 山东云特信息科技有限公司 | The assembly method of metallic pin connector |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150429 Termination date: 20170120 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |