CN204289409U - A kind of defective semiconductor chip removal device - Google Patents
A kind of defective semiconductor chip removal device Download PDFInfo
- Publication number
- CN204289409U CN204289409U CN201520027077.8U CN201520027077U CN204289409U CN 204289409 U CN204289409 U CN 204289409U CN 201520027077 U CN201520027077 U CN 201520027077U CN 204289409 U CN204289409 U CN 204289409U
- Authority
- CN
- China
- Prior art keywords
- lifting platform
- hole
- removal device
- chip removal
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of defective semiconductor chip removal device, it comprises frame (17), frame (17) base (9) is connected with a lower bolster (10), lower bolster (10) is provided with guide pillar (7), lower bolster (10) center is provided with die (8), die (8) center offers a material-dropping hole (18), material-dropping hole (18) periphery is provided with four symmetrical location hole A(21), location hole A(21) interior installation pilot pin (19), the upper cover of guide pillar (7) has cope match-plate pattern (11), cope match-plate pattern (11) is connected with punch (12), punch (12) is provided with cutter (22), cutter surrounding is provided with and location hole A(21) corresponding location hole B(23), cope match-plate pattern (11) connects an elevating mechanism.The beneficial effects of the utility model are: it has, and operating efficiency is high, minimizing is scrapped, reduced costs and advantage simple to operate.
Description
Technical field
The utility model relates to semiconductor chip, particularly a kind of defective semiconductor chip removal device.
Background technology
Semiconductor chip is in the course of processing, for conserve space, also be convenient to store transport, usually semiconductor chip is evenly distributed in a chip strip, because the semiconductor chip processed has defective products, after detecting defective products, need to remove defective products, defective semiconductor's chip of transmission is by artificial cutting, inefficiency, and when cutting, bad chip surrounding is needed to cut off completely, labour intensity is larger, human cost is higher, when defective products is more, a chip strip will be separated into multistage, be unfavorable for the storage transport of chip, and by artificial cutting, also easily cause non-defective unit chip damaged, increase production cost.
Utility model content
The purpose of this utility model is the shortcoming overcoming prior art, provide a kind of operating efficiency high, reduce costs and easy to operate defective semiconductor's chip removal device.
The purpose of this utility model is achieved through the following technical solutions: a kind of defective semiconductor chip removal device, it comprises frame, the column lower end of described frame is provided with a base, base is connected with a lower bolster, described lower bolster upper surface is provided with guide pillar, lower bolster center offers a square blind hole, in square blind hole, die is installed, described die center offers a material-dropping hole, material-dropping hole periphery is provided with four symmetrical location hole A, pilot pin with spring is installed in described location hole A, on described guide pillar, cover has cope match-plate pattern, cope match-plate pattern is connected with a punch, punch center is connected with a cutter, cutter is positioned at directly over material-dropping hole, and cutter surrounding is provided with the location hole B corresponding with location hole A, described cope match-plate pattern connects an elevating mechanism, described elevating mechanism is enclosed within the column of frame, and can move up and down along column.
Described lowering or hoisting gear comprises lifting platform, spur rack, gear, described lifting platform inside is hollow structure, lifting platform inner bay is provided with a rotating shaft, set gear on rotating shaft, described lifting platform front end face offers a chute, be sliding combined with a spur rack in chute, and by cover plate capping on lifting platform front end face, the tooth bar of the rack and pinion of described spur rack matches.
Lifting platform is stretched out in described rotating shaft one end, and rotating shaft external part is provided with a rocking bar.
Described spur rack upper end is connected with a spring, and the other end of spring is connected with frame.
Described lifting platform rearward end offers a through hole, and through hole and the column of lifting platform are slidably matched, and are provided with a clamping screw on the left side wall of lifting platform.
Described die upper surface offers multiple square groove, and die offers four screwed holes, and screwed hole is distributed on the diagonal of die.
Described punch lower surface offers the square groove corresponding with die, and offers two symmetrical screwed holes at punch upper surface.
Described cope match-plate pattern lower surface is provided with sleeve, and jacket casing is on column
The utility model has the following advantages: defective semiconductor of the present utility model chip removal device, bad chip is placed on material-dropping hole, and located by pilot pin, down shake rocking bar with hand, cutter completes the removal of bad chip, then cutter is up under the effect of spring force and gear, do not need chip strip to be cut into the removal that multistage just can complete bad chip, improve production efficiency, decrease and scrap, reduce cost, and easy to operate, labour intensity is low.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model
Fig. 2 is the structural representation of die
Fig. 3 is A-A cross-sectional schematic in Fig. 2
Fig. 4 is the structural representation of punch
In figure, 1-lifting platform, 2-gear, 3-rotating shaft, 4-clamping screw, 5-column, 6-sleeve, 7-guide pillar, 8-die, 9-base, 10-lower bolster, 11-cope match-plate pattern, 12-punch, 13-cover plate, 14-rocking bar, 15-spur rack, 16-spring, 17-frame, 18-material-dropping hole, 19-pilot pin, 20-square groove, 21-location hole A, 22-cutter, 23-location hole B.
Embodiment
Be further described the utility model below in conjunction with accompanying drawing, protection of the present utility model is enclosed and is not limited to the following stated:
As shown in Figure 1, a kind of defective semiconductor chip removal device, it comprises frame 17, column 5 lower end of described frame 17 is provided with a base 9, base 9 is connected with a lower bolster 10, described lower bolster 10 upper surface is provided with guide pillar 7, lower bolster 10 center offers a square blind hole, die 8 is installed in square blind hole, as shown in Figure 2, described die 8 center offers a material-dropping hole 18, as shown in Figure 3, material-dropping hole 18 periphery is provided with four symmetrical location hole A21, pilot pin 19 with spring is installed in described location hole A21, on described guide pillar 7, cover has cope match-plate pattern 11, cope match-plate pattern 11 is connected with a punch 12, as shown in Figure 4, punch 12 center is connected with a cutter 22, cutter 22 is positioned at directly over material-dropping hole 18, and cutter surrounding is provided with the location hole B23 corresponding with location hole A21, described cope match-plate pattern 11 connects an elevating mechanism, described elevating mechanism is enclosed within the column 5 of frame 17, and can move up and down along column 5.
In the present embodiment, as shown in Figure 1, described lowering or hoisting gear comprises lifting platform 1, spur rack 15, gear 2, described lifting platform 1 inside is hollow structure, lifting platform 1 inner bay is provided with a rotating shaft 3, set gear 2 on rotating shaft 3, described lifting platform 1 front end face offers a chute, a spur rack 15 is sliding combined with in chute, and by cover plate 13 capping on lifting platform 1 front end face, the tooth bar of the rack and pinion 2 of described spur rack 15 matches, lifting platform 1 is stretched out in further rotating shaft 3 one end, rotating shaft 3 external part is provided with a rocking bar 14, shake rocking bar 14, gear 2 rotates, thus drive spur rack 15 to move up and down, and then drive punch 12 to move up and down.
In the present embodiment, spur rack 15 upper end is connected with a spring 16, the other end of spring 16 is connected with frame 17, when spur rack 15 is descending, the pulling force of spring 16 need be overcome, thus reduce the impulsive force of cutter 22 pairs of chip strip, avoid the phenomenon that chip strip causes because impulsive force is excessive damaging, and after semiconductor failure chip is removed, spur rack 15 is up under the pulling force effect of spring 16, reduces labour intensity.
In the present embodiment, lifting platform 1 rearward end offers a through hole, and through hole and the column 5 of lifting platform 1 are slidably matched, and on the left side wall of lifting platform 1, be provided with a clamping screw 4, by the elemental height regulating clamping screw 4 can preset lifting platform 1.
In this suitable examples, die 8 upper surface offers multiple square groove 20, die 8 offers four screwed holes, screwed hole is distributed on the diagonal of die 8, guarantee that die 8 to be fixedly mounted on lower bolster 10 10, punch 12 lower surface offers the square groove 20 corresponding with die 8, and offers two symmetrical screwed holes at punch 12 upper surface, and the size of square groove 20 is surely closed mutually with the die size in chip strip.
In this enforcement, described cope match-plate pattern 11 lower surface is provided with sleeve 6, and sleeve 6 is enclosed within column 5, and sleeve 6 can increase the descending vertical precision of cope match-plate pattern, and sleeve 6 also can play spacing effect.
The course of work of the present utility model is as follows: be placed on material-dropping hole 18 by the bad chip in chip strip, pilot pin 19 matches with the through hole in chip strip, realize the location of chip strip, then rotate rocking bar 14, cope match-plate pattern 11 is descending, and punch 12 contacts with die 8, cutter 22 on punch 12 completes the removal of bad chip, then upwards rotating rocker 14, cope match-plate pattern 11 up moves under the drive of spring force and gear 2, then carries out the removal of next bad chip.
Claims (8)
1. defective semiconductor's chip removal device, it is characterized in that: it comprises frame (17), column (5) lower end of described frame (17) is provided with a base (9), base (9) is connected with a lower bolster (10), described lower bolster (10) upper surface is provided with guide pillar (7), lower bolster (10) center offers a square blind hole, die (8) is installed in square blind hole, described die (8) center offers a material-dropping hole (18), material-dropping hole (18) periphery is provided with four symmetrical location hole A(21), described location hole A(21) in pilot pin (19) with spring is installed, the upper cover of described guide pillar (7) has cope match-plate pattern (11), cope match-plate pattern (11) is connected with a punch (12), punch (12) center is connected with a cutter (22), cutter (22) is positioned at directly over material-dropping hole (18), and cutter surrounding is provided with and location hole A(21) corresponding location hole B(23), described cope match-plate pattern (11) connects an elevating mechanism, described elevating mechanism is enclosed within the column (5) of frame (17), and can move up and down along column (5).
2. a kind of defective semiconductor according to claim 1 chip removal device, it is characterized in that: described lowering or hoisting gear comprises lifting platform (1), spur rack (15), gear (2), described lifting platform (1) inside is hollow structure, lifting platform (1) inner bay is provided with a rotating shaft (3), the upper set gear (2) of rotating shaft (3), described lifting platform (1) front end face offers a chute, a spur rack (15) is sliding combined with in chute, and by cover plate (13) capping on lifting platform (1) front end face, the tooth bar of the rack and pinion (2) of described spur rack (15) matches.
3. a kind of defective semiconductor according to claim 2 chip removal device, is characterized in that: lifting platform (1) is stretched out in described rotating shaft (3) one end, and rotating shaft (3) external part is provided with a rocking bar (14).
4. a kind of defective semiconductor according to claim 2 chip removal device, it is characterized in that: described spur rack (15) upper end is connected with a spring (16), the other end of spring (16) is connected with frame (17).
5. a kind of defective semiconductor according to claim 2 chip removal device, it is characterized in that: described lifting platform (1) rearward end offers a through hole, through hole and the column (5) of lifting platform (1) are slidably matched, and on the left side wall of lifting platform (1), be provided with a clamping screw (4).
6. a kind of defective semiconductor according to claim 1 chip removal device, it is characterized in that: described die (8) upper surface offers multiple square groove (20), die (8) offers four screwed holes, and screwed hole is distributed on the diagonal of die (8).
7. a kind of defective semiconductor according to claim 6 chip removal device, it is characterized in that: described punch (12) lower surface offers the square groove (20) corresponding with die (8), and offer two symmetrical screwed holes at punch (12) upper surface.
8. a kind of defective semiconductor according to claim 1 chip removal device, is characterized in that: described cope match-plate pattern (11) lower surface is provided with sleeve (6), and sleeve (6) is enclosed within column (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520027077.8U CN204289409U (en) | 2015-01-15 | 2015-01-15 | A kind of defective semiconductor chip removal device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520027077.8U CN204289409U (en) | 2015-01-15 | 2015-01-15 | A kind of defective semiconductor chip removal device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204289409U true CN204289409U (en) | 2015-04-22 |
Family
ID=52872543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520027077.8U Expired - Fee Related CN204289409U (en) | 2015-01-15 | 2015-01-15 | A kind of defective semiconductor chip removal device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204289409U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104505357A (en) * | 2015-01-15 | 2015-04-08 | 成都先进功率半导体股份有限公司 | Bad semiconductor chip removal device |
-
2015
- 2015-01-15 CN CN201520027077.8U patent/CN204289409U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104505357A (en) * | 2015-01-15 | 2015-04-08 | 成都先进功率半导体股份有限公司 | Bad semiconductor chip removal device |
| CN104505357B (en) * | 2015-01-15 | 2017-05-17 | 成都先进功率半导体股份有限公司 | Bad semiconductor chip removal device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150422 Termination date: 20160115 |
|
| EXPY | Termination of patent right or utility model |