CN204289018U - A kind of base being applicable to annular common mode inductance - Google Patents
A kind of base being applicable to annular common mode inductance Download PDFInfo
- Publication number
- CN204289018U CN204289018U CN201420716742.XU CN201420716742U CN204289018U CN 204289018 U CN204289018 U CN 204289018U CN 201420716742 U CN201420716742 U CN 201420716742U CN 204289018 U CN204289018 U CN 204289018U
- Authority
- CN
- China
- Prior art keywords
- base
- cushion rubber
- common mode
- mode inductance
- solder joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of base being applicable to annular common mode inductance, described base is provided with boss in bottom even, it can be used for increasing solder joint heat-dissipating space, described base is provided with cushion rubber in wire hole place, top, described cushion rubber inside is provided with some convex pads, and it can be used for containing that the flowing of epoxy glue is to promote the link strength after its sclerosis.Compare to traditional common mode inductance base, the design increases projection bottom it, the heat-dissipating space of solder joint is increased with this, the problem that when can solve welding circuit board, solder joint bubbles, increase cushion rubber at base wire hole place simultaneously, cushion rubber inside is provided with some convex pads, can effectively contain that epoxy glue flows, and the aesthetics improved after epoxy glue sclerosis and the link strength between enamelled wire and base.
Description
Technical field
The utility model relates to a kind of base being applicable to annular common mode inductance.
Background technology
Existing common mode inductance base, there are the following problems usually:
1, in the assembly welding process of circuit board, base is close to circuit board, and during Wave crest Welding, cannot breathe freely in solder joint hole, during solder cools, solder joint can produce pore and bubble;
In the process of 2, assembling at product coil and base, use epoxy resin to carry out a glue and fixes, after the base point glue of conventional pattern, glue point outward appearance is poor, and between enamelled wire and base, link strength is not enough.
Summary of the invention
In order to overcome above-mentioned deficiency of the prior art, the utility model provides a kind of annular common mode inductance base of brand-new design, increase protruding bottom it, base increases cushion rubber simultaneously, cushion rubber inside is provided with some convex pads, can effectively contain that epoxy glue flows, improve the attractive in appearance and link strength of some glue.
The utility model solves the technical scheme that its technical problem adopts:
A kind of base being applicable to annular common mode inductance, described base is provided with boss in bottom even, it can be used for increasing solder joint heat-dissipating space, described base is provided with cushion rubber in wire hole place, top, described cushion rubber inside is provided with some convex pads, and it can be used for containing that the flowing of epoxy glue is to promote the link strength after its sclerosis.
As the improvement of technique scheme, described boss is arranged at the corner of described base bottom, and itself and described base are formed in one structure.
The beneficial effect that the utility model brings has:
Compare to traditional common mode inductance base, the design increases projection bottom it, the heat-dissipating space of solder joint is increased with this, the problem that when can solve welding circuit board, solder joint bubbles, increase cushion rubber at base wire hole place simultaneously, cushion rubber inside is provided with some convex pads, can effectively contain that epoxy glue flows, and the aesthetics improved after epoxy glue sclerosis and the link strength between enamelled wire and base.
Accompanying drawing explanation
Below in conjunction with drawings and the specific embodiments, the utility model is described in further detail,
Accompanying drawing 1 is the structural perspective of this base;
Accompanying drawing 2 is structure side views of this base;
Accompanying drawing 3 is structure vertical views of this base;
Accompanying drawing 4 is structure upward views of this base.
Embodiment
With reference to accompanying drawing 1 to accompanying drawing 4, the utility model be a kind of brand-new design be mainly applicable to annular common mode inductance base.This base is provided with boss 1 integrated with it in corner, bottom place, and when carrying out Wave crest Welding, boss 1 can be used for increasing the heat-dissipating space of solder joint, the problem that when solving welding circuit board with this, solder joint bubbles.
Wire hole place, base top is provided with cushion rubber 2, be provided with some convex pads 3 in cushion rubber 2, click and enter after cushion rubber 2 until epoxy glue, this structure can be used for the flowing containing epoxy glue, after epoxy glue sclerosis, between enamelled wire and base, link strength significantly improves, and improves the aesthetics of product simultaneously.
It should be noted that, the above is preferred embodiment of the present utility model, and the utility model is not limited to above-mentioned execution mode, as long as it reaches technique effect of the present utility model with identical means, all should belong to protection range of the present utility model.
Claims (2)
1. one kind is applicable to the base of annular common mode inductance, it is characterized in that: described base is provided with boss (1) in bottom even, it can be used for increasing solder joint heat-dissipating space, described base is provided with cushion rubber in wire hole place, top, described cushion rubber inside is provided with some convex pads (2), and it can be used for containing that the flowing of epoxy glue is to promote the link strength after its sclerosis.
2. a kind of base being applicable to annular common mode inductance according to claim 1, is characterized in that: described boss (1) is arranged at the corner of described base bottom, and itself and described base are formed in one structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420716742.XU CN204289018U (en) | 2014-11-24 | 2014-11-24 | A kind of base being applicable to annular common mode inductance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420716742.XU CN204289018U (en) | 2014-11-24 | 2014-11-24 | A kind of base being applicable to annular common mode inductance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204289018U true CN204289018U (en) | 2015-04-22 |
Family
ID=52872152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420716742.XU Expired - Fee Related CN204289018U (en) | 2014-11-24 | 2014-11-24 | A kind of base being applicable to annular common mode inductance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204289018U (en) |
-
2014
- 2014-11-24 CN CN201420716742.XU patent/CN204289018U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP02 | Change in the address of a patent holder |
Address after: 519000 Guangdong province Zhuhai Sanzao calm Bay Road No. 60 ten Patentee after: Zhuhai Yun Lu at dawn New Energy Technology Co., Ltd. Address before: 519041 Guangdong province Zhuhai City Sanzao town Jinwan District Yonghui Road No. 10 on the 1st plant Patentee before: Zhuhai Yun Lu at dawn New Energy Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150422 Termination date: 20181124 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |