CN204285952U - A kind of for the vacuum drying device in multiline cut silicon chips cleaning process - Google Patents
A kind of for the vacuum drying device in multiline cut silicon chips cleaning process Download PDFInfo
- Publication number
- CN204285952U CN204285952U CN201420724964.6U CN201420724964U CN204285952U CN 204285952 U CN204285952 U CN 204285952U CN 201420724964 U CN201420724964 U CN 201420724964U CN 204285952 U CN204285952 U CN 204285952U
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- casing
- silicon chip
- conveying device
- cleaning process
- vacuum drying
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Abstract
The utility model relates to a kind of for the vacuum drying device in multiline cut silicon chips cleaning process, and belong to silicon chip preparation facilities field, it comprises, airtight casing, and casing is connected with the vacuum tube for vacuumizing; In casing, being also provided with the conveying device for placing silicon chip, two side panels that casing is corresponding with conveying device having charging aperture and discharging opening, is fitted with feeding gate and discharge door at charging aperture and discharge outlet correspondence; The auxiliary hot plate in order to warm silicon chip is also provided with in the position that conveying device contacts with the silicon wafer gaily decorated basket, use vavuum pump to reduce environmental pressure and remove moisture, silicon chip surface is avoided to cause contamination, conveying device and charging and discharging mouth are connected consistent, automatically the gaily decorated basket carrying multiple silicon chip is delivered into casing, the automaticity of equipment is high, add and have an auxiliary hot plate, internal temperature is regulated by auxiliary hot equipment, ensure that temperature is more than or equal to outdoor dew-point temperature when taking out silicon chip, there will not be the phenomenon of surface sweating.
Description
Technical field
This device belongs to silicon chip preparation facilities field, particularly a kind of for the vacuum drying device in multiline cut silicon chips cleaning process.
Background technology
In the industry field such as electronics, photovoltaic, silicon chip is most important basic material.Pole shape is generally after monocrystalline silicon completes, need to use wire cutting machine to carry out slicing treatment, and line slicer is in slicing processing, particle loaded fluid (mixed solution of SiC, cutting fluid) must be injected, after slicing treatment, for the thin slice of proper alignment, then silicon chip is needed to carry out cleaning, in prior art, silicon chip cleans by general cleaning solution, then be stacked in drier and dry, drier is generally utilize to get rid of a barrel High Rotation Speed, and abundant ingress of air makes it dry, or be placed in dryer, use heating plate to carry out high temperature drying.
Wherein, drier carries out in the process dried at a high speed, because water droplet high-speed flight has certain probability to produce washmarking at silicon chip surface, dryer carries out in the process of high temperature drying, owing to fully contacting with air, the lower limb of silicon chip can be made to have remaining watermark in the process of drying, consuming time longer, silicon chip surface stains serious, known dry way, to have ignored in drying course environment to the contamination effect of silicon chip, and silicon chip is exported dryer by general dryer after oven dry completes, now silicon chip surface temperature does not drop to room temperature, steam in air can carry out secondary pollution to silicon chip, the knot cleanliness of silicon chip surface and defect directly affect the performance of electronics silicon chip and photovoltaic cell, silicon chip surface stains serious, this can affect the quality of silicon chip, for manufacture high performance electronics, this kind of silicon chip is difficult to be competent at.
Utility model content
The purpose of this utility model is, in order to the problem that the drier and dryer that solve above-mentioned proposition all can pollute silicon chip surface, propose a kind of for the vacuum drying device in multiline cut silicon chips cleaning process, dry to realize quick no pollution, effectively can improve the surface knot cleanliness of silicon chip.
The technical scheme provided, provide a kind of for the vacuum drying device in multiline cut silicon chips cleaning process, it comprises airtight casing, and casing is connected with the vacuum tube for vacuumizing; In casing, be also provided with the conveying device for placing silicon chip, casing corresponding with conveying device two side panels on have charging aperture and discharging opening, be fitted with feeding gate and discharge door at charging aperture and discharge outlet correspondence; The auxiliary hot plate in order to warm silicon chip is also provided with in the position that conveying device contacts with the silicon wafer gaily decorated basket.
Further, the crawler belt that described conveying device comprises driving wheel, driven pulley, regulating wheel and covers on three, crawler belt between driving wheel and driven pulley is on the line of charging aperture and discharging opening minimum point, and described auxiliary hot plate is under crawler belt between driving wheel and driven pulley.
Further, also contact-making switch is provided with above feeding gate, discharge door.
Further, be positioned in casing cavity on bottom surface and be also provided with fragment box.
The beneficial effect obtained is, 30 DEG C time, fit saturated vapor pressure is 4132.982Pa, if at normal temperatures the pressure in environment is reduced to below saturated vapour pressure, then the moisture of silicon chip surface will seethe with excitement, and absorb heat, use vavuum pump to reduce environmental pressure and remove moisture, avoid silicon chip surface to cause contamination.
Conveying device and charging and discharging mouth are connected consistent, automatically the gaily decorated basket carrying multiple silicon chip are delivered into casing, and send discharging opening after treating silicon chip surface cleaning and enter silicon chip turnover rack, the automaticity of equipment is high.
In order to avoid the steam run into because silicon chip surface temperature is too low in air can cause secondary pollution in silicon chip surface condensation, add and have an auxiliary hot plate, internal temperature is regulated by auxiliary hot equipment, ensure that temperature is more than or equal to outdoor dew-point temperature when taking out silicon chip, and there will not be the phenomenon of surface sweating.
Accompanying drawing explanation
Fig. 1 is this apparatus structure schematic diagram
Detailed description of the invention
This device comprises casing 1, vavuum pump 2, the silicon wafer gaily decorated basket 3, auxiliary hot plate 4, limit switch 5, conveying arrangement.
Wherein, casing 1 is also connected with feeding gate 1a, discharge door 1b, fragment box 1c;
Conveying arrangement comprises driven pulley, driving wheel, regulating wheel, crawler belt.
As shown in Figure 1, this device comprises a casing 1, in casing 1 left panel, central authorities have charging aperture, corresponding, feeding gate 1a is hinged with herein in equipped, casing 1 right panel central authorities have discharging opening, corresponding, discharge door 1b is hinged with herein in equipped, in feeding gate 1a, limit switch 5 is also provided with above discharge door 1b, described conveying arrangement is arranged in casing 1, conveying arrangement comprises driving wheel, driven pulley, regulating wheel and the crawler belt covered on three, described driving wheel and driven pulley are in same level line, therebetween crawler belt is on the line of charging aperture and discharging opening minimum point, described crawler belt can carry and transport the gaily decorated basket 3 being mounted with silicon wafer, corresponding, auxiliary hot plate 4 is provided with between driving wheel and driven pulley below crawler belt, and the area of auxiliary hot plate 4 can contain enough greatly the institute of the gaily decorated basket 3 through path, be positioned in casing 1 cavity on bottom surface and be also provided with fragment box 1c, the side of casing 1 also has gas outlet, this gas outlet place is sealably coupled to vavuum pump 2 by vacuum tube, opposite side has air inlet, this air inlet place is sealedly connected with an intake valve, also thermometer is connected with above casing, timer, the instrument such as pressure controller or control device.
Feeding gate 1a, discharge door 1b, vavuum pump 2, contact-making switch 5 and conveying device thereof are all connected with control unit.
Composition graphs 1 is set forth, silicon chip loads the dress gaily decorated basket 3 and enters into silicon chip alkaline bath, cleaning is not necessarily often, the silicon chip of alkali cleaning is hung in silicon chip potcher by manipulator, carrying out ultrasonic oscillation purification, cleaning complete silicon chip enters in casing 1 by feeding gate 1a, enter into casing 1 cavity laggard bin gate 1a and discharge door 1b completely at the gaily decorated basket close simultaneously and seal, driving wheel stall, vavuum pump and auxiliary hot plate are started working, casing 1 progresses into vacuum environment, be arranged on casing 1 pressure sensor and pressure in casing 1 is fed back to control unit constantly, the pressure value received and user are set numerical value and compare constantly by control unit, after pressure reaches setting threshold values, timer initiation, in chamber, pressure ensures between 1000mTorr-10000mTorr, treat necessarily often after silicon wafer bone dry, open intake valve, cavity pressure recovers normal pressure, auxiliary hot plate 4 quits work, feeding gate 1a and discharge door 1b opens simultaneously, driving wheel starts, the gaily decorated basket 4 is sent cavity.
Claims (4)
1. for the vacuum drying device in multiline cut silicon chips cleaning process, it is characterized in that: comprise airtight casing (1), casing (1) is connected with the vacuum tube for vacuumizing; The conveying device for placing silicon chip is also provided with in casing (1), casing (1) corresponding with conveying device two side panels on have charging aperture and discharging opening, be fitted with feeding gate (1a) and discharge door (1b) at charging aperture and discharge outlet correspondence; The auxiliary hot plate (4) in order to warm silicon chip is also provided with in the position that conveying device contacts with the silicon wafer gaily decorated basket (3).
2. according to claim 1 for the vacuum drying device in multiline cut silicon chips cleaning process, it is characterized in that: the crawler belt that described conveying device comprises driving wheel, driven pulley, regulating wheel and covers on three, crawler belt between driving wheel and driven pulley is on the line of charging aperture and discharging opening minimum point, and described auxiliary hot plate (4) is under crawler belt between driving wheel and driven pulley.
3. according to claim 1 for the vacuum drying device in multiline cut silicon chips cleaning process, it is characterized in that: feeding gate (1a), discharge door (1b) top is also provided with contact-making switch (5).
4. according to claim 1 for the vacuum drying device in multiline cut silicon chips cleaning process, it is characterized in that: be positioned in casing (1) cavity on bottom surface and be also provided with fragment box (1c).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420724964.6U CN204285952U (en) | 2014-11-27 | 2014-11-27 | A kind of for the vacuum drying device in multiline cut silicon chips cleaning process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420724964.6U CN204285952U (en) | 2014-11-27 | 2014-11-27 | A kind of for the vacuum drying device in multiline cut silicon chips cleaning process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204285952U true CN204285952U (en) | 2015-04-22 |
Family
ID=52869103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420724964.6U Expired - Fee Related CN204285952U (en) | 2014-11-27 | 2014-11-27 | A kind of for the vacuum drying device in multiline cut silicon chips cleaning process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204285952U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106052314A (en) * | 2016-08-02 | 2016-10-26 | 江苏光阳动力环保设备有限公司 | Water-containing material drying and guiding device |
| CN107214745A (en) * | 2017-07-11 | 2017-09-29 | 成都远洋蓝猫科技有限公司 | One kind is stained with liquid scraps of paper special cutting device |
| CN111554593A (en) * | 2020-04-29 | 2020-08-18 | 常州比太科技有限公司 | Method for drying silicon wafer after groove type cleaning and texturing |
| CN112880369A (en) * | 2021-01-28 | 2021-06-01 | 西安奕斯伟硅片技术有限公司 | Device and method for controlling TDH (time domain reflectometry) of silicon wafer |
-
2014
- 2014-11-27 CN CN201420724964.6U patent/CN204285952U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106052314A (en) * | 2016-08-02 | 2016-10-26 | 江苏光阳动力环保设备有限公司 | Water-containing material drying and guiding device |
| CN107214745A (en) * | 2017-07-11 | 2017-09-29 | 成都远洋蓝猫科技有限公司 | One kind is stained with liquid scraps of paper special cutting device |
| CN111554593A (en) * | 2020-04-29 | 2020-08-18 | 常州比太科技有限公司 | Method for drying silicon wafer after groove type cleaning and texturing |
| CN112880369A (en) * | 2021-01-28 | 2021-06-01 | 西安奕斯伟硅片技术有限公司 | Device and method for controlling TDH (time domain reflectometry) of silicon wafer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150422 Termination date: 20171127 |
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| CF01 | Termination of patent right due to non-payment of annual fee |