CN204280353U - A kind of packaging fixing plate of high-density semiconductor encapsulation wafer UV membraneous material - Google Patents
A kind of packaging fixing plate of high-density semiconductor encapsulation wafer UV membraneous material Download PDFInfo
- Publication number
- CN204280353U CN204280353U CN201420697822.5U CN201420697822U CN204280353U CN 204280353 U CN204280353 U CN 204280353U CN 201420697822 U CN201420697822 U CN 201420697822U CN 204280353 U CN204280353 U CN 204280353U
- Authority
- CN
- China
- Prior art keywords
- baffle plate
- stationary cylinder
- plate
- density semiconductor
- fixing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of packaging fixing plate of high-density semiconductor encapsulation wafer UV membraneous material, comprise baffle plate and stationary cylinder, described baffle plate is made up of upper plate and lower plate two pieces, first-class point of described baffle plate offers two mounting holes between two parties, and described stationary cylinder is movably arranged on baffle plate by inside the lateral of baffle plate by mounting hole.The encapsulation of this high-density semiconductor is simple by the packaging fixing plate structure of wafer UV membraneous material, and environmental protection is easy to use.
Description
Technical field
The utility model relates to packing technique field, is specially a kind of packaging fixing plate of high-density semiconductor encapsulation wafer UV membraneous material.
Background technology
After protective film is produced, the formation adopting rolling packing more, this causes protective film to be deposited and transports inconvenience, deposit with transportation in easily scatter and roll, for this reason, we propose a kind of packaging fixing plate of high-density semiconductor encapsulation wafer UV membraneous material.
Utility model content
The purpose of this utility model is the packaging fixing plate providing a kind of high-density semiconductor encapsulation wafer UV membraneous material, to solve the problem proposed in above-mentioned background technology.
For achieving the above object, the utility model provides following solution: a kind of packaging fixing plate of high-density semiconductor encapsulation wafer UV membraneous material, comprise baffle plate and stationary cylinder, described baffle plate is made up of upper plate and lower plate two pieces, first-class point of described baffle plate offers two mounting holes between two parties, and described stationary cylinder is movably arranged on baffle plate by inside the lateral of baffle plate by mounting hole.
Preferably, described baffle plate adopts solid fiberboard material, and corner is designed with chamfering.
Preferably, outwards extend in described stationary cylinder lower end, and form position limiting structure, being arranged on baffle plate for stationary cylinder superolateral spacing, inwardly extends in described stationary cylinder upper end, forms suit mouth.
Compared with prior art; the beneficial effects of the utility model are: the packaging fixing plate structure of this high-density semiconductor encapsulation wafer UV membraneous material is simple; adopt the manufacture of solid fiberboard material; environmental protection, two pieces of baffle plates adopt equivalent specifications design, and it is more convenient to make in use procedure; stationary cylinder is arranged on baffle plate; then two pieces of baffle plates are sleeved on the two ends up and down of protective film respectively by stationary cylinder, easy to use, effective.
Accompanying drawing explanation
Fig. 1 is the utility model structural representation;
Fig. 2 is the utility model baffle arrangement schematic diagram;
Fig. 3 is the utility model stationary cylinder structural representation.
Specific implementation method
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
Refer to Fig. 1-3, the utility model provides a kind of technical scheme: a kind of packaging fixing plate of high-density semiconductor encapsulation wafer UV membraneous material, comprise baffle plate 1 and stationary cylinder 2, baffle plate 1 is made up of upper plate 11 and lower plate 12 two pieces, first-class point of baffle plate 1 offers two mounting holes 13 between two parties, and baffle plate 1 adopts solid fiberboard material, corner is designed with chamfering 14, makes the corner of baffle plate 1 deposit or not easily bend in transportation.Stationary cylinder 2 is by being movably arranged on baffle plate 1 inside the lateral of mounting hole 13 by baffle plate 1; outwards extend in stationary cylinder 2 lower end; form position limiting structure 21; baffle plate 1 is arranged on superolateral spacing for stationary cylinder 2; inwardly extending in stationary cylinder 2 upper end, forms suit mouth 22, and what suit mouth 22 can make protective film 3 be more prone to is sleeved on stationary cylinder 2; and the structure of stationary cylinder 2 can be made more stable, not yielding.
To those skilled in the art, obvious the utility model is not limited to the details of above-mentioned one exemplary embodiment, and when not deviating from spirit of the present utility model or essential characteristic, can realize the utility model in other specific forms.Therefore, no matter from which point, all should embodiment be regarded as exemplary, and be nonrestrictive, scope of the present utility model is limited by claims instead of above-mentioned explanation, and all changes be therefore intended in the implication of the equivalency by dropping on claim and scope are included in the utility model.Any Reference numeral in claim should be considered as the claim involved by limiting.
In addition, be to be understood that, although this specification sheets is described according to embodiment, but not each embodiment only comprises an independently technical scheme, this narrating mode of specification sheets is only for clarity sake, those skilled in the art should by specification sheets integrally, and the technical scheme in each embodiment also through appropriately combined, can form other embodiments that it will be appreciated by those skilled in the art that.
Claims (3)
1. a high-density semiconductor encapsulates the packaging fixing plate using wafer UV membraneous material, comprise baffle plate and stationary cylinder, it is characterized in that: described baffle plate is made up of upper plate and lower plate two pieces, first-class point of described baffle plate offers two mounting holes between two parties, and described stationary cylinder is movably arranged on baffle plate by inside the lateral of baffle plate by mounting hole.
2. the packaging fixing plate of a kind of high-density semiconductor encapsulation wafer UV membraneous material according to claim 1, is characterized in that: described baffle plate adopts solid fiberboard material, and corner is designed with chamfering.
3. the packaging fixing plate of a kind of high-density semiconductor encapsulation wafer UV membraneous material according to claim 1, it is characterized in that: outwards extend in described stationary cylinder lower end, form position limiting structure, baffle plate is arranged on superolateral spacing for stationary cylinder, inwardly extending in described stationary cylinder upper end, forms suit mouth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420697822.5U CN204280353U (en) | 2014-11-19 | 2014-11-19 | A kind of packaging fixing plate of high-density semiconductor encapsulation wafer UV membraneous material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420697822.5U CN204280353U (en) | 2014-11-19 | 2014-11-19 | A kind of packaging fixing plate of high-density semiconductor encapsulation wafer UV membraneous material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204280353U true CN204280353U (en) | 2015-04-22 |
Family
ID=52863539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420697822.5U Expired - Fee Related CN204280353U (en) | 2014-11-19 | 2014-11-19 | A kind of packaging fixing plate of high-density semiconductor encapsulation wafer UV membraneous material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204280353U (en) |
-
2014
- 2014-11-19 CN CN201420697822.5U patent/CN204280353U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150422 Termination date: 20151119 |
|
| EXPY | Termination of patent right or utility model |