CN204272476U - A kind of electrode modified node method of plasma cleaning system - Google Patents
A kind of electrode modified node method of plasma cleaning system Download PDFInfo
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- CN204272476U CN204272476U CN201520011369.2U CN201520011369U CN204272476U CN 204272476 U CN204272476 U CN 204272476U CN 201520011369 U CN201520011369 U CN 201520011369U CN 204272476 U CN204272476 U CN 204272476U
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- electrode body
- plate electrode
- circulation line
- plasma cleaning
- cleaning system
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Abstract
The utility model discloses a kind of electrode modified node method of plasma cleaning system, comprise plate electrode body, plate electrode body has certain thickness, offers circulation line in plate electrode body inside, and plate electrode body is provided with the pipe joint be communicated with circulation line.The utility model adopts the electrode of tabular, its surface uniform is steady, uniform electric field can be formed in discharge process, avoid the problem occurring that portion electric field superposes, thoroughly solve the problem that the electric discharge of existing screen electrode existence is uneven, make the etching of product comparatively even, its inner circulation line arranged is used for the circulation of cooling water, thus lower the temperature, the opening of circulation line is provided with joint, is convenient to be connected with the cooling recirculation system of outside.
Description
Technical field
The utility model relates to the surface cleaning technology field of printing board PCB, specifically refers to a kind of electrode modified node method of plasma cleaning system.
Background technology
In printing board PCB industry, cleaning comprises any critical process relevant with removing pollutant, along with the development of microelectronic technique, traditional wet-cleaned is more and more limited to, new technological requirement has not been reached to the process of high thickness to diameter ratio plate, high frequency plate, hard and soft plate etc., and dry method cleaning can meet new requirement, and the environmental pollution avoiding wet-cleaned to bring, productivity ratio also improves greatly simultaneously, and plasma cleaning is exactly dry method cleaning technique that is convenient, efficient, high-quality.Plasma cleaning device (Plasma Cleaner) be also plasma cleaner, Surface Treatment with Plasma instrument, is a kind of brand-new high-tech technology, utilizes plasma to reach Conventional cleaning method and to be beyond one's reach effect.Plasma cleaning belongs to dry method cleaning, adopts gas chemistry method to remove material surface pollutant.Gas chemistry method mainly contains thermal oxidation method and plasma cleaning method etc., cleaning process is exactly that heat chemistry gas or plasma state reacting gas are imported reative cell, and reacting gas and the pcb board surface that need process chemical reaction occur and generate effumability product and pumped by vacuum.Plasma cleaning principle is different from ultrasonic wave principle, when in the body of cabin close to vacuum state time, open plasma generation power supply, at this moment gas molecule ionization, produces plasma, and with glow discharge phenomenon, plasma accelerates under the electric field, thus under electric field action high-speed motion, to body surface generation physical impacts, isoionic energy is enough to remove various pollutant, and simultaneously organic pollution can be oxidized to carbon dioxide and steam to discharge vacuum chamber external by oxonium ion.Plasma cleaning does not need other raw material, as long as air just can meet the demands, easy to use and not do not pollute, the advantage simultaneously had more than Ultrasonic Cleaning is that plasma not only can carry out surface clean, the more important thing is and can improve surface activity, plasma and body surface carry out chemical reaction can produce active chemical group, these chemical groups have very high activity, thus be of wide application, such as improve material surface cementability, improve Weldability, nation is qualitative, the a lot of aspect of hydrophily etc., therefore plasma cleaning has become the main trend of cleaning industry.
Current PCB industry starts the plasma cleaning system many employings gate-shaped electrode applied, certain problem is also there is: uneven between ion plasma during energising in cleaning process, reacting gas also flows between grid, causes air-flow wayward, and final etch uniformity is poor.
Utility model content
The purpose of this utility model is the electrode modified node method providing a kind of plasma cleaning system, solves the problem of the etch uniformity difference that current plasma cleaning system exists, and improves the quality of product.
The purpose of this utility model is achieved through the following technical solutions:
An electrode modified node method for plasma cleaning system, comprises plate electrode body, and plate electrode body has certain thickness, offers circulation line in plate electrode body inside, and plate electrode body is provided with the pipe joint be communicated with circulation line.The utility model is the improvement that the electrode of article on plasma purging system is made, electrode structure general in prior art is gate-shaped electrode, employing pipeline welding processes, and mounting end pipeline is distinguished as connector in the two ends of screen, for the fixing and overall installation of pipeline, its pipeline is as coolant flow passages, its cooling effect is better, and gate-shaped electrode is welded primarily of the aluminum tubular conductor and splice combinations that can lead to refrigerant, and component count is many, processed complex, the long contact of weld seam is many; And the etch uniformity of pcb board product is not high under this battery lead plate working condition, through the research and analysis that applicant is long-term, obtain the reason of product etch uniformity difference: between the pipeline due to screen, there is certain gap, cause the uneven of discharge electric field.According to such theory, applicant have developed new electrode plate structure: the electrode adopting tabular, its surfacing is even, uniform electric field can be formed in discharge process, avoid the problem occurring that portion electric field superposes, thoroughly solve the problem that the electric discharge of existing gate-shaped electrode existence is uneven, the etch uniformity of pcb board product is obviously promoted, its inner circulation line arranged is used for the circulation of cooling water, the opening of circulation line is provided with joint, is convenient to be connected with the cooling recirculation system of outside.
Described circulation line comprises the plug being opened in inner orthogonal many horizontal pipelines of plate electrode body, pipe tunnel and being arranged on horizontal pipeline and/or pipe tunnel, and horizontal pipeline and pipe tunnel are connected to form circulating line by plug.For the ease of processing, utilize existing machining apparatus can carry out perforation processing to plate electrode body, form orthogonal two in the inside of plate electrode body and rent pipeline, be respectively horizontal pipeline and pipe tunnel, each group all comprises one or more pipeline, substantially be parallel to each other between pipeline, and be interconnected between two rent pipelines, by installing plug in pipeline, local pipe is carried out shutoff, the pipe plugging be interconnected is formed unidirectional circulating line, so, according to the position that the number of tubes arranged and turnover are taken over, the circulation line of different length can be formed.
The diameter of described horizontal pipeline, pipe tunnel is 60 ~ 80% of plate electrode body thickness.Through experiment repeatedly and analysis, applicant finds that the diameter of horizontal pipeline, pipe tunnel can affect the uniformity of Electrode Field, have found comparatively suitable diameter and thickness proportion in numerous possibilities, meets cooling simultaneously and requires the requirement with the uniformity.
Described pipe joint is welding point.Ensure that the sealing of pipeline and the connection of circulation line, facilitate the installation of battery lead plate, and be convenient to dismounting, easily change and maintenance.
The utility model compared with prior art, has following advantage and beneficial effect:
The electrode modified node method of a kind of plasma cleaning system of 1 the utility model, adopt the electrode of tabular, its surface uniform is steady, uniform electric field can be formed in discharge process, avoid the problem occurring that portion electric field superposes, thoroughly solve the problem that the electric discharge of existing screen electrode existence is uneven, make the etching of product comparatively even, its inner circulation line arranged is used for the circulation of cooling water, thus lower the temperature, the opening of circulation line is provided with joint, is convenient to be connected with the cooling recirculation system of outside;
The electrode modified node method of a kind of plasma cleaning system of 2 the utility model, form orthogonal two in the inside of plate electrode body and rent pipeline, be respectively horizontal pipeline and pipe tunnel, each group all comprises one or more pipeline, substantially be parallel to each other between pipeline, and be interconnected between two groups of pipelines, by installing plug in pipeline, local pipe is carried out shutoff, the pipe plugging be interconnected is formed unidirectional circulating line, so, according to the position that the number of tubes arranged and turnover are taken over, the circulation line of different length can be formed.
Accompanying drawing explanation
Accompanying drawing described herein is used to provide the further understanding to the utility model embodiment, forms a application's part, does not form the restriction to the utility model embodiment.In the accompanying drawings:
Fig. 1 is that the utility model partly cuts open structural representation.
Mark and corresponding parts title in accompanying drawing:
1-plate electrode body, 2-pipe joint, 3-horizontal pipeline, 4-pipe tunnel, 5-plug.
Embodiment
Clearly understand for making the purpose of this utility model, technical scheme and advantage, below in conjunction with embodiment and accompanying drawing, the utility model is described in further detail, exemplary embodiment of the present utility model and explanation thereof are only for explaining the utility model, and conduct is not to restriction of the present utility model.
Embodiment
As shown in Figure 1, the electrode modified node method of a kind of plasma cleaning system of the utility model, comprise plate electrode body 1, plate electrode body 1 is long is 180cm, wide 150cm, thickness is 2cm, two horizontal pipelines be parallel to each other 3 are offered in plate electrode body 1 inside, four pipe tunnels 4 vertical with horizontal pipeline 3, article four, pipe tunnel 4 and two horizontal pipelines 3 are interconnected, pipe tunnel 4 and horizontal pipeline 3 form 12 openings in the side of plate electrode body 1, to wherein seal by 10 opening plugs 5 in position, then at the inner utilization plug 5 of plate electrode body 1, horizontal pipeline 3 and/or pipe tunnel 4 are split, form unidirectional circulation passage as circulating line, according to the need of production of reality, the form of circulating line and flow direction can change combination, the quantity of horizontal pipeline 3 and pipe tunnel 4, spacing can be changed, the diameter of horizontal pipeline 3 and pipe tunnel 4 is at 3 ~ 4cm, two openings are remained for welding point as pipe joint 2 in the side of plate electrode body 1, as the connecting interface of its inner loop pipeline and external circulating system.
Above-described embodiment; the purpose of this utility model, technical scheme and beneficial effect are further described; be understood that; the foregoing is only embodiment of the present utility model; and be not used in restriction protection range of the present utility model; all within spirit of the present utility model and principle, any amendment made, equivalent replacement, improvement etc., all should be included within protection range of the present utility model.
Claims (4)
1. the electrode modified node method of a plasma cleaning system, it is characterized in that: comprise plate electrode body (1), plate electrode body (1) has certain thickness, offer circulation line in plate electrode body (1) inside, plate electrode body (1) is provided with the pipe joint (2) be communicated with circulation line.
2. the electrode modified node method of a kind of plasma cleaning system according to claim 1, it is characterized in that: described circulation line comprises the plug (5) being opened in inner orthogonal many horizontal pipelines (3) of plate electrode body (1), pipe tunnel (4) and being arranged on horizontal pipeline (3) and/or pipe tunnel (4), and horizontal pipeline (3) and pipe tunnel (4) are connected to form circulating line by plug (5).
3. the electrode modified node method of a kind of plasma cleaning system according to claim 2, is characterized in that: the diameter of described horizontal pipeline (3), pipe tunnel (4) is 60 ~ 80% of plate electrode body (1) thickness.
4. the electrode modified node method of a kind of plasma cleaning system as claimed in any of claims 1 to 3, is characterized in that: described pipe joint (2) is welding point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520011369.2U CN204272476U (en) | 2015-01-08 | 2015-01-08 | A kind of electrode modified node method of plasma cleaning system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520011369.2U CN204272476U (en) | 2015-01-08 | 2015-01-08 | A kind of electrode modified node method of plasma cleaning system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204272476U true CN204272476U (en) | 2015-04-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520011369.2U Expired - Fee Related CN204272476U (en) | 2015-01-08 | 2015-01-08 | A kind of electrode modified node method of plasma cleaning system |
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| CN (1) | CN204272476U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106373868A (en) * | 2016-10-10 | 2017-02-01 | 昆山龙腾光电有限公司 | Fabrication method of array substrate |
-
2015
- 2015-01-08 CN CN201520011369.2U patent/CN204272476U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106373868A (en) * | 2016-10-10 | 2017-02-01 | 昆山龙腾光电有限公司 | Fabrication method of array substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150415 Termination date: 20180108 |