CN204268135U - LED lighting device - Google Patents
LED lighting device Download PDFInfo
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- CN204268135U CN204268135U CN201420677525.4U CN201420677525U CN204268135U CN 204268135 U CN204268135 U CN 204268135U CN 201420677525 U CN201420677525 U CN 201420677525U CN 204268135 U CN204268135 U CN 204268135U
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- light
- guide plate
- led
- light guide
- incident end
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
LED light device (10) comprising: apparatus main body (20); Be contained in the LED luminescence unit (30) in apparatus main body; With supported by apparatus main body and be provided with the light guide plate (50) of light-incident end (53).LED luminescence unit is configured to towards light-incident end.LED luminescence unit comprises: the substrate (33) that LED chip (32) is mounted thereto; Be configured to keep substrate and the retainer (31) supported by apparatus main body; With give prominence to from retainer and comprise the protuberance (34) of coated surface (343), coated surface is parallel to the plane orthogonal with light-incident end and extending longitudinally along substrate.Protuberance has outstanding with the front end (346) being at least arranged in the position in the plane identical with light-incident end.For this reason, the coated surface contact light guide plate of protuberance.This makes protuberance can support light guide plate and damage its nothing.The relative position of luminescence unit and light-incident end can maintain normal position for a long time.The LED light device that can reduce light loss can be provided.
Description
Technical field
The utility model relates to a kind of LED that utilizes as the LED light device of light source also by using light guide plate to perform illumination.
Background technology
Routinely, known a kind of utilize multiple LED as light source and irradiate light by light guide plate perform the LED light device (such as, see No. 2012-84316, Japanese Unexamined Patent Application Publication (Fig. 2 and 5)) of illumination.
As shown in Figure 10, disclosed in No. 2012-84316, Japanese Unexamined Patent Application Publication, LED light device 100 comprises: device body 101; Adapter 102, it is by electricity and be mechanically connected to the ceiling socket be arranged on as on the ceiling surface of device surfaces for attachment; With infrared remote-control emitter 103.
Device body 101 comprises lamp device 104, reflecting plate 105, base 106, light source cell 107, light guide plate 108, main body frame 109, central cover element 110 and lampshade 111.
Light source cell 107 comprises multiple substrate 113, and the multiple light-emitting components 112 as light source are installed to described substrate.Substrate 113 is attached to the inner surface of the attachment plate 114 be arranged in outside substrate 113.
Light guide plate 108 forms polygon even shape.In order to diffused light, the rear surface of light guide plate 108 forms tiny V-shaped groove by laser.Circular open is formed in the basic central part of light guide plate 108.
The peripheral part of light guide plate 108 is used as light-incident end 108A, is incident on light-incident end 108A from the light of light-emitting component 112 outgoing to advance in light guide plate 108.Light guide plate 108 comprises light exit surface, has the light exit area of plane at the front-surface side place of described light exit surface.Be incident on central cover element 110 from the light of the inner periphery end face outgoing of the circular open 115 of light guide plate 108, thus cause central cover element 110 shinny.
To be spread by lampshade 111 from the light of light guide plate 108 and the outgoing of central cover element 110 and irradiate predetermined scope.
Utilizing multiple light-emitting component as light source and being irradiated by light guide plate in the LED light device of light, the light-incident end of light source cell and light guide plate must be made facing with each other.If the light-incident end of light source cell and light guide plate is taken to and contacts with each other or closely close, there is the worry of bend of light conducting plate.
For this reason, need to arrange light-emitting component 112 and light-incident end with the relation of space interval.Further, the relative position of light-emitting component 112 and light-incident end needs to maintain normal position.
As shown in figure 11, in LED light device 100 disclosed in Japanese Unexamined Patent Application Publication 2012-84316, diapire 116 supports the peripheral end of light guide plate 108 and covers light source cell 107.
But, because diapire 116 is the elements be separated with the attachment plate 114 of supporting substrate 113, so due to the dimensional tolerance of various piece or build-up tolerance, over time etc., the relative position of light-emitting component 112 and light-incident end 108A can not maintain normal position for a long time.
And the bottom of the cross section of attachment plate 114 is with sharp bend and contact the lower surface of light guide plate 108.In other words, the bottom of the cross section of attachment plate 114 is not parallel to the lower surface of light guide plate 108.For this reason, the light be not incident on light-incident end 108A does not enter the lower surface of light guide plate 108.Therefore, light loss is large.
In addition, the front end 114A of the bottom of the cross section of attachment plate 114 locates the lower surface supporting light guide plate 108 on one point.This causes the lower surface of light guide plate 108 can vitiable problem.
Utility model content
In view of the above problems, the utility model provides a kind of LED light device, and it without damage can support light guide plate, the relative position of luminescence unit and light-incident end is maintained normal position for a long time and reduces light loss.
According to an aspect of the present utility model, provide a kind of LED light device, it comprises: device body; LED luminescence unit, it is contained in device body; And light guide plate, it is supported by device body and is provided with light-incident end, and LED luminescence unit is configured to towards light-incident end, and wherein said LED luminescence unit comprises: substrate, and LED chip is installed on the substrate; Retainer, it is configured to keep described substrate and described retainer is supported by device body; And protuberance, it protrudes from retainer and comprises coated surface, and described coated surface is parallel to the plane orthogonal with the light-incident end of light guide plate and longitudinal direction along substrate extends; And wherein said protuberance has front end, described front end is protruded thus the position be at least arranged in the plane identical with light-incident end.
When installing LED matrix, protuberance can be arranged under light guide plate.
When installing LED matrix, protuberance can be arranged on light guide plate.
Coated surface can comprise the reflecting layer be formed thereon.
LED luminescence unit can be provided with the jut towards light-incident end.Described jut can in height be greater than described LED chip.
According to the utility model, the protuberance protruded from retainer is arranged on and is configured to keep described substrate and the retainer supported by device body.Protuberance comprises coated surface, and it is parallel to the plane orthogonal with the light-incident end of light guide plate and longitudinal direction along substrate extends continuously.Protuberance has front end, and described front end is protruded thus the position be arranged at least identical with light-incident end plane.For this reason, the coated surface contact light guide plate of protuberance.This makes protuberance can support described light guide plate and not cause the damage of described light guide plate.Therefore, the relative position of LED luminescence unit and light-incident end can maintain regular position for a long time.Therefore, it is possible to provide a kind of LED light device that can reduce light loss.
Accompanying drawing explanation
Accompanying drawing describes the one or more embodiments according to this instruction by means of only the mode of example instead of the mode of limitation.In the accompanying drawings, identical Reference numeral represents same or analogous element.
Fig. 1 is the bottom side perspective view that the state being wherein attached to ceiling surface according to the LED light device of embodiment of the present utility model is shown.
Fig. 2 is the top side stereogram of the LED light device according to this embodiment of the present utility model.
Fig. 3 is the partial cross-sectional perspective view of the major part of the LED light device illustrated according to this embodiment of the present utility model.
Fig. 4 is the sectional view of the major part of the LED light device illustrated according to this embodiment of the present utility model.
Fig. 5 illustrates wherein to go up the bottom side perspective view that retainer is attached to the state of device body.
Fig. 6 A illustrates that the substrate being wherein loaded with the LED chip be installed on it is installed to the stereogram of the state of retainer and Fig. 6 B illustrates that substrate is not attached to the stereogram of the upper retainer on it.
The stereogram of Fig. 7 A to be the stereogram of the substrate being loaded with the LED chip be installed on it and Fig. 7 B be heat sink.
Fig. 8 is the bottom side perspective view that light guide plate is shown.
Fig. 9 is the view of corresponding diagram 4, and it illustrates the situation that the front end of protuberance is concordant with light-incident end.
Figure 10 is the exploded perspective view of conventional LED light device.
Figure 11 is the sectional view of the major part of conventional LED light device.
Detailed description of the invention
Referring now to accompanying drawing, the LED light device according to an embodiment of the present utility model is described.
As shown in Figure 1, be attached to such as ceiling surface 11 according to the LED light device 10 of an embodiment, and the described LED light device 10 that can be used to mainly to throw light on to downside.
In the following description, when LED light device 10A is attached to ceiling surface 11, that side of ceiling surface 11 will be called as " on ".That side (namely floor side) contrary with ceiling surface 11 will be called as D score.
First, the unitary construction of LED light device 10 will be described briefly.
As depicted in figs. 1 and 2, LED light device 10 comprises the device body 20 being attached to ceiling surface 11.
Upper light guide plate (light guide plate) 50 is arranged under device body 20.The opaque white upper cover 51 with reflection characteristic to be arranged under light guide plate 50 and to be attached to device body 20, and the downside covering on light guide plate 50 on wherein said supports upper light guide plate 50.
In the downside of upper cover 51, lower light guide plate (light guide plate) 60 is arranged with the relation parallel with upper light guide plate 50.The opaque white lower cover (cover) 61 with reflection characteristic is arranged under lower light guide plate 60, and the downside covering on lower light guide plate 60 under wherein said supports lower light guide plate 60.
Lower cover 61 has the shape of annular.The center lens 70 of annular is arranged on inside lower cover 61 and extends with the inner circumferential along lower cover 61.Central authorities' cover 71 of annular is arranged on inside center lens 70.Pan-shaped cover 72 is removably attached to the inner side of central authorities' cover 71.
Present all parts part will be described.
As shown in Figures 2 and 3, device body 20 is such as made up of metals such as aluminium and is formed the global shape of plate-like.The centre of apparatus main body 20 be formed for be attached adapter 22 opening 21, described attachment adapter 22 is attached to ceiling socket (not shown), and described ceiling socket is fixed to ceiling surface 11.
Device body 20 is bent obliquely with from the peripheral end of central planar portion 23 downwards and stretch out.Sidewall 24 is formed in device body 20.The bottom of sidewall 24 is bent outwardly to form horizontal part 25.
Sidewall 24 is with following upper LED luminescence unit 30 correspondence setting and the hexagonal shape be formed as such as when observing in plan view.The front end (i.e. outermost edge 251) of horizontal part 25 is fillets.Multiple (such as three) flexible member 26 is attached to par 23.
Therefore, by removing lid 72 (see Fig. 1) and attachment adapter 22 being attached to ceiling socket, attachment adapter 22 is electric and be mechanically connected to ceiling socket, and device body 20 is attached to ceiling surface 11.Now, flexible member 26 is flexibly out of shape between device body 20 and ceiling surface 11, thus prevents any shake of device body 20.
As shown in Figures 3 and 4, upper LED luminescence unit (LED luminescence unit) 30 is arranged on inside device body 20.Upper LED luminescence unit 30 comprises and being arranged on inside device body 20 to contact the upper retainer (retainer) 31 of the lower surface of par 23.In this embodiment, six upper retainers 31 are provided as shape (hexagon) (see Fig. 5) of meeting sidewall 24.
As shown in Fig. 4, Fig. 6 A and Fig. 6 B, upper retainer 31 has the global shape of rectangular planar.In the upper end of the outer surface 311 of upper retainer 31, provide the outside backboard 312 spaced a predetermined distance with outer surface 311.Be inserted at the substrate 33 described afterwards and heat sink 35 in the gap between outer surface 311 and backboard 312.
Outwardly jut 313 is provided at longitudinal opposite ends place of outer surface 311.As described below, when the substrate 33 being loaded with the LED chip 32 be arranged on substrate is attached to upper retainer 31, jut 313 projects outward beyond LED chip 32.
With outwardly on the outer surface 311 that protuberance 34 is provided at retainer 31.
Protuberance 34 comprises: support portion 341, and it upwards extends from the lower end of the outer surface 311 of upper retainer 31 with the relation spaced and parallel with outer surface 311; With acceptance division 342, it has L shape shape of cross section and is arranged on the top end of support portion 341.
Be inserted at the substrate 33 described afterwards and heat sink 35 in the gap between outer surface 311 and support portion 341.
Acceptance division 342 is strengthened by multiple rib 344.The upper surface of acceptance division 342 is formed by coated surperficial 343.Coated surperficial 343 reflecting surfaces that can be provided with reverberation.Reflecting surface can be coated with white with the reflectivity with 75% or higher.
Gap 345 is limited between the outer surface 311 of acceptance division 342 and upper retainer 31.
The substrate 33 being loaded with the LED chip 32 be installed on substrate is attached to the outer surface 311 of retainer 31 to make LED chip 32 towards outward.
As shown in Figure 7 A, substrate 33 has the shape being essentially rectangular slab.Multiple LED chip 32 is installed to width (vertical direction) central portion of mounting surface 331 in a linear fashion along the longitudinal direction of substrate 33.In longitudinal opposite ends of substrate 33, be provided with for receiving electric power or the connector 332 for being electrically connected with adjacent substrate 33 from power supply (not shown).
As shown in Figure 4, heat sink 35 is attached to the rear surface 333 contrary with mounting surface 331 of substrate 33.The outer surface 351 of heat sink 35 contacts face-to-face with the rear surface 333 of substrate 33.
As shown in Figure 7 B, heat sink 35 is formed as the shape of substantial rectangular plate by metallic plate.Substantially the projection 352 of U-shaped is provided at longitudinal opposite ends and the bottom of heat sink 35.Projection 352 is provided to projecting inward.The outer surface 351 of heat sink 35 is substantially smooth.
Which ensure that the heat sink 35 not outer surface 311 of retainer 31 on close contact.
The upper end of heat sink 35 curves inwardly to form bend 353.
Substrate 33 is coupled in retainer 31 at the inner side place of the backboard 312 of upper retainer 31.The bottom of substrate 33 is inserted between the support portion 341 of protuberance 34 and the outer surface 311 of upper retainer 31.Then, heat sink 35 inserts along the rear surface 333 of substrate 33.
Now, the rear surface 333 close contact heat sink 35 of substrate 33.Therefore, heat sink 35 can be absorbed in the heat produced in LED chip 32.Because projection 352 contacts the outer surface 311 of upper retainer 31, heat sink 35 is retainer 31 on close contact not.This helps to strengthen heat radiation.
After upper retainer 31 assembles with device body 20, the lower surface (see Fig. 4) of the par 23 of the bend 353 contact device body 20 of heat sink 35.
Therefore, the heat being delivered to heat sink 35 by substrate 33 is delivered to device body 20 from bend 353.This help strengthens heat radiation further.
As shown in Figure 3, at the downside place of upper LED luminescence unit 30, upper cover 51 is attached to device body 20.Upper cover 51 comprises and is attached to device body 20 and the flatly inclined shore portion 512 that outwards and upwards extends of outward extending annular horizontal support portion 511 and the peripheral end from horizontal supporting portion 511.
The upper end 513 in inclined shore portion 512 is arranged the outermost peripheral 251 of the horizontal part 25 to correspond to device body 20.
As shown in Figures 3 and 4, upper light guide plate 50 is supported between device body 20 and upper cover 51.As shown in Figure 3, upper light guide plate 50 is provided to stretch out from device body 20.
As shown in Figure 8, upper light guide plate 50 has the global shape of plate-like.Upper light guide plate 50 is included in the hollow bulb 52 of its centre.Hollow bulb 52 is formed as hexagonal shape with the relation corresponding with upper retainer 31, and described upper retainer is supported by device body 20 and is set to form of hexagons.
To control Light distribation on the surface that rib or typographic(al) mark can be formed in light guide plate 50.
As shown in Figure 3, the lower surface of the horizontal part 25 of upper light guide plate 50 contact device body 20.And upper light guide plate 50 is supported by the upper end 513 in the inclined shore portion 512 of upper cover 51 on the downside of it.
As shown in Figures 3 and 4, the hollow bulb side end of upper light guide plate 50 is supported by the acceptance division 342 of protuberance 34 on the downside of it.The circumferential end faces of hollow bulb 52 becomes light-incident end 53 (see Fig. 8), and it is towards the LED chip 32 of substrate 33 being attached to upper retainer 31.Now, the jut 313 projecting outward beyond LED chip 32 of upper retainer 31 is towards light-incident end 53.
Coated surperficial 343 and upper light guide plate 50 of acceptance division 342 are substantially parallel each other.Gap can be arranged between coated surperficial 343 and upper light guide plate 50.But preferably, coated surperficial 343 contact with each other with upper light guide plate 50.In addition, LED chip 32 and light-incident end 53 are spaced preset distance (such as, 0.25mm to 1.00mm) and should contact each other with described light-incident end 53 to make described LED chip 32.
The front end of protuberance 34 is at least projected into the position in (hypothesis) plane identical with light-incident end 53 from upper retainer 31.That is, in this embodiment, the front end 346 of the acceptance division 342 of protuberance 34 extends to the optional position being present in light-incident end 53 opposition side (left side in Fig. 4) from the position the plane identical with light-incident end 53, thus light guide plate 50 on supporting on the downside of upper light guide plate 50.
It is only necessary that the front end of protuberance 34 is at least projected into the position in the plane identical with light-incident end 53.
As shown in figs. 1 and 3, at the downside place of upper cover 51, lower cover 61 is supported by device body 20.Lower light guide plate 60 is supported between upper cover 51 and lower cover 61.As shown in Figure 3, lower light guide plate 60 is provided to stretch out from device body 20.
Between the lower surface that lower light guide plate 60 is supported on the horizontal supporting portion 511 of upper cover 51 and the upper end 611 of lower cover 61.
Lower light guide plate 60 is less than light guide plate 50 dimensionally, but structurally identical with upper light guide plate 50.Therefore, the detailed description about lower light guide plate 60 will no longer be made.
As shown in Figure 3, lower LED luminescence unit (LED luminescence unit) 40 is arranged between upper cover 51 and lower cover 61.Lower LED luminescence unit 40 comprises lower retainer 41.
Lower retainer 41 is structurally identical with above-mentioned upper retainer 31.Therefore, the detailed description about lower retainer 41 will no longer be made.
The light-incident end 62 of lower light guide plate 60 is configured to towards LED chip 32, and described LED chip 32 is arranged on the substrate 33 that supported by lower retainer 41.Lower light guide plate 60 is supported by the protuberance 42 of lower retainer 41.
Will now describe the effect of LED light device 10.
LED light device 10 comprises: upper LED luminescence unit 30, and it is contained in device body 20; With upper light guide plate 50, it is supported by device body 20 and is configured to the exit direction that makes light-incident end 53 towards upper LED luminescence unit 30.
Upper LED luminescence unit 30 comprises: substrate 33, and it is loaded with the LED chip 32 be installed on described substrate 33; Upper retainer 31, it is configured to keep substrate 33 and supported by device body 20; With protuberance 34, it protrudes from upper retainer 31.
Therefore, incide upper light guide plate 50 from the light of LED chip 32 outgoing from light-incident end 53.Light from upper light guide plate 50 downwardly towards upper outgoing, mainly throw light on downside.
Protuberance 34 comprises: coated surperficial 343, and it is parallel to the plane (suppose plane) orthogonal with the light-incident end 53 of upper light guide plate 50, and extends along the longitudinal direction of substrate 33.And the front end 346 of protuberance 34 is arranged between the optional position in the outside of the plane concordant with light-incident end 53 and light-incident end 53.
Because the upper light guide plate 50 of coated surperficial 343 contact of protuberance 34, so protuberance 34 can support light guide plate 50 and not cause the damage to upper light guide plate 50.Therefore, upper LED luminescence unit 30 can maintain normal position for a long time with the relative position of light-incident end 53.Therefore, it is possible to minimizing light loss.
When lower LED luminescence unit 40, effect same as described above can be obtained.
In LED light device 10, when installing LED light device 10, protuberance 34 is arranged on the lower face side of light guide plate 50.Therefore, when LED light device 10 is in turn assembled from downside, protuberance 34 can support light guide plate 50.This contributes to the easiness improving assembling.
When lower LED luminescence unit 40, effect same as described above can be obtained.
In LED light device 10, reflecting layer is formed on coated surperficial 343 of protuberance 34.
For this reason, from LED chip 32 outgoing but the light do not incided light-incident end 53 or caused entering upper light guide plate 50 by reflective layer reflects once the light that enters light-incident end 53 outwards outgoing immediately.This can reduce light loss.
When lower LED luminescence unit 40, effect same as described above can be obtained.
In LED light device 10, the upper retainer 31 of upper LED luminescence unit 30 is provided with jut 313, and described jut 313 is in height greater than LED chip 32 and towards light-incident end 53.
Therefore, when LED chip 32 is towards light-incident end 53, jut 313 is also towards light-incident end 53.Because jut 313 contacts light-incident end 53, so can prevent LED chip 32 from contacting light-incident end 53 and protect LED chip 32.
When lower LED luminescence unit 40, effect same as described above can be obtained.
LED light device is not limited to above-described embodiment but can suitably changes or revise.
In the following description, upper light guide plate 50 and lower light guide plate 60 will be called as light guide plate 50 or 60.And upper LED luminescence unit 30 and lower LED luminescence unit 40 will be called as LED luminescence unit 30 or 40.
Such as, in the aforementioned embodiment, illustrated that light guide plate 50 or 60 is formed the situation of annular, hexagon hollow bulb 52 is formed in the centre of light guide plate 50 or 60, and the peripheral surface of hollow bulb 52 is used as light-incident end 53.
In LED light device of the present utility model, LED luminescence unit 30 or 40 can be arranged on the outside of light guide plate 50 or 60, and light-incident end can be formed in light guide plate 50 or 60 outer surface on to make light irradiate towards the center of light guide plate 50 or 60.In addition, for light guide plate, can use and be connected that there are the multiple light guide plates with above-mentioned annular light guide plate same shape.
In the aforementioned embodiment, the acceptance division 342 having shown protuberance 34 extends to the optional position in the outside of light-incident end 53 and the situation overlapping with light guide plate 50 or 60 from the plane identical with light-incident end 53.
The utility model is not limited to this.As shown in Figure 9, the front end 346 of protuberance 34 can be concordant with the light-incident end 53 or 62 of light guide plate 50 or 60.
In the aforementioned embodiment, show protuberance 34 and be arranged on situation under light guide plate 50 or 60.
In LED light device 10 of the present utility model, when installing LED light device 10, protuberance 34 can be arranged on the upper surface side place of light guide plate 50 or 60.
This makes it possible to limit incident end face sidepiece of light guide plate 50 or 60 and moves upward, and prevents the periphery of light guide plate 50 or 60 sagging and be deformed into taper under the deadweight of light guide plate.
Although be described previously imputed optimal mode and/or other examples, it will be appreciated that, various variant can be made wherein and main body disclosed herein can be implemented by various forms and example, and various variant goes for multiple application, the only part in these variants is open in this article.Following claims are intended to protect and fall into any and all modifications in this instruction true scope and variant.
Claims (5)
1. a LED light device, is characterized in that, it comprises:
Device body;
LED luminescence unit, it is accommodated in described device body; With
Light guide plate, it is supported by described device body and is provided with light-incident end, and described LED luminescence unit is configured to towards described light-incident end,
Wherein said LED luminescence unit comprises: the substrate that LED chip is mounted thereto; Retainer, it is configured to keep described substrate and is supported by described device body; And protuberance, it protrudes from described retainer and comprises coated surface, and described coated surface is parallel to the plane orthogonal with the described light-incident end of described light guide plate and longitudinal direction along described substrate extends; And
Wherein said protuberance has front end, and described front end gives prominence at least to be arranged in the position in the plane identical with described light-incident end.
2. LED light device according to claim 1, is characterized in that, when installing described LED light device, described protuberance is arranged under described light guide plate.
3. LED light device according to claim 1, is characterized in that, when installing described LED light device, described protuberance is arranged on described light guide plate.
4. LED light device according to claim 1, is characterized in that, described coated surface comprises the reflecting layer be formed thereon.
5. LED light device according to claim 1, is characterized in that, described LED luminescence unit is provided with the jut towards described light-incident end, and described jut is in height greater than described LED chip.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-234731 | 2013-11-13 | ||
| JP2013234731A JP6238164B2 (en) | 2013-11-13 | 2013-11-13 | LED lighting fixtures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204268135U true CN204268135U (en) | 2015-04-15 |
Family
ID=52802999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420677525.4U Expired - Fee Related CN204268135U (en) | 2013-11-13 | 2014-11-13 | LED lighting device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6238164B2 (en) |
| CN (1) | CN204268135U (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6544683B2 (en) * | 2015-05-19 | 2019-07-17 | パナソニックＩｐマネジメント株式会社 | lighting equipment |
| JP7122539B2 (en) * | 2018-04-26 | 2022-08-22 | パナソニックＩｐマネジメント株式会社 | lighting equipment |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120293715A1 (en) * | 2010-01-07 | 2012-11-22 | Sharp Kabushiki Kaisha | Lighting device, display device and television receiver |
| JP2012084316A (en) * | 2010-10-08 | 2012-04-26 | Toshiba Lighting & Technology Corp | Lighting fixture |
-
2013
- 2013-11-13 JP JP2013234731A patent/JP6238164B2/en active Active
-
2014
- 2014-11-13 CN CN201420677525.4U patent/CN204268135U/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015095389A (en) | 2015-05-18 |
| JP6238164B2 (en) | 2017-11-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150415 Termination date: 20171113 |
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| CF01 | Termination of patent right due to non-payment of annual fee |