CN204259145U - The diaphragm structure of sound-producing device - Google Patents
The diaphragm structure of sound-producing device Download PDFInfo
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- CN204259145U CN204259145U CN201420618408.0U CN201420618408U CN204259145U CN 204259145 U CN204259145 U CN 204259145U CN 201420618408 U CN201420618408 U CN 201420618408U CN 204259145 U CN204259145 U CN 204259145U
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Abstract
The utility model provides a kind of diaphragm structure of sound-producing device, and it comprises: a thin layer, one first circuit film layer, is fixed on the first side of thin layer through one first electrolysis knitting layer; One second circuit thin layer, is fixed on the second side of thin layer through one second electrolysis knitting layer; Multiple perforation, penetrates the first circuit film layer, thin layer and second circuit thin layer; And multiple conductive layer, be arranged on the internal perisporium of boring a hole described in each, to contact with this first circuit film layer and this second circuit thin layer.Diaphragm structure of the present utility model replaces traditional gum that circuit film layer is fixed on the both sides of thin layer by the mode that electrolysis engages, and makes the thickness of diaphragm structure decline to a great extent by this.
Description
Technical field
The utility model, about a kind of diaphragm structure, engages especially in regard to utilizing electrolysis and is fixed on the film of vibrating diaphragm by wire coil, significantly reduce the diaphragm structure of the thickness of sound-producing device monomer by this.
Background technology
Different according to the principle of structure and sounding, the kind of sound-producing device can be divided into the numerous species such as moving-coil type loudspeaker, piezoelectric loudspeaker, piezoelectric ceramics loudspeaker and paper loudspeaker, wherein, is the most commonly traditional moving-coil type loudspeaker.The structure of moving-coil type loudspeaker, after forming a voice coil loudspeaker voice coil, then is placed in the side of magnet, to form the monomer of moving-coil type loudspeaker after mainly an enameled wire loop being wound in the outside of round tubing string behind side one end of voice coil loudspeaker voice coil being glued at a vibrating diaphragm.When utilizing this kind of monomer sounding, making corresponding tone currents by enameled wire loop, making the magnetic field permeates electromagnetic induction of coil change and drive diaphragm oscillations, by this vibrate air and sounding.Moving-coil type horn single body has the good advantage of the audio of medium and low frequency, but, because its volume is comparatively large, moving-coil type loudspeaker among the device not being suitable for small size, in addition, due to moving-coil type loudspeaker monomer thickness comparatively after, the performance of its high frequency is also poor.
In more existing monomer structures, voice coil loudspeaker voice coil is mostly be fixed on film in the mode of gum.Because gum available in current industry all has certain thickness, therefore, this kind of fixed form can make the thickness of monomer entirety become thicker, and then causes as the monomer of the sound-producing devices such as earphone and the size of earphone entirety cannot diminish; In addition, when needing the sensitivity increasing sound-producing device, in general the magnetic density of monomer can be increased through the quantity increasing coil, but, because the monomer thickness after tradition uses the fixed form of gum that coil quantity can be made to increase becomes blocked up, thus restriction is caused to the design of sound-producing device and earphone.
Utility model content
For the foregoing reasons, the purpose of this utility model is to provide a kind of diaphragm structure, and it utilizes electrolysis to engage to replace mode of gum to be fixed on by wire coil on film to form the vibrating diaphragm of sound-producing device, significantly reduces the thickness of vibrating diaphragm by this.
Another object of the present utility model is to provide a kind of diaphragm structure, and it utilizes electrolysis juncture that multiple wire coil and multiple film are replaced superposition and fixes, and makes diaphragm structure can have larger magnetic flux under the constant condition of thickness.
For reaching aforementioned object, the utility model provides a kind of diaphragm structure, and it comprises: a thin layer, one first circuit film layer, a second circuit thin layer and at least one conductive structure.Described thin layer has one first side and one second side.Described first circuit film layer is fixed on the first side of thin layer through one first electrolysis knitting layer, and its one end has one first contact terminal.Described second circuit thin layer is fixed on the second side of thin layer through one second electrolysis knitting layer, and its one end has one second contact terminal.Described at least one conductive structure penetrates thin layer and connects the first circuit film layer and second circuit thin layer.
According to one embodiment of the invention, described conductive structure comprises a perforation and a conductive layer.Described perforation passes from an outer surface of the first circuit film layer the outer surface that thin layer penetrates into second circuit thin layer.Described conductive layer is arranged on an internal perisporium of perforation, and conductive layer contacts with the first circuit film layer and second circuit thin layer simultaneously.
In addition, the utility model provides another kind of diaphragm structure, and it comprises: a thin layer, one first circuit film layer, at least one layer that coincides, a second circuit thin layer and multiple conductive structure.Described thin layer has one first side and one second side.Described first circuit film layer is fixed on the first side of thin layer through one first electrolysis knitting layer, and its one end has one first contact terminal.The each of described at least one layer that coincides comprises: a tertiary circuit thin layer and coincides thin layer.The described thin layer that coincides is fixed on tertiary circuit thin layer through the electrolysis knitting layer that coincides; Wherein, in this at least one layer that coincides, outermost tertiary circuit thin layer is fixed on the second side of thin layer through one the 3rd electrolysis knitting layer.Described second circuit thin layer is fixed on the outermost thin layer that coincides at least one layer that coincides through one second electrolysis knitting layer, and its one end has one second contact terminal.Wherein, in the first circuit film layer, second circuit thin layer and at least one tertiary circuit thin layer, every two adjacent circuit film layers are connected through at least one conductive structure.
According to an embodiment of the present utility model, each of described conductive structure comprises a perforation and a conductive layer.Described perforation in these two adjacent circuit film layers before coincide thin layer or this thin layer of this one circuit film layer adjacent through two penetrate into rear one in two adjacent circuit film layers.Described conductive layer is arranged on an internal perisporium of perforation, and the conductive layer circuit film layer adjacent with these two contacts.
According to an embodiment of the present utility model, described diaphragm structure comprises multiple cover part further, described cover part is arranged around perforation described in each on the outer surface of the first circuit film layer and the outer surface of second circuit thin layer, and described cover part contacts with each conductive layer in described perforation respectively.
According to an embodiment of the present utility model, described diaphragm structure comprises multiple layer that coincides, and every two coincide between layer and interfix through the electrolysis knitting layer that coincides.
Accompanying drawing explanation
Fig. 1 is the three-dimensional exploded view of display according to the diaphragm structure of the utility model first embodiment;
Fig. 2 is the side cutaway view of display according to the diaphragm structure of the utility model first embodiment;
Fig. 3 is the three-dimensional exploded view of display according to the diaphragm structure of the utility model second embodiment;
Fig. 4 is the side cutaway view of display according to the diaphragm structure of the utility model second embodiment;
Fig. 5 is the three-dimensional exploded view of display according to the diaphragm structure of the utility model the 3rd embodiment.
Wherein, description of reference numerals is as follows:
11 thin layers
111 first sides
112 second sides
12 coincide thin layer
21 first circuit film layers
211 first contact terminals
22 second circuit thin layers
221 second contact terminals
23 coincide layer
3 tertiary circuit thin layers
41 first electrolysis knitting layers
42 second electrolysis knitting layers
43 the 3rd electrolysis knitting layers
44 coincide electrolysis knitting layer
5,5a, 5b perforation
51 conductive layers
52 cover parts
110,210,220,30a, 30b hole
Embodiment
Below coordinate graphic and Reference numeral to do more detailed description to execution mode of the present utility model, those of ordinary skill in the art can be implemented according to this after studying this specification carefully.
Fig. 1 is the three-dimensional exploded view of display according to the diaphragm structure of the utility model first embodiment; Fig. 2 is the side cutaway view of display according to the diaphragm structure of the utility model second embodiment.As shown in Figure 1 and Figure 2, according to the diaphragm structure that the utility model first embodiment provides, mainly include thin layer 11,1 first circuit film layer 21, second circuit thin layer 22 and a conductive structure.
Described thin layer 11 has one first side 111 and one second side 112.In the utility model, adopt glue-free copper as the first described circuit film layer 21 and second circuit thin layer 22, and through the mode that electrolysis engages the first circuit film layer 21 and second circuit thin layer 22 be individually fixed in the both sides of thin layer 11, to form the vibrating diaphragm of the sound-producing devices such as such as earphone.As shown in Figure 2, first circuit film layer 21 has one first contact terminal 211 and one second contact terminal 221 respectively with second circuit thin layer 22, the mode that first circuit film layer 21 engages by electrolysis is fixed on the first side 111 of thin layer 11 through the first electrolysis knitting layer 41, and the mode that second circuit thin layer 22 engages by electrolysis is fixed on the second side 112 of thin layer 11 through the second electrolysis knitting layer 42.It is worth mentioning that at this, conveniently identification, the thickness of each electrolysis knitting layer is not according to the scale of reality, and the ratio shown in Thickness Ratio figure of actual electrolysis knitting layer is thinner.In addition the material of circuit film layer is not limited to glue-free copper, any other can conduct electricity and can pass through electrolysis engage the mode material be fixed on thin layer be all suitable material.
Thin layer 11, first circuit film layer 21 and second circuit thin layer 22 are formed with corresponding multiple holes 110,210,220 respectively, when making the first circuit film layer 21 and second circuit thin layer 22 be fixed on the both sides of thin layer 11, the perforation 5 penetrating vibrating diaphragm can be formed.As shown in Figure 1, due to thin layer 11, first circuit film layer 21 and second circuit thin layer 22 being formed with four holes respectively, therefore, the vibrating diaphragm in the utility model has four perforation 5 altogether.Due to when sounding, through electric current, the first circuit film layer 21 and second circuit thin layer 22 need be conducted electricity, make its magnetic field change by this and drive thin layer 11 vibrate air sounding, therefore, respectively to select the mode of plating to be coated with one deck conductive layer 51, the first circuit film layer 21 and second circuit thin layer 22 to be electrically connected to each other on the internal perisporium of described perforation 5.As shown in Figure 2, on the outer surface of the first circuit film layer 21 and the outer surface of second circuit thin layer 22, the periphery of each perforation 5 is all formed with a cover part 52, and described cover part 52 all contacts with each conductive layer 51, to guarantee the electric connection between the first circuit film layer 21 and second circuit thin layer 22 further.
The diaphragm structure provided in the utility model first embodiment, the first circuit film layer 21 that glue-free copper forms by the mode utilizing electrolysis to engage and second circuit thin layer 22 are fixed on the both sides of thin layer 11, and utilize the mode of choosing plating to form conductive layer 51 in perforation 5, make the thickness of diaphragm structure entirety be able to by this significantly thinning; More accurately, compared to existing gum mode wire coil is fixed on the vibrating diaphragm on film, the thickness of vibrating diaphragm can be dropped to 4 μm from 8.75 μm by diaphragm structure provided by the utility model.Thus, the chi of the monomer of sound-producing device and sound-producing device itself can be made to deposit and significantly reduce, also therefore, diaphragm structure provided by the utility model is applicable to being applied to as in the undersized sound-producing devices such as earphone very much.
The sensitivity of magnetic flux to earphone of earphone has a great impact, and has the earphone of higher magnetic flux, sound that can be larger through less power production.Under the condition of the area of plane not increasing earphone diaphragm, in general increase the magnetic flux of vibrating diaphragm through the mode of superposition wire coil quantity, according to the fixed form of existing gum, the thickness of vibrating diaphragm entirety can be caused blocked up; Therefore, second and third embodiment of the present utility model just proposes another kind of diaphragm structure for the problems referred to above.
Fig. 3 is the three-dimensional exploded view of display according to the diaphragm structure of the utility model second embodiment, and Fig. 4 is the side cutaway view of display according to the diaphragm structure of the utility model second embodiment.As shown in Figures 3 and 4, similar according to the diaphragm structure in the diaphragm structure of the utility model second embodiment and the first embodiment, include thin layer 11,1 first circuit film layer 21 and a second circuit thin layer 22 equally, both difference places are mainly, the diaphragm structure in the second embodiment is provided with one further and coincides layer 23.
Similar with the first embodiment, thin layer 11 in second embodiment has one first side 111 and one second side 112, the first described circuit film layer 21 and second circuit thin layer 22 have one first contact terminal 211 and the second contact terminal 221 respectively and are made up of glue-free copper equally, and the mode that the first circuit film layer 21 is engaged by electrolysis is fixed on the first side 111 of thin layer 11 through the first electrolysis knitting layer 41.The layer 23 that coincides in second embodiment, is made up of a tertiary circuit thin layer 3 and one thin layer 12 that coincides, and the mode that tertiary circuit thin layer 3 is engaged by electrolysis is fixed on through the electrolysis knitting layer 44 that coincides and coincides on thin layer 12.The mode that the tertiary circuit thin layer 3 coinciding layer 23 is engaged by electrolysis is fixed on the second side 112 of thin layer 11 through the 3rd electrolysis knitting layer 43, to be then the mode that engaged by electrolysis be fixed on through the second electrolysis knitting layer 42 layer 23 that coincides to second circuit thin layer 22 coincides thin layer 12, as shown in Figure 4.
In diaphragm structure provided by the utility model, every two adjacent circuit film layers are connected through at least one conductive structure.More specifically, as shown in Figure 3, first circuit film layer 21, thin layer 11 and tertiary circuit thin layer 3 are respectively arranged with corresponding hole 210,110 and 30a, and tertiary circuit thin layer 3, coincide thin layer 12 and second circuit thin layer 22 are respectively arranged with corresponding hole 30b, 120 and 220.After diaphragm structure is fixing through above-mentioned mode, hole 210,110 and 30a can form perforation 5a, hole 30b, 120 and 220 can form perforation 5b, and all to select the mode of plating to be coated with one deck conductive layer 51 in described perforation 5a and described perforation 5b, as shown in Figure 4.First circuit film layer 21 is electrically connected with tertiary circuit thin layer 3 by the conductive layer 51 in perforation 5a, and tertiary circuit thin layer 3 and second circuit thin layer 22 are electrically connected by the conductive layer 51 of boring a hole in 5b, between the first contact terminal 211 and the second contact terminal 221, form a circuit by this.
In addition, with similar in the first embodiment, each perforation periphery of 5a on the outer surface of the first circuit film layer 21 and each periphery of boring a hole 5b on the outer surface of second circuit thin layer 22 are all formed with a cover part 52, and described cover part 52 all contacts with each conductive layer 51, to guarantee the electric connection between the first contact terminal 211 and the second contact terminal 221 further.
Through the diaphragm structure that the second embodiment provides, can when vibrating diaphragm integral thickness significantly can not be increased superposition wire coil to increase the magnetic flux of vibrating diaphragm, maintaining the small size of individual earphones and earphone by this and improve the sensitivity of earphone, providing designer more to select when designing earphone.
Diaphragm structure provided by the utility model, its quantity coinciding layer 23 is not limited to the single one deck in the second embodiment.Fig. 5 be display according to the three-dimensional exploded view of the diaphragm structure of the utility model the 3rd embodiment, as shown in Figure 5, the diaphragm structure in the 3rd embodiment is almost identical with the diaphragm structure in the second embodiment, and difference between the two is only to coincide the quantity of layer 23.
In the third embodiment, diaphragm structure has N number of layer 23 that coincides, and every two adjacent coincide between layer 23, adjacent tertiary circuit thin layer 3 and the thin layer 12 that coincides are interfixed (not being shown in Fig. 5) through the electrolysis knitting layer 44 that coincides by the mode engaged by electrolysis.In addition, what change mutually N number ofly coincides in layer 23, the mode that outermost tertiary circuit thin layer 3 is engaged by electrolysis is fixed on the second side 112 of thin layer 11 through the electrolysis knitting layer 44 that coincides, and the mode that the outermost thin layer 12 that coincides is engaged by electrolysis is fixed on second circuit thin layer 22 through the second electrolysis knitting layer 42.Among the first circuit film layer 21 of the diaphragm structure of the 3rd embodiment, second circuit thin layer 22 and all tertiary circuit thin layers 3, the front one in every two adjacent circuit film layers to be connected to the rear one in two adjacent circuit film layers through coincide thin layer or the thin layer two adjacent circuit film layers through conductive structure.Through above-mentioned configuration, designer can to coincide the quantity 23 of layer for the demand adjustment of magnetic flux according to earphone.
As seen from the above embodiment, value in the true tool industry of diaphragm structure provided by the utility model, above describing is only preferred embodiment explanation of the present utility model, those of ordinary skill in the art can do other all improvement according to above-mentioned explanation, these changes still belong in spirit of the present utility model and following defined the scope of the claims.
Claims (7)
1. a diaphragm structure for sound-producing device, is characterized in that, comprising:
One thin layer, has one first side and one second side;
One first circuit film layer, be fixed on this first side of this thin layer, and its one end has one first contact terminal through one first electrolysis knitting layer;
One second circuit thin layer, be fixed on this second side of this thin layer, and its one end has one second contact terminal through one second electrolysis knitting layer; And
At least one conductive structure, penetrates this thin layer and connects this first circuit film layer and this second circuit thin layer.
2. diaphragm structure according to claim 1, is characterized in that, this at least one conductive structure comprises:
One perforation, passes from an outer surface of this first circuit film layer the outer surface that this thin layer penetrates into this second circuit thin layer; And
One conductive layer, is arranged on an internal perisporium of this perforation, and this conductive layer contacts with this first circuit film layer and this second circuit thin layer simultaneously.
3. diaphragm structure according to claim 2, it is characterized in that, comprise multiple cover part further, described cover part is arranged around this perforation on an outer surface of this first circuit film layer and an outer surface of this second circuit thin layer, and described cover part contacts with this conductive layer in this perforation.
4. a diaphragm structure for sound-producing device, is characterized in that, comprising:
One thin layer, has one first side and one second side;
One first circuit film layer, be fixed on this first side of this thin layer, and its one end has one first contact terminal through one first electrolysis knitting layer;
At least one layer that coincides, each this layer that coincides comprises:
One tertiary circuit thin layer; And
One coincides thin layer, is fixed on this tertiary circuit thin layer through the electrolysis knitting layer that coincides;
Wherein, in this at least one layer that coincides, this tertiary circuit thin layer outermost is fixed on the second side of this thin layer through one the 3rd electrolysis knitting layer;
One second circuit thin layer, is fixed on outermost this in this at least one layer that coincides and coincides thin layer, and its one end has one second contact terminal through one second electrolysis knitting layer; And
Multiple conductive structure;
Wherein, in this first circuit film layer, this second circuit thin layer and this at least one tertiary circuit thin layer, every two adjacent circuit film layers are connected through at least one conductive structure.
5. diaphragm structure according to claim 4, is characterized in that, each of this conductive structure comprises:
One perforation, coincide thin layer or this thin layer of this circuit film layer that before in these two adjacent circuit film layers, one is adjacent through two penetrates into rear one in two adjacent circuit film layers; And
One conductive layer, is arranged on an internal perisporium of this perforation, and the circuit film layer that this conductive layer is adjacent with these two contacts.
6. diaphragm structure according to claim 5, it is characterized in that, comprise multiple cover part further, described cover part is arranged around perforation described in each on the outer surface of this first circuit film layer and the outer surface of this second circuit thin layer, and described cover part contacts with each this conductive layer in described perforation respectively.
7. diaphragm structure according to claim 4, is characterized in that, comprises multiple this and to coincide layer, and every two this coincide between layer and interfix through this electrolysis knitting layer that coincides.
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| CN201420618408.0U CN204259145U (en) | 2014-10-24 | 2014-10-24 | The diaphragm structure of sound-producing device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201420618408.0U CN204259145U (en) | 2014-10-24 | 2014-10-24 | The diaphragm structure of sound-producing device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016061713A1 (en) * | 2014-10-24 | 2016-04-28 | 邓克忠 | Diaphragm structure of sounding apparatus |
| CN105744449A (en) * | 2016-01-06 | 2016-07-06 | 吴泓均 | Film speaker and manufacturing method thereof |
| WO2017106985A1 (en) * | 2015-12-21 | 2017-06-29 | 邓克忠 | Pneumatic high pitch monomer having improved sound membrane and improved structure |
| WO2017214855A1 (en) * | 2016-06-14 | 2017-12-21 | 邓克忠 | Pneumatic single-body structure |
-
2014
- 2014-10-24 CN CN201420618408.0U patent/CN204259145U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016061713A1 (en) * | 2014-10-24 | 2016-04-28 | 邓克忠 | Diaphragm structure of sounding apparatus |
| US10070227B2 (en) | 2014-10-24 | 2018-09-04 | Ko-Chung Teng | Diaphragm of sounding apparatus |
| WO2017106985A1 (en) * | 2015-12-21 | 2017-06-29 | 邓克忠 | Pneumatic high pitch monomer having improved sound membrane and improved structure |
| US10623848B2 (en) | 2015-12-21 | 2020-04-14 | Ko-Chung Teng | Pneumatic tweeter unit having improved sound diaphragm and structure |
| CN105744449A (en) * | 2016-01-06 | 2016-07-06 | 吴泓均 | Film speaker and manufacturing method thereof |
| WO2017214855A1 (en) * | 2016-06-14 | 2017-12-21 | 邓克忠 | Pneumatic single-body structure |
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