CN204257617U - A kind of vacuum suction drying plate for semiconductor cutting equipment - Google Patents
A kind of vacuum suction drying plate for semiconductor cutting equipment Download PDFInfo
- Publication number
- CN204257617U CN204257617U CN201420794465.4U CN201420794465U CN204257617U CN 204257617 U CN204257617 U CN 204257617U CN 201420794465 U CN201420794465 U CN 201420794465U CN 204257617 U CN204257617 U CN 204257617U
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- China
- Prior art keywords
- cutting equipment
- drying plate
- vacuum suction
- suction drying
- semiconductor cutting
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a kind of vacuum suction drying plate for semiconductor cutting equipment, comprising: metallic plate, is provided with the array that position, multiple hole is formed; Multiple rubber suction nozzle, is located in position, each described hole correspondingly, and this drying plate is convenient to dismounting, plays good suction-operated for bendability material.
Description
Technical field
The utility model relates to technical field of manufacturing semiconductors, particularly relates to a kind of vacuum suction drying plate for semiconductor cutting equipment.
Background technology
Prior art vacuumizes at metallic plate fluting merely directly to adsorb semiconductor substrate, can cause vacuum leak for bendability material.
Summary of the invention
The shortcoming of prior art in view of the above, the purpose of this utility model is to provide a kind of vacuum suction drying plate for semiconductor cutting equipment, solves drying plate in above-mentioned prior art and semiconductor substrate absorption is understood to the problem of vacuum leak.
For realizing above-mentioned target and other related objectives, the utility model provides a kind of vacuum suction drying plate for semiconductor cutting equipment, comprising: metallic plate, is provided with the array that position, multiple hole is formed; Multiple rubber suction nozzle, is located in position, each described hole correspondingly.
Optionally, described array is square formation.
Optionally, described metallic plate is also provided with location hole for locating semiconductor substrate outward at described array.
Optionally, described metallic plate is also provided with fixing screw hole outward at described array.
Optionally, described metal is stainless steel.
As mentioned above, the utility model provides a kind of vacuum suction drying plate for semiconductor cutting equipment, comprising: metallic plate, is provided with the array that position, multiple hole is formed; Multiple rubber suction nozzle, is located in position, each described hole correspondingly, and this drying plate is convenient to dismounting, plays good suction-operated for bendability material.
Accompanying drawing explanation
Fig. 1 is shown as the structural representation of an embodiment of the vacuum suction drying plate for semiconductor cutting equipment of the present utility model.
Element numbers illustrates:
1-metallic plate;
2-rubber suction nozzle;
3-location hole;
4-screw hole.
Embodiment
Below by way of specific instantiation, execution mode of the present utility model is described, those skilled in the art the content disclosed by this specification can understand other advantages of the present utility model and effect easily.The utility model can also be implemented or be applied by embodiments different in addition, and the every details in this specification also can based on different viewpoints and application, carries out various modification or change not deviating under spirit of the present utility model.It should be noted that, when not conflicting, the embodiment in the application and the feature in embodiment can combine mutually.
As shown in Figure 1, the utility model provides a kind of vacuum suction drying plate for semiconductor cutting equipment, comprising: metallic plate 1, is provided with the array that position, multiple hole is formed; Multiple rubber suction nozzle 2, is located in position, each described hole correspondingly.
Preferably, described array is square formation, and certainly in other embodiments, its shape can be changed according to actual conditions, and such as triangle, trapezoidal or circle etc., be not limited with the present embodiment; And the quantity of the size of described drying plate and hole bit array can be changed according to the size of semiconductor board; Position, described hole can be circular hole, square opening, delthyrium etc., and described rubber suction nozzle 2 can have corresponding to boss, and can snap in fixing, preferably, interference fit dimensionally, fixes better the position, described hole in.
In one embodiment, described metallic plate 1 is also provided with the location hole 3 for locating semiconductor substrate outward at described array, is convenient to by male-female engagement location semiconductor substrate in the position of horizontal plane; Further alternative, described metallic plate 1 is also provided with fixing screw hole 4 outward at described array, can fix basic plate or fixing drying plate all can on tool in order to screw lock.
In one embodiment, described metal is stainless steel, certainly also can be other metal materials, and mainly the existing metal material of antirust corrosion-proof all can.
In sum, the utility model provides a kind of vacuum suction drying plate for semiconductor cutting equipment, comprising: metallic plate, is provided with the array that position, multiple hole is formed; Multiple rubber suction nozzle, is located in position, each described hole correspondingly, and this drying plate is convenient to dismounting, plays good suction-operated for bendability material.
Above-described embodiment is illustrative principle of the present utility model and effect thereof only, but not for limiting the utility model.Any person skilled in the art scholar all without prejudice under spirit of the present utility model and category, can modify above-described embodiment or changes.Therefore, such as have in art and usually know that the knowledgeable modifies or changes not departing from all equivalences completed under the spirit and technological thought that the utility model discloses, must be contained by claim of the present utility model.
Claims (5)
1., for a vacuum suction drying plate for semiconductor cutting equipment, it is characterized in that, comprising:
Metallic plate, is provided with the array that position, multiple hole is formed;
Multiple rubber suction nozzle, is located in position, each described hole correspondingly.
2. the vacuum suction drying plate for semiconductor cutting equipment according to claim 1, is characterized in that, described array is square formation.
3. the vacuum suction drying plate for semiconductor cutting equipment according to claim 1, described metallic plate is also provided with the location hole for locating semiconductor substrate outward at described array.
4. the vacuum suction drying plate for semiconductor cutting equipment according to claim 1, described metallic plate is also provided with fixing screw hole outward at described array.
5. the vacuum suction drying plate for semiconductor cutting equipment according to claim 1, is characterized in that, described metal is stainless steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420794465.4U CN204257617U (en) | 2014-12-16 | 2014-12-16 | A kind of vacuum suction drying plate for semiconductor cutting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420794465.4U CN204257617U (en) | 2014-12-16 | 2014-12-16 | A kind of vacuum suction drying plate for semiconductor cutting equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204257617U true CN204257617U (en) | 2015-04-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420794465.4U Active CN204257617U (en) | 2014-12-16 | 2014-12-16 | A kind of vacuum suction drying plate for semiconductor cutting equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204257617U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110970341A (en) * | 2019-12-11 | 2020-04-07 | 华天科技（西安）有限公司 | Dry Block board for product cutting post-treatment and processing method thereof |
-
2014
- 2014-12-16 CN CN201420794465.4U patent/CN204257617U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110970341A (en) * | 2019-12-11 | 2020-04-07 | 华天科技（西安）有限公司 | Dry Block board for product cutting post-treatment and processing method thereof |
| CN110970341B (en) * | 2019-12-11 | 2023-03-14 | 华天科技（西安）有限公司 | Dry Block board for product cutting post-treatment and processing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |