CN204235725U - A kind of temperature control box of silicon chip cutting environment - Google Patents
A kind of temperature control box of silicon chip cutting environment Download PDFInfo
- Publication number
- CN204235725U CN204235725U CN201420701540.8U CN201420701540U CN204235725U CN 204235725 U CN204235725 U CN 204235725U CN 201420701540 U CN201420701540 U CN 201420701540U CN 204235725 U CN204235725 U CN 204235725U
- Authority
- CN
- China
- Prior art keywords
- main frame
- sliding door
- control box
- temperature control
- qianmen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
A temperature control box for silicon chip cutting environment, area of solar cell, comprises main frame, temperature controller, heat exchanger, sliding door, fixing Qianmen; Described main frame comprises underframe, upper frame, column, and main frame bottom is fixed on the ground around silicon wafer cutting equipment, the left side of main frame, right side, rear side, and top is provided with transparent double-layer heat insulation glass; Described temperature controller is arranged on main frame outside, for detecting and controlling the temperature in temperature control box; Described heat exchanger is arranged in main frame, for providing thermal source in temperature control box; Have structure simple, heating volume is little, easy to operate, saves the energy, can ensure cutting environment temperature, reduces the feature that silicon chip breaks.
Description
Technical field
The invention belongs to area of solar cell, particularly a kind of temperature control box of silicon chip cutting environment.
Background technology
Solar cell is the important component part of solar power plant, and silicon chip is the important component part of solar cell, before manufacturing solar cell, silicon chip is needed to cut into certain size, to meet its function needs, at present, cutting silicon wafer adopts laser cutting technique mostly, because silicon wafer thickness is very thin, silicon chip performance is more crisp simultaneously, and when environment temperature is not suitable with when cut, silicon chip is easy to fracture, thus cause material and artificial waste, when environment temperature is lower than 26
0during C, silicon chip just easily produces fracture, wants to ensure that cutting temperature is applicable to, and needs whole job shop to be warmed to uniform temperature, which adds warm-up time, needs the Insulation increasing workshop, increases input, lose time.
Summary of the invention
For the above-mentioned defect that existing silicon chip cutting environment exists, the utility model proposes a kind of temperature control box of silicon chip cutting environment, it is characterized in that: comprise main frame, temperature controller, heat exchanger, sliding door, fixing Qianmen; Described main frame comprises underframe, upper frame, column, and main frame bottom is fixed on the ground around silicon wafer cutting equipment, the left side of main frame, right side, rear side, and top is provided with transparent double-layer heat insulation glass; Described temperature controller is arranged on main frame outside, for detecting and controlling the temperature in temperature control box; Described heat exchanger is arranged in main frame, for providing thermal source in temperature control box; Described fixing Qianmen is arranged on the front side of main frame, and described fixing Qianmen comprises munnion, horizontal frame, two-layer warm-keeping glass; Fixing Qianmen is arranged on the bottom in main frame front side frame, its frontal plane and main frame frontal plane cave in, so that sliding door is up and down, fixing Qianmen and main frame adopt adhesive to bond, and described sliding door comprises sliding door munnion, the horizontal frame of sliding door, two-layer warm-keeping glass, handle and locking device, sliding door both sides munnion is provided with and the slideway matched inside column on front side of main frame, facilitates sliding door to slide up and down inside main frame column.
Beneficial effect
Beneficial effect of the present invention is, structure is simple, and heating volume is little, easy to operate, saves the energy, can ensure cutting environment temperature, reduces silicon chip and breaks.
Accompanying drawing explanation
Fig. 1 structural representation of the present utility model
1. temperature controller, 2 heat exchangers, 3. main frame, 4. sliding door, 5. fixing Qianmen.
Fig. 2 is the structural representation of main frame
31. underframes, 32. columns, 33. upper frames.
Fig. 3 is the structural representation at fixing Qianmen
51. munnions, 52. horizontal frames, 53. two-layer warm-keeping glass.
Fig. 4 is the structural representation of sliding door
41. two-layer warm-keeping glass, 42. sliding door munnions, the horizontal frame of 43 sliding door, 44. handles and locking device.
Detailed description of the invention
Further illustrate implementation method of the present utility model by reference to the accompanying drawings now, as Fig. 2, select aluminium alloy or plastics-steel shapes for door and window, respectively as underframe 31, upper frame 33, column 32, and according to the suitable length of the size Selection of laser cutting machine, adopt expansion bolt to be fixed on around laser cutting machine underframe 31, make it to be enclosed in underframe 31, four columns 32 are loaded onto at four angles of underframe 31 respectively, connects upper frame 33 in the upper end of column 32, as Fig. 3, adopt aluminium alloy or plastics-steel shapes for door and window, its specification is less than main frame 3 section bar used No. one, respectively as the munnion 51 at fixing Qianmen 5, horizontal frame 52, and connect firmly, in the rectangular frame be made up of munnion 51 and horizontal frame 52, two-layer warm-keeping glass 53 is installed, as Fig. 4, select and the identical aluminium alloy that uses of fixing Qianmen or plastic-steel section bar as the sliding door munnion 42 of sliding door 4, the horizontal frame 43 of sliding door, connect and be fixed into rectangular frame, two-layer warm-keeping glass 41 is installed in rectangular frame, the horizontal frame 43 of superposed sliding door is installed handle with snap close as handle and locking device 44, as Fig. 1, in main frame 3 inside, heat exchanger 2 is installed, and to relevant pipeline, circuit and valve are connected, in the outside of main frame 3, temperature controller 1 is installed, and be connected with the gauge tap of heat exchanger 2, in the left side of main frame 3, two-layer warm-keeping glass is installed at right side and top, in front side, the namely position one side of operating personnel, main frame 3 underframe 31 and be positioned at above between two columns 32 fixing Qianmen 5 is installed, employing bonding agent is bonding, its bonding location ensures to cave in before fixing Qianmen 5 with before main frame 3, its distance of caving in is for being greater than the thickness of sliding door 4, reserve the position of column sliding way, slideway between the front column 32 sliding door 4 being put into main frame 3, ensure that sliding door slides up and down smooth and easy and jug and locking device 44 on sliding door 4 side and is positioned at top, the upper frame 33 being arranged on main frame 3 in handle and the supporting snap close of locking device 44 is positioned at above and the position corresponding with handling position, just complete making of the present utility model, during use, start the thermal source of heat exchanger 2, make heat exchanger 2 heat supply in this temperature control box, when this temperature control the temperature inside the box reaches design temperature, open sliding door 4, laser cutting device installs the silicon chip needing cutting, shut sliding door 4, start laser cutting device and cut, after having cut, open sliding door, take out finished product, again lay silicon chip to be cut, so circulate, now have the temperature that temperature controller 1 controls in temperature control box, make it to remain in the temperature range of setting, like this, laser cutting machine just carries out work under the temperature environment of setting.
Claims (1)
1. a temperature control box for silicon chip cutting environment, is characterized in that: comprise main frame, temperature controller, heat exchanger, sliding door, fixing Qianmen; Described main frame comprises underframe, upper frame, column, and main frame bottom is fixed on the ground around silicon wafer cutting equipment, the left side of main frame, right side, rear side, and top is provided with transparent double-layer heat insulation glass; Described temperature controller is arranged on main frame outside, for detecting and controlling the temperature in temperature control box; Described heat exchanger is arranged in main frame, for providing thermal source in temperature control box; Described fixing Qianmen is arranged on the front side of main frame, and described fixing Qianmen comprises munnion, horizontal frame, two-layer warm-keeping glass; Fixing Qianmen is arranged on the bottom in main frame front side frame, its frontal plane and main frame frontal plane cave in, so that sliding door is up and down, fixing Qianmen and main frame adopt adhesive to bond, and described sliding door comprises sliding door munnion, the horizontal frame of sliding door, two-layer warm-keeping glass, handle and locking device, sliding door both sides munnion is provided with and the slideway matched inside column on front side of main frame, facilitates sliding door to slide up and down inside main frame column.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420701540.8U CN204235725U (en) | 2014-11-21 | 2014-11-21 | A kind of temperature control box of silicon chip cutting environment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420701540.8U CN204235725U (en) | 2014-11-21 | 2014-11-21 | A kind of temperature control box of silicon chip cutting environment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204235725U true CN204235725U (en) | 2015-04-01 |
Family
ID=52765275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420701540.8U Expired - Fee Related CN204235725U (en) | 2014-11-21 | 2014-11-21 | A kind of temperature control box of silicon chip cutting environment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204235725U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105181562A (en) * | 2015-06-09 | 2015-12-23 | 南京交通职业技术学院 | Visualization material test ambient temperature box |
-
2014
- 2014-11-21 CN CN201420701540.8U patent/CN204235725U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105181562A (en) * | 2015-06-09 | 2015-12-23 | 南京交通职业技术学院 | Visualization material test ambient temperature box |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150401 Termination date: 20151121 |
|
| EXPY | Termination of patent right or utility model |