CN204221631U - A kind of epoxide terrace mill - Google Patents
A kind of epoxide terrace mill Download PDFInfo
- Publication number
- CN204221631U CN204221631U CN201420591308.3U CN201420591308U CN204221631U CN 204221631 U CN204221631 U CN 204221631U CN 201420591308 U CN201420591308 U CN 201420591308U CN 204221631 U CN204221631 U CN 204221631U
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- CN
- China
- Prior art keywords
- pedestal
- silicon wafer
- epoxide terrace
- polished silicon
- grinding cutter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model is created and is provided a kind of epoxide terrace mill, comprises discoidal pedestal; The connecting portion also comprising burnishing device, grinding cutter and pedestal is installed on epoxide terrace mill driving arrangement; Described burnishing device is arranged on base central place; Described burnishing device comprises polishing disk and polished silicon wafer; Described polishing disk center is provided with connecting hole; Described grinding cutter is arranged on pedestal lower surface, and is in the outside of polished silicon wafer.Polished silicon wafer along the circumferencial direction of polishing disk uniform arrange several.It is simple that the utility model creates structure, easy to use.The grinding cutter in outside first carries out grinding to epoxide terrace out-of-flatness place, then carries out polishing by the polished silicon wafer of inner side, and the grinding cutter in outside plays a protective role to polished silicon wafer, polished silicon wafer long service life.Polishing disk is threaded on pedestal, by screwing polishing disk, still can ensure and grinding cutter synchronization job, realizing best ground effect after making polishing pad wear through regulating.
Description
Technical field
The invention belongs to epoxide terrace technical field of construction equipment, especially relates to a kind of epoxide terrace mill.
Background technology
Epoxide terrace can not have ash, integral seamless, non-leakage, easily cleans, and can not stockpile dust and bacterium, mechanical strength is high, wear-resistant, shock-resistant; The characteristics such as chemicals such as acid and alkali resistance, salt, gasoline, machine oil diesel oil, make epoxide terrace be widely used.Epoxide terrace is normal in grinding and polishing process adopts epoxide terrace grinding cutter head, and epoxide terrace grinding cutter head is installed on grinding machine, drives its high-speed rotary to transfer carry out smooth polishing, finishing, polishing process to epoxy floor surface by grinding machine.But existing exist the defects such as grinding cutter head is easy to wear, service life is short, and ground effect is poor, grinding efficiency is low, and overall operation is not steady.
Summary of the invention
The problem that the invention will solve overcomes the defect existed in above prior art, provides a kind of epoxide terrace mill.
For solving the problems of the technologies described above, the technical scheme that the invention adopts is: a kind of epoxide terrace mill, comprises discoidal pedestal; The connecting portion also comprising burnishing device, grinding cutter and pedestal is installed on epoxide terrace mill driving arrangement; Described burnishing device is arranged on base central place; Described burnishing device comprises polishing disk and polished silicon wafer; Described polishing disk center is provided with connecting hole; Described grinding cutter is arranged on pedestal lower surface, and is in the outside of polished silicon wafer.
Further, described polished silicon wafer along the circumferencial direction of polishing disk uniform arrange several.
Further, described polished silicon wafer is nylon fiber sheet.
Further, described grinding cutter arranges several along the circumferencial direction of pedestal.
Further, described grinding cutter is elongated, and its length direction is arranged along the radial direction of pedestal.
Further, described grinding cutter is alloy knife.
Further, described polishing disk is threaded on pedestal.
Further, described connecting portion is the several concave stations of susceptor edges along the uniform setting of pedestal circumferencial direction; Each described concave station is equipped with pedestal connecting hole.
Further, on the position of described pedestal outer rim, also balance weight is provided with.
The advantage that the invention has and good effect are:
1) structure is simple; easy to use; the grinding cutter in outside first carries out grinding to epoxide terrace out-of-flatness place; polishing is carried out again by the polished silicon wafer of inner side; time saving and energy saving; the grinding cutter in outside plays a protective role to polished silicon wafer, and polished silicon wafer can not contact with large-area out-of-flatness place, therefore polished silicon wafer long service life.
2) polishing disk is threaded on pedestal, by screwing polishing disk, can regulate the distance of the most lower edge of the most lower edge of polished silicon wafer on polishing disk and grinding cutter, still can ensure and grinding cutter synchronization job, realizing best ground effect after making polishing pad wear through regulating.
3) position of pedestal outer rim is also provided with balance weight, when the operation of this epoxide terrace mill, overall balance can be ensured, make overall operation steady.
Accompanying drawing explanation
Fig. 1 is the structural representation of the invention;
Fig. 2 is the structural representation of burnishing device part in the invention;
Fig. 3 is the structural representation of base part in the invention;
Fig. 4 is the structure enlarged diagram at A place in Fig. 3.
In figure: 1-pedestal; 2-burnishing device; 3-grinding cutter; 4-connecting portion; 5-polishing disk; 6-polished silicon wafer; 7-connecting hole; 8-heavy stand; 9-installing hole; 10-external screw thread; 11-internal thread; 12-concave station; 13-pedestal connecting hole; 14-balance weight; 15-dedusting hole.
Detailed description of the invention
Elaborate below in conjunction with the specific embodiment of accompanying drawing to the invention.
A kind of epoxide terrace mill, as shown in Figure 1, comprises discoidal pedestal 1; The connecting portion 4 also comprising burnishing device 2, grinding cutter 3 and pedestal 1 is installed on epoxide terrace mill driving arrangement; Described burnishing device 2 is arranged on pedestal 1 center; Described burnishing device 2 comprises polishing disk 5 and polished silicon wafer 6; Described polishing disk 5 center is provided with connecting hole 7; Described grinding cutter 3 is arranged on pedestal 1 lower surface, and is in the outside of polished silicon wafer 6.
It should be noted that, described grinding cutter 3 and polished silicon wafer 6 are all provided with the installing hole 9 being with heavy stand 8, by the screw be arranged in installing hole 9, grinding cutter 3 and polished silicon wafer 6 are separately fixed on pedestal 1 or on polishing disk 5.
In addition; pedestal 1 is also provided with some dedusting holes 15; the flue dust of sanding and polishing process can not be gathered in below pedestal; can come out to greatest extent; the defective material that can not get off because polishing is assembled generation and is blocked clamping stagnation, if be provided with dust collection equipment during construction on pedestal 1, so flue dust can be siphoned away through dedusting hole 15; protection of the environment, can not pollute.
Wherein, described polished silicon wafer 6 along the circumferencial direction of polishing disk 5 uniform arrange several.
Wherein, described polished silicon wafer 6 is nylon fiber sheet, and cost is low, and polishing effect is good.Polished silicon wafer 6 is dismountable to be arranged on polishing disk 5, when friction loss is to lifetime limitation, can be convenient for changing.
Wherein, described grinding cutter 3 arranges several along the circumferencial direction of pedestal 1, and grinding efficiency is high, ensure that the operation effectiveness of mill.
Wherein, described grinding cutter 3 is elongated, and its length direction is arranged along the radial direction of pedestal 1.Grinding area is large, and operating efficiency is high.
Wherein, described grinding cutter 3 is alloy knife, durable wear, usually without the need to changing.
It should be noted that; the grinding cutter 3 in outside first carries out grinding to epoxide terrace out-of-flatness place; polishing is carried out again by the polished silicon wafer 6 of inner side; time saving and energy saving; grinding cutter 3 pairs of polished silicon wafer 6 in outside play a protective role; polished silicon wafer 6 can not contact with large-area out-of-flatness place of epoxide terrace, therefore polished silicon wafer 6 long service life.
Wherein, as shown in Figures 2 and 3, described polishing disk 5 is threaded on pedestal 1.For reaching optimum sanding and polishing effect, polished silicon wafer 6 generally protrudes from most lower edge about the 0.1mm ~ 0.5mm of grinding cutter 3 and arranges, and therefore, the loss of wearing and tearing can often occur polished silicon wafer 6 in work progress.
So, external screw thread 10 is provided with at the circumferential outer surface of polishing disk 5, what pedestal was corresponding with the through hole of polishing disk junction is provided with internal thread 11, by screwing polishing disk 5, the distance of polishing disk 5 lower surface and pedestal 1 lower surface can be regulated, and then regulate the distance of the most lower edge of the most lower edge of polished silicon wafer on polishing disk 56 and grinding cutter 3.Like this, according to actual conditions, still can ensure and grinding cutter 3 synchronization job through regulating after polished silicon wafer 6 can be made to wear and tear, realizing best ground effect.
Wherein, as shown in Figure 2, described connecting portion 4 is the several concave stations 12 of pedestal 1 edge along the uniform setting of pedestal circumferencial direction; Each described concave station 12 is equipped with pedestal connecting hole 13.
Wherein, on the position of described pedestal 1 outer rim, balance weight 14 is also provided with.When the operation of this epoxide terrace mill, overall balance can be ensured, make overall operation steady.
Before construction, this epoxide terrace polishing disk is installed on the driving arrangement of epoxide terrace polishing disk by the pedestal connecting hole 13 on connecting portion 4, checks polished silicon wafer 6, ensure that polished silicon wafer 6 lower edge protrudes from most lower edge about the 0.1mm ~ 0.5mm of grinding cutter 3.
During operation, pedestal 1 is driven by epoxide terrace mill driving arrangement and rotates, grinding cutter 3 on pedestal 1 first carries out grinding to epoxide terrace out-of-flatness place, polishing is carried out again by the polished silicon wafer 6 inside grinding cutter 3, like this, one time namely constructing operation achieves grinding and buffing two operations, and operating efficiency is high, and sanding and polishing is effective.
Above an embodiment of the invention has been described in detail, but described content being only the preferred embodiment of the invention, the practical range for limiting the invention can not being considered to.All equalization changes done according to the invention application range with improve, within the patent covering scope that still all should belong to the invention.
Claims (9)
1. an epoxide terrace mill, comprises discoidal pedestal; It is characterized in that: the connecting portion also comprising burnishing device, grinding cutter and pedestal is installed on epoxide terrace mill driving arrangement; Described burnishing device is arranged on base central place; Described burnishing device comprises polishing disk and polished silicon wafer; Described polishing disk center is provided with connecting hole; Described grinding cutter is arranged on pedestal lower surface, and is in the outside of polished silicon wafer.
2. a kind of epoxide terrace mill according to claim 1, is characterized in that: described polished silicon wafer along the circumferencial direction of polishing disk uniform arrange several.
3. a kind of epoxide terrace mill according to claim 1, is characterized in that: described polished silicon wafer is nylon fiber sheet.
4. a kind of epoxide terrace mill according to claim 1, is characterized in that: described grinding cutter arranges several along the circumferencial direction of pedestal.
5. a kind of epoxide terrace mill according to claim 1, is characterized in that: described grinding cutter is elongated, and its length direction is arranged along the radial direction of pedestal.
6. a kind of epoxide terrace mill according to claim 1,4 or 5, is characterized in that: described grinding cutter is alloy knife.
7. a kind of epoxide terrace mill according to claim 1, is characterized in that: described polishing disk is threaded on pedestal.
8. a kind of epoxide terrace mill according to claim 1, is characterized in that: described connecting portion is the several concave stations of susceptor edges along the uniform setting of pedestal circumferencial direction; Each described concave station is equipped with pedestal connecting hole.
9. a kind of epoxide terrace mill according to claim 1, is characterized in that: on the position of described pedestal outer rim, be also provided with balance weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420591308.3U CN204221631U (en) | 2014-10-13 | 2014-10-13 | A kind of epoxide terrace mill |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420591308.3U CN204221631U (en) | 2014-10-13 | 2014-10-13 | A kind of epoxide terrace mill |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204221631U true CN204221631U (en) | 2015-03-25 |
Family
ID=52919771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420591308.3U Expired - Fee Related CN204221631U (en) | 2014-10-13 | 2014-10-13 | A kind of epoxide terrace mill |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204221631U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104907901A (en) * | 2015-05-17 | 2015-09-16 | 成都赋阳技术开发有限公司 | Terrace construction equipment capable of preventing dust pollution |
| CN105234847A (en) * | 2015-09-16 | 2016-01-13 | 丹阳市长平机械有限公司 | Compound grinding wheel |
| CN108838781A (en) * | 2018-07-17 | 2018-11-20 | 刘仲华 | A kind of epoxide terrace mill |
| CN109454509A (en) * | 2018-12-19 | 2019-03-12 | 上海骥铭机械设备有限公司 | A kind of new grinding polishing disk |
| CN111347307A (en) * | 2020-03-10 | 2020-06-30 | 广东博智林机器人有限公司 | Polishing cutter disc and polishing machine |
| CN111502273A (en) * | 2020-04-29 | 2020-08-07 | 汪煜 | Building steel formwork surface treatment process |
-
2014
- 2014-10-13 CN CN201420591308.3U patent/CN204221631U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104907901A (en) * | 2015-05-17 | 2015-09-16 | 成都赋阳技术开发有限公司 | Terrace construction equipment capable of preventing dust pollution |
| CN105234847A (en) * | 2015-09-16 | 2016-01-13 | 丹阳市长平机械有限公司 | Compound grinding wheel |
| CN108838781A (en) * | 2018-07-17 | 2018-11-20 | 刘仲华 | A kind of epoxide terrace mill |
| CN109454509A (en) * | 2018-12-19 | 2019-03-12 | 上海骥铭机械设备有限公司 | A kind of new grinding polishing disk |
| CN109454509B (en) * | 2018-12-19 | 2024-04-05 | 上海骥铭机械设备有限公司 | Novel grinding and polishing disk |
| CN111347307A (en) * | 2020-03-10 | 2020-06-30 | 广东博智林机器人有限公司 | Polishing cutter disc and polishing machine |
| CN111502273A (en) * | 2020-04-29 | 2020-08-07 | 汪煜 | Building steel formwork surface treatment process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150325 Termination date: 20151013 |
|
| EXPY | Termination of patent right or utility model |